• 제목/요약/키워드: polymer encapsulation

검색결과 104건 처리시간 0.026초

A Case Study of Paraffin Double-walled Microencapsulation Preparation Using Acrylic Polymer and Melamine Polymer for Thermal Energy Storage

  • Nguyen, Hang Vo-Minh;Kim, Chae-Hyun;Kim, Jong-Kuk
    • 한국태양에너지학회 논문집
    • /
    • 제39권5호
    • /
    • pp.65-78
    • /
    • 2019
  • In this study, we investigated the paraffin encapsulation using double-walled encapsulation technique. The first encapsulation used methyl methacrylic acid as the main component in acrylic polymer and the second encapsulation used melamine polymer. Particles size and distribution of the capsules were analyzed using scanning electron microscopy. In the first encapsulation, the stable capsules were obtained at 67% of phase change material ratio to methyl methacrylic acid monomer and the size of the capsule was from 0.2 to $0.3{\mu}m$. In the second encapsulation, the size of the capsules was almost the same with those capsules prepared in the first encapsulation. The particle size of single wall and double wall was about $0.3{\mu}m$. As a result of the encapsulation of paraffin using double-walled encapsulation technique, it was confirmed that the particle size was determined in the process of encapsulating using the acrylic polymer at the first wall material, and the physical and thermal stability of the capsules were imparted using melamine at the secondary wall material.

고분자 기판의 휨 스트레스에 대한 Encapsulation층의 효과 (The Effect of Encapsulation Layer Incorporated into Polymer Substrates for Bending Stress)

  • 박준백;서대식;이상극;이준웅;김영훈;문대규;한정인
    • 한국전기전자재료학회논문지
    • /
    • 제17권4호
    • /
    • pp.443-447
    • /
    • 2004
  • In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

OLED Barrier와 Encapsulation을 위한 원자층 증착 Polymer / Al2O3 다층 필름의 온습도 신뢰도 평가 분석 (Reliability Evaluation of Atomic layer Deposited Polymer / Al2O3 Multilayer Film for Encapsulation and Barrier of OLEDs in High Humidity and Temperature Environments)

  • 이사야;송윤석;김현;류상욱
    • 반도체디스플레이기술학회지
    • /
    • 제16권4호
    • /
    • pp.1-4
    • /
    • 2017
  • Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Atomic layer deposition (ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. Moisture permeation has a mechanism to pass through defects, Thin Film Encapsulation using inorganic / organic / inorganic hybrid film has been used as promising technology. $Al_2O_3$ / Polymer / $Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films.

  • PDF

Flexible 기판의 Bending Stress에 대한 Encapsulation Layer의 영향 (The Influence of Encapsulation Layer Incorporated into Flexible Substrates for Bending Stress)

  • 박준백;서대식;이상극;이준웅;김영훈;문대규;한정인
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
    • /
    • pp.473-476
    • /
    • 2003
  • This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

  • PDF

코아 가교 양친성 고분자 나노입자를 이용한 고함량 유용 약물 담지 고분자 나노입자 제조 (Preparation of Valuable Compounds Encapsulated Polymer Nanoparticles with High Payload Using Core-crosslinked Amphiphilic Polymer Nanoparticles)

  • 김나혜;김주영
    • 공업화학
    • /
    • 제27권1호
    • /
    • pp.26-34
    • /
    • 2016
  • 본 연구에서는 반응성 비닐기를 가지고 있는 반응성 양친성 고분자 전구체(Reactive Amphiphilic Reactive Polymer Precursor) (RARP)를 이용하여 제조된 소수성 세그먼트들이 가교된 코아 가교 양친성 고분자(Core-crosslinked Amphiphilic Polymer) (CCAP) 나노입자와 나노침전법을 사용하여서 소수성 유용물질을 고함량으로 담지할 수 있는 새로운 공정을 제안하였다. 극성이 각기 다른 유기용매(에탄올, 아세톤, 테트라하이드로퓨란(THF))들과 소수성 세그먼트 분자량이 다른 CCAP를 사용하여서, 모델 유용 약물인 ${\alpha}$-tocopherol의 담지 효율, 담지량 및 약물 담지 나노입자의 크기와 안정성 변화를 조사하였다. 소수성 세그먼트 분자량이 큰 CCAP와 소수성 용매인 THF를 용매로 사용한 경우에 가장 높은 유용 약물 담지량, 담지 효율을 나타내는 안정한 나노입자가 형성이 되었다. 즉 CCAP 나노입자들의 물리적 화학적으로 견고한 나노 구조로 인해서 33 wt%의 높은 담지량과 97% 이상의 담지 효율을 가지면서 물속에서 70 nm의 크기의 안정한 유용 약물 담지 고분자 나노입자를 제조할 수 있었다.

Silicone 봉지재를 이용한 태양광 모듈 제조 공정 및 평가에 대한 연구 (The study on evaluation for PV module development using the silicone encapsulation)

  • 정인성;이범수;양오봉;강성환;김종일
    • 한국태양에너지학회:학술대회논문집
    • /
    • 한국태양에너지학회 2011년도 추계학술발표대회 논문집
    • /
    • pp.137-142
    • /
    • 2011
  • Individual solar cells must be connected together to give the appropriate current and voltage levels and they must also be protected from damage by the environment. [1] PV module consists of a glass/ polymer encapsulation/ solar cell string/ polymer encapsulation/ back sheet. Usually, encapsulation materials is used EVA(ethylene vinyl acetate), PVB(polyvinyl butyral), PO(polyolefin)sheet. This study is about fabrication of module using silicone material instead of above them. We got to know advantage that is fabrication time and efficiency of modules.

  • PDF

Density Compatibility of Encapsulation of White Inorganic $TiO_2$ Particles Using Dispersion Polymerization Technique for Electrophoretic Display

  • Kim, Mi-Kyung;Joung, Meyoung-Ju;Kim, Chul-Am;Lee, Yong-Eui;Ahn, Seong-Deok;Kang, Seung-Roul;Suh, Kyung-Soo
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
    • /
    • pp.825-827
    • /
    • 2002
  • The polymer encapsulation of white inorganic $TiO_2$ pigment particles was prepared by a two stage dispersion polymerization technique for applications in electrophoretic displays (EPDs). In order to give functionality for inorganic pigment particles in the EPD, we have investigated the density of the polymer encapsulated $TiO_2$ particles. The average density of the polymer encapsulated $TiO_2$ particles was 2.2 at 25$^{\circ}C$. The average density of the polymer encapsulated $TiO_2$ particles is suitable to 1.7, due to density matching with suspending media. Therefore, we will attempt density compatibility of dispersion polymerization technique for encapsulation of $TiO_2$ particles in suspending media.

  • PDF

Thin film encapsulation of thin-cathode organic electroluminescent devices

  • Lee, Shih-Nan;Hwang, Shiao-Wen;Chen, Chin H.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
    • /
    • pp.1034-1037
    • /
    • 2006
  • We have developed a novel thin film encapsulation method for thin-cathode OLED by introducing organic (not polymer)/inorganic multiple thin films to protect device, which is shown to slow down the permeation rate of moisture and oxygen. From the stability test of devices, the projected lifetime of thin-cathode OLED device with thin film encapsulation was similarly to that with glass lid encapsulation.

  • PDF

Supramolecular Nanodevice Based on Helical Encapsulation of Photo-/Electroactive Oligomers

  • Kim, Oh-Kil
    • 한국고분자학회:학술대회논문집
    • /
    • 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
    • /
    • pp.167-167
    • /
    • 2006
  • Photo-/electroactive donor-acceptor (D-A) chromophores were synthesized and investigated for energy- and electron-transfer (ET/eT) properties, for which the chromophores are supramolecularly integrated by encapsulation with helical amylose, rendering the chromophores aggregation-free and rigidified along the helical axis and thus, a remarkably enhanced fluorescence intensity. Fluorescence quenching studies indicated that the helical encapsulation gives the ET/eT a clear D-A distance dependence unlike with the encapsulation-free counterparts, being reflected in their florescence decay profile. Another notable difference is that the helical supramolecule of the chromophores forms a perpendicularly oriented self-assembly. Transport behavior in the solid state will be also discussed.

  • PDF

고분자 용액의 동축 이중노즐 전기분무: 분산제 흐름의 사용 (Coaxial Nozzle Electrospraying of Polymer Solutions: Use of Dispersant Flow)

  • 김민영;이종휘
    • 폴리머
    • /
    • 제35권3호
    • /
    • pp.254-259
    • /
    • 2011
  • 고분자 용액의 전기분무에서 금속 샘플 포집기들은 분무된 입자로부터 흔히 용매를 충분히 제거하거나 재분산이 가능한 분무 입자를 회수하는데 효과적이지 못하다. 단백질 약물의 캡슐화(encapsulation)를 위해 본 연구에서는 입자를 분산매(응고액제)의 층류 안으로 분무하는 새로운 전기분무시스템을 설계하였다. 캡슐화용 물질로 키토산과 폴리아크릴산이 사용되었다. 이 새로운 시스템을 사용하여 입자의 응집을 방지할 수 있었으며, 4~16 kV의 전압과 같은 유속에서 unimodal한 입도분포를 관찰할 수 있었다. 반면에 가한 전압이 평균 입자 크기에 미치는 영향은 크지 않았다.