• Journal of Welding and Joining
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• v.34 no.4
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• pp.23-27
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• 2016

A 3D printed metal part and thermal plastic polymer part were joined by direct laser irradiation. The 3D metal part was fabricated by using DED(Direct Energy Deposition) with STS316 material. The experiment was carried out through no patterned metal surface, 3D metal printed surface and micro laser patterned surface. The most secure joining quality was obtained at the laser micro patterned surface specimen and the counterparts of polymers were PLA and PE based thermo plastics. The applied laser power was 350Watt and the distance of patterns was maintained at $150{\mu}m$. The laser line width was optimized at $450{\mu}m$ and the laser micro pattern depth was $180{\mu}m$ for the best joining quality. Based on the result analysis, the possibility of laser material joining for metal to polymer was proposed and multi-material joining will be possible in 3D laser direct material fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.228-230
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• 2001

We synthesized Bis(3-N-ethylcarbazolyl) terephthalidene(BECP) and Bis(3-7-ethyl-carbazolyl) cyanoterephthalidene(BECCP) and characterized EL properties of these materials. Our device shows a strong blue emission at 472 nm with a luminance efficiency of 0.9 lm/W at a voltage, a current density, and a brightness of 8 V, 5.7 mA/cm$^2$, and 130 cd/m$^2$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.285-288
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• 1995

In this Study, it worked to get the degradation characteristics of polymer insulating materials using TSC technique. So, it prepared epoxy composities with sample, the TSC spectroscopy was applied to investigate the influence of interfacial deformation due to inorganic filler and treatments of coupling agents on the network structure and the electrical properties of epoxy composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.273-276
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• 1996

Polyphenylenediamine(PPD) film was prepared with dimethylsulfoxide after the synthesis of PPD by chemical polymerization. The molecular structure of conductive polymer synthesized were discussed by using SEM, FT-IR, NMR. The electrical conductivity measurements were carried out at room temperature. The electrical conductivity which was obtained from electrical instrument was 1.98${\times}$10$\^$-2/ S/cm at ambient temperature.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10b
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• pp.203-204
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• 2003

Generally, polymeric foam has many advantages, such as light-weight, good impact absorptivity and adiabatic properties. Poly (ethylene terephthalate) PET has good recyclability and no toxicity. Hence, if we make foam of PET, it could be used for various applications such as heat insulating material, recyclable packing material, and food vessel. Thus these properties are attractive interests to manufacturers. (omitted)

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.432-435
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• 2001

Polymer/clay nanocomposites have received much attention in recent years, because they often exhibit physical properties that are dramatically different from those observed in their micro- and rnacrocornposite counterparts. The presence of clay may affect the crystallization behavior of semicrystalline polymer. (omitted)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.391-394
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• 2000

EPDM/silicone blend was prepared with polyorganosiloxane compatibilizer for out-door polymer insulation used to shed. Each blend had various weight ratios, 100/0, 90/10, 70/30, 50/50, 30/70, 10/90, and 0/100 as EPDM to silicone, and electrical and tracking characteristics were studied with the method of IEC 60587. And also, tracking properties and contact angle related to UV-weathering period were studied to understand the degree of degradation of blend after 1000 h UV-weathering.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.128-131
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• 2000

The main objective of this paper is to design and test a new type of polymer ZnO surge arrester for DC power system of railroad vehicles. The rated voltage is 1500V direct current. The main research works are focused on structure design by finite element method, rating voltage, temporary over voltage and studies of characteristics of polymeric surge arrester.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.191-194
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• 2007

In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

• Applied Chemistry for Engineering
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• v.21 no.2
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• pp.115-128
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• 2010

Recently the use heat sink material grows where the polymer filled with thermal conductive fillers effectively dissipates heat generated from electronic components. Therefore the management of heat is directly related to the lifetime of electronic devices. For the purpose of improving thermal conductivity of composites, fillers with excellent thermaly conductive behavior are commonly used. Polymer composites filled with thermally conductive particles have advantages due to their processibility, cheap price, and durability to the corrosion. This paper aims to review the thermal interface materials and their model equations for predicting the thermal conductivity of polymer composites, and to introduce the commercial thermal conductive fillers and their applications.