• Title/Summary/Keyword: polymer welding

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Fiber Orientation Distribution of Injection Molded Product on the Fiber-Reinforced Polymeric Composites (섬유강화 고분자 복합재료 사출성형품의 섬유배향상태)

  • Lee Dong-Gi;Sim Jea-Ki;Kim Jin-Woo
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.14 no.1
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    • pp.73-80
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    • 2005
  • Injection molding is the most widely used process for the industrial forming of plastic articles. During an injection molding process of composites, the fiber-matrix separation and fiber orientation are caused by the flow of molten polymer/fiber mixture. As a result, the product tends to be nonhomogeneous and anisotropic. Hence, it is very important to clarify the relations between separation orientation and injection molding conditions. So far, there is no research on the measurement of fiber orientation using image processing. In this study, the effects of fiber content ratio and molding condition on the fiber orientation-angle distributions are studied experimentally. Using the image processing method, the fiber orientation distribution of welding parts in injection-molded products is assessed. And the effects of fiber content and injection mold shapes on the fiber orientation in case of fiber reinforced polymeric composites are studied experimentally.

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Ultrasonic Flaw Detection in Composite Materials Using SSP-MPSD Algorithm

  • Benammar, Abdessalem;Drai, Redouane
    • Journal of Electrical Engineering and Technology
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    • v.9 no.5
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    • pp.1753-1761
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    • 2014
  • Due to the inherent inhomogeneous and anisotropy nature of the composite materials, the detection of internal defects in these materials with non-destructive techniques is an important requirement both for quality checks during the production phase and in service inspection during maintenance operations. The estimation of the time-of-arrival (TOA) and/or time-of-flight (TOF) of the ultrasonic echoes is essential in ultrasonic non-destructive testing (NDT). In this paper, we used split-spectrum processing (SSP) combined with matching pursuit signal decomposition (MPSD) to develop a dedicated ultrasonic detection system. SSP algorithm is used for Signal-to-Noise Ratio (SNR) enhancement, and the MPSD algorithm is used to decompose backscattered signals into a linear expansion of chirplet echoes and estimate the chirplet parameters. Therefore, the combination of SSP and MPSD (SSP-MPSD) presents a powerful technique for ultrasonic NDT. The SSP algorithm is achieved by using Gaussian band pass filters. Then, MPSD algorithm uses the Maximum Likelihood Estimation. The good performance of the proposed method is experimentally verified using ultrasonic traces acquired from three specimens of carbon fibre reinforced polymer multi-layered composite materials (CFRP).

THE EFFECTS OF SEALING ON THE PLASMA-SPRAYED OXIDE-BASED COATINGS

  • Kim, Hyung-Jun;Sidoine Odoul;Kweon, Young-Gak
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.53-58
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    • 2002
  • Electrical insulation and mechanical properties of the plasma sprayed oxide ceramic coatings were studied before and after the sealing treatment of the ceramic coatings. Plasma sprayed A1$_2$O$_3$-TiO$_2$ coating as the reference coating was sealed using three commercial sealants based on polymer. Penetration depth of the sealants to the ceramic coating was evaluated directly from the optical microscope using a fluorescent dye. It is estimated that the penetration depth of the sealants to the ceramic coating is from 0.2 to 0.5 mm depending on the sealants used. The preliminary test results with a DC puncture tester imply that the dielectric breakdown voltage mechanism of plasma sprayed ceramic coatings has been determined to be a corona mechanism. Dielectric breakdown voltage of the as-sprayed and as-ground samples have shown a linear trend with regard to the thickness showing an average dielectric strength of 20 kV/mm for the thickness scale studied. It is also shown that grinding the coating before sealing and adding fluorescent dye do not agent the penetration depth of sealants. All of the microhardness, two-body abrasive wear resistance, bond strength, and surface roughness of the ceramic coating after the sealing treatment are improved. The extent of improvement is different from the sealants used. However, three-point bending stress of the ceramic coating after the sealing treatment is decreased. This is attributed to the reduced micro-crack toughening effect since the cracks propagate easily through the lamellar of the coating without crack deflection and/or branching after the sealing treatment.

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The Effect of Mold Shapes on the Fiber Orientation of Welding Parts for Injectin Molding of Fiber Reinforced Polymeric Composites (섬유강화 고분자 복합재료의 사출성형에 있어서 웰드부의 섬유배향에 미치는 금형형상의 영향)

  • Kang, M. G.;Choi, Y. S.;Kim, H.;Lee, D. G.;Han, G. Y.;Kim, E. G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.457-460
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    • 2000
  • Injection molding is the most widely used process for the industrial forming of plastic articles. During an injection molding process of composites, the fiber-matrix separation and fiber orientation are caused by the flow of molten polymer/fiber mixture. As a result, the product tends to be nonhomogeneous and anisotropic. Hence, it is very important to clarify the relations between separation·orientation and infection molding conditions. So far, there is no research on the measurement of fiber orientation using image processing. In this study, the effects of fiber content ratio and molding condition on the fiber orientation-angle distributions are studied experimentally. Using the image processing method, the fiber orientation distribution of welding parts in injection-molded products is assessed. And the effects of fiber content and injection mold shapes on the fiber orientation in case of fiber reinforced polymeric composites are studied. experimentally.

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Experimental and numerical investigation of strengthened deficient steel SHS columns under axial compressive loads

  • Shahraki, Mehdi;Sohrabi, Mohammad Reza;Azizyan, Gholam Reza;Narmashiri, Kambiz
    • Structural Engineering and Mechanics
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    • v.67 no.2
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    • pp.207-217
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    • 2018
  • In past years, numerous problems have vexed engineers with regard to buckling, corrosion, bending, and overloading in damaged steel structures. This article sets out to investigate the possible effects of carbon fiber reinforced polymer (CFRP) and steel plates for retrofitting deficient steel square hollow section (SHS) columns. The effects of axial loading, stiffness, axial displacement, the position and shape of deficient region on the length of steel SHS columns, and slenderness ratio are examined through a detailed parametric study. A total of 14 specimens was tested for failure under axial compression in a laboratory and simulated using finite element (FE) analysis based on a numerical approach. The results indicate that the application of CFRP sheets and steel plates also caused a reduction in stress in the damaged region and prevented or retarded local deformation around the deficiency. The findings showed that a deficiency leads to reduced load-carrying capacity of steel SHS columns and the retrofitting method is responsible for the increase in the load-bearing capacity of the steel columns. Finally, this research showed that the CFRP performed better than steel plates in compensating the axial force caused by the cross-section reduction due to the problems associated with the use of steel plates, such as in welding, increased weight, thermal stress around the welding location, and the possibility of creating another deficiency by welding.

Characteristics of electrically conductive adhesives filled with silver-coated copper

  • Nishikawa, Hiroshi;Terad, Nobuto;Miyake, Koich;Aoki, Akira;Takemoto, Tadashi
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.217-220
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    • 2009
  • Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

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Tensile response of steel/CFRP adhesive bonds for the rehabilitation of civil structures

  • Matta, F.;Karbhari, Vistasp M.;Vitaliani, Renato
    • Structural Engineering and Mechanics
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    • v.20 no.5
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    • pp.589-608
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    • 2005
  • There is a growing need for the development and implementation of new methods for the rapid and cost-effective rehabilitation of deteriorating steel structural components to offset the drawbacks related to welding and/or bolting in the field. Carbon fiber reinforced polymer (CFRP) composites provide a potential alternative as externally bonded patches for strengthening and repair of metallic structural members for building and bridge systems. This paper describes results of an investigation of tensile and fatigue response of steel/CFRP joints simulating scenarios of strengthening and crack-patching. It is shown that appropriately designed schemes, even when fabricated with levels of inaccuracy as could be expected in the field, can provide significant strain relief and load transfer capability. A simplified elasto-plastic closed form solution for stress analysis is presented, and validated experimentally. It is shown that the bond development length remains constant in the linear range, whereas it increases as the adhesive is deformed plastically. Fatigue resistance is shown to be at least comparable with the requirements for welded cover plates without attendant decreases in stiffness and strength.

A Study of Laser Joining for Polymer 2D Camber Compensation (폴리머 2D 캠버 보상을 위한 레이저용접 기술)

  • Lee, Young-Min;Yoon, Jin-Young;Song, Chi-Hun;Choi, Hae-Woon
    • Laser Solutions
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    • v.15 no.2
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    • pp.15-20
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    • 2012
  • A novel joining technology was developed to compensate the camber in polymers. The preheating laser beam circulates on the joining location and the accumulated heat serves to increase the flexibility of neighboring polymers. The temperature rises up to the glass transient temperature of the polymers and continually loading spring force closes the gap of camber. The irradiated laser was 808nm central wavelength and the power varied between 2Watt and 5Watt. The laps were adjusted between 3 and 10 and the optimum process parameters were 3Watt and 5 laps for the specific application. An FEM analysis was introduced to understand the mechanism of joining by the transient temperature distribution on the polymers. Thermocouples experiments were also tried to correlate the numerical analysis results and it showed the trend of heat accumulation in experiments.

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Replication of Polyethylene Nano-Microstructures Using Ultrasonic Forming (초음파성형을 이용한 폴리에틸렌 나노 마이크로 구조물의 복제)

  • Lee, Chi-Hoon;Yu, Hyun-Woo;Shin, Bo-Sung;Ko, Jong-Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.11
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    • pp.1209-1216
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    • 2009
  • Nano-micro hierarchical structures that nanoprotrusions were formed on the network-type microstructures were fabricated using an ultrasonic vibration forming technology. A commercial ultrasonic welding system was used to apply ultrasonic vibration energy. To evaluate the formability of ultrasonic vibration forming, nickel nano-micro hierarchical mold was fabricated and polyethylene (PE) was used as the replication material. The optimal molding time was 3.5 sec for PE nano-micro hierarchical structures. The molding process was conducted at atmospheric pressure.