• Title/Summary/Keyword: polymer/metal interface failure

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Irregular Failures at Metal/polymer Interfaces

  • Lee, Ho-Young
    • Journal of the Korean institute of surface engineering
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    • v.36 no.4
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    • pp.347-355
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    • 2003
  • Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

Failure Paths of Polymer/Roughened Metal Interfaces under Mixed-Mode Loading (혼합 하중하에서의 고분자/거친금속 계면의 파손경로)

  • Lee Ho-Young;Kim Sung-Ryong
    • Korean Journal of Materials Research
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    • v.14 no.5
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    • pp.322-327
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    • 2004
  • Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

Experimental and numerical disbond localization analyses of a notched plate repaired with a CFRP patch

  • Abderahmane, Sahli;Mokhtar, Bouziane M.;Smail, Benbarek;Wayne, Steven F.;Zhang, Liang;Belabbes, Bachir Bouiadjra;Boualem, Serier
    • Structural Engineering and Mechanics
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    • v.63 no.3
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    • pp.361-370
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    • 2017
  • Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.