• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.3
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• pp.224-234
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• 2016

This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• Applied Science and Convergence Technology
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• v.26 no.6
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• pp.184-188
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• 2017

Polymer deposition pattern on the ceramic lid surface is analyzed by numerical modeling. Assumption was made that is affected by gas flow pattern from the horizontal and vertical nozzles, temperature profile from the finger-like branches made of graphite and electrostatic potential effect. Calculated results showed gas flow dynamics is less relevant than two others. Temperature and electrostatic effects are likely determining the polymer deposition pattern based on our numerical simulation results.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.6
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• pp.686-692
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• 2012

Solid free-form fabrication (SFF) technology was developed to fabricate three-dimensional (3D) scaffolds for tissue engineering (TE) applications. In this study, we developed a polymer deposition system (PDS) and created 3D microstructures using a bioresorbable polycaprolactone (PCL) polymer. Fabrication of 3D scaffolds by PDS requires a combination of several devices, including a heating system, dispenser, and motion controller. The system can process a polymer with extremely high precision by using a 200 ${\mu}m$ nozzle. Based on scanning electron microscope (SEM) images, both the line width and the piled line height were fine and uniform. Several 3D micro-structures, including the ANU pattern (a pattern named after Andong National University), $45^{\circ}$ pattern square, frame, cylindrical, triangular, cross-shaped, and hexagon, have been fabricated using the polymer deposition system.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.549-550
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• 2006

It has become topic continuously at MEMS or semiconductor process to form three-dimensional multilayer structure. In this paper, we devised the new polymer pattern method that has multilayer structure. This is method that uses different kind of polymeric material. Specially, polymers used in this study that we propose became all pattern by photolithography, prevented that process increases. Here, polymer that we use used polymer of epoxy order called "SU-8" and polymer of novolak resin called "AZ-1518". The result, "SU-8" was formed pattern to 3.5um thickness, and "AZ-1518" about pattern 3um thickness. Also, It was been 6um thickness at same pattern area.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.291-298
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• 2014

This study uses two numerical approaches to analyze the filling behavior of micro patterns on micro-injection molding for V-grooves pattern which cannot be simulated with conventional CAE packages. The parametric studies have been performed to examine the fidelity of micro patterns with respect to temperature, pressure, inlet velocity and pattern location on the mold according to the boundary condition from the macro pressure and velocity data which can be obtained by conventional CAE packages. Through these numerical approaches, the filling behavior of polymer melt in micro patterns can be understood, the quality of replication can be predicted, and the V-groove pattern can be shaped uniformly during the process of injection molding.

• Journal of Integrative Natural Science
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• v.4 no.4
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• pp.311-314
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• 2011

Application of self-assembled monolayers (SAMs) to the fabrication of organic thin film transistor has been recently reported very often since it can help to provide ohmic contact between films as well as to form simple and effective electrode pattern. Accordingly, quality of these ultra-thin films is becoming more imperative. In this study, in order to manufacture a high quality SAM pattern, a hydrophobic alkylsilane monolayer and a hydrophilic aminosilane monolayer were selectively coated on $SiO_2$ surface through the consecutive procedures of a micro-contact printing (${\mu}CP$) and dip-coating methods under extremely dry condition. On a SAM pattern cleaned with SC1 solution immediately after ${\mu}CP$, poly(3,4-ethylenedioxythiophene) (PEDOT) source and drain electrode array were very selectively and nicely vapour phase polymerized. On the other side, on a SC1-untreated SAM pattern, PEDOT array was very poorly polymerized. It strongly suggests that the SC1 cleaning process effectively removes unwanted contaminants on SAM pattern, thereby resulting in very selective growth of PEDOT electrode pattern.

• Journal of Advanced Marine Engineering and Technology
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• v.22 no.4
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• pp.505-514
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• 1998

Flow pattern of air-water two phase flow depends on the conditions of pressure void fraction and channel geometry. We classify the flow pattern by measuring the output signal of the conductivity probe. under the classified flow pattern we mount a visualization equipment on the test section and take pictures. We vary the concentration of pure solvent and polymer to measure local void fraction. We know that the maximum point position of local void fraction distribution move from the center of the pipe to the wall of the pipe as JSL increase when JSA is constant in two phase flow. But we find that the maximum point position of local void friction move from the wal of the pipe to the center of the pipe when polymer concentration increase.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.775-777
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• 2003

Several methods are available for the fabrication of electrode pattern for the plasma display panel(PDP) including screen printing and photolithographic method. Piezo type ink-jet printing method is considered to the method of choice for electrode patterning in manufacturing of PDP. Both silver ink and absorbent layer paste formulation were developed for ink-jet printing of electrode pattern. The ink-jet printing of silver electrode with preformed absorbent layer was especially suitable for the patterning of address electrode for high resolution PDP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.666-670
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• 2004

VLSI 소자에서 design rule(D/R)이 작아져 각 단위 Pattern의 size가 작아짐에 따라 aspect ratio가 커지게 되었다. 산화막 contact etch를 하는데 있어 산화막 측벽을 보호하는데, 이러한 보호막은 주로 fluoro-carbon 계열의 polymer precursor들이 사용된다. Aspect ratio(A/R)가 5 이하일 때에는 측벽의 보호막에 의한 바닥 변형이 문제가 되지 않으나, 10 이상의 A/R를 가진 contact에서는 크기가 줄고, 모양이 불균형하게 변하는 바닥 변형을 쉴게 관찰할 수 있다. 이러한 바닥 변형이 커지면 contact 저항이 높아지는 것은 물론이고, 심하게는 하부 pattern과 overlap 불량을 유발할 수 있다. 본 논문에서는 바닥변형을 일으키는 원인을 분석하고 fluoro-carbon 계열의 polymer precursor의 종류$(C_4_F6\;vs.\;C_3F_8)$에 따른 polymer증착 상태 확인 및 pattern비대칭에 따른 바닥 변형의 고찰과 plasma etching 시 H/W 변형을 통해 바닥 변형이 거의 없는 조건을 찾아낼 수 있었다.