• Journal of Sensor Science and Technology
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• v.22 no.5
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• pp.357-363
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• 2013

An ultraviolet pulsed laser ablation of polyimide film coated with platinum has been used to enhance the sensitivity for the application as an electrochemical biosensor. Densely packed cones are formed on polyimide surface after UV irradiation which results in increase of surface area. In order to apply the sensitivity improvement of laser ablated polyimide film electrodes, the glucose oxidase modified biosensor was fabricated by using an encapsulation in the gel matrix through sol-gel transition of tetraethoxysliane on the surface of laser ablated polyimide film. The optimum conditions for glucose determination have been characterized with respect to the applied potential and pH. The linear range and detection limit of glucose detection were from 2.0 mM to 18.0 mM and 0.18 mM, respectively. The sensitivity of glucose biosensors fabricated with laser ablated polyimide film is about three times higher than that of plain polyimide film due to increase in surface area by laser ablation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.1086-1089
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• 2003

We investigated the electro-optical (EO) performances of the super twisted nematic liquid crystal display (STN-LCD) on the polyimide (PI) surface using polymer film. Monodomain alignment of the plastic STN-LCD can be observed. A stable voltage-transmittance (V-T) curve of the plastic STN-LCD was observed on the polyimide (PI) surfaces using polymer film. Also, a faster response time for the plastic STN-LCD on the polyimide (PI) surfaces using polymer film can be achieved. Therefore, the EO performances of the plastic STN-LCD on the polyimide (PI) surfaces using polymer film is almost the same as that of the glass STN-LCD on a polyimide (PI) surface.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.38-44
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• 2005

Pyrolyzed polyimide is explored in terms of MEMS material. This paper describes chemical, electrical, mechanical properties of pyrolyzed polyimide (PIX-1400) thin film as MEMS material. When polyimide thin film was pyrolyzed at $800^{\circ}C$ for 60 minutes in $N_{2}$ ambient, the residual ratio of pyrolyzed film thickness measured with a surface profiler is about 49 %, and the resistivity is about $2.17{\times}10^{-2}\;{Omega}cm$. From the result of the load-deflection test, the estimated Young's modulus and initial average stress of pyrolyzed polyimide are 67 GPa and 30 MPa, respectively. As one demonstration of MEMS structures of pyrolyzed polyimide, the fabrication method of the microbridge structure is proposed for a micro heater and a resonator.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1509-1511
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• 2001

In this study, etching characteristics of polyimide(Pl) film with $O_2/CF_4$ gas mixing ratio was studied using inductively coupled plasma (ICP). The etch rate and selectivity were evaluated to chamber pressure and gas mixing ratio. High etch rate (over 8000$\AA$/min) and vertical profile were acquired in $CF_4$/($CF_4+O_2$) of 0.2. The selectivities of polyimide to PR and polyimide to $SiO_2$ were 1.15, 5.85, respectively. The profiles of polyimide film etched in $CF_4/O_2$ were measured by a scanning electron microscope (SEM) with using an aluminum hard mask pattern. The chemical states on the polyimide film surface were measured by x-ray photoelectron spectroscopy (XPS).

• Journal of Sensor Science and Technology
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• v.32 no.1
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• pp.51-54
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• 2023

We investigated a humidity sensor based on a polyimide-coated side-polished optical fiber. The polyimide film absorbed moisture, causing the resonant wavelength of the sensor to shift to a longer wavelength owing to the changes in the optical properties of the film. The experimental results showed that the resonant wavelength of the device shifted by 17-18 nm when relative humidity changed from 30% to 90%.

• Tribology and Lubricants
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• v.11 no.4
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• pp.28-34
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• 1995

PTFE has good mechanical and chemical stability at wide temperature range, and more over, shows a low value of friction coefficient. On the other hand, it shows cold flow and high wear rate. However, these short comings can be overcome by adding various fillers. In this experiment, PTFE and polyimide powder were mixed into composite and its tribological characteristics was investigated. 100% polyimide was also tested for comparison. The countefface material was a stainless steel (SUS304). Friction and wear tester of ring-on-block type was used at room temperature and under atmosphere. After the wear test, the worn surfaces were examined by optical microscope. The test results show that PTFE-polyimide composite generates. the wear transfer film on both sides of the friction surfaces, and, the friction coefficient and the wear rates are relatively low. 100% polyimide generated little wear transfer films, showed high friction and wear rates, and also showed some problems of vibration and noise. It even damaged the stainless steel countefface. It was concluded that 100% polyimide does not generate transfer film well because its shear resistanbe is high and it stickslips, thus, friction coefficients and wear rates are high. In case of PTFE-polyimide composite, on the other hand, transfer film containing sufficient PTFE adheres and remains on both wear surfaces well enough because PTFE has low shear resistance. Polyimide particles in the composite were proved to be able to bear normal load and does not show stick-slip because they are covered with transfer film containing much PTFE.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.972-973
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• 2007

Relationships between field effect mobility and grain size on pentacene thin-film transistors with $polyimide/SiO_2$ gate dielectrics have been studied. 6 kinds of polyimide were used as surface treatment gate dielectric layer. Grain size of the pentacene thin film were between 5 and $30\;{\mu}m$ and depended on the polyimide. The field effect mobility were also depended on the polyimide and the those values were from 0.027 to $0.69\;cm^2/(Vs)$. The field effect mobility tends to increase with increasing the grain size. Precursor type polyimide containing polyamic acid show better mobility of $0.69\;cm^2/(Vs)$ than soluble type polyimide. Bias stress characteristics in air are discussed in the basis of the grain size.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.59-66
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• 1996

Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.594-597
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• 2023

We have proposed and demonstrated a fiber optic RH (relative humidity) sensor based on fiber Bragg grating covered with a polyimide film. As the polyimide film absolves the moisture in the air, its volume expands. As a result, the grating period of the FBG (fiber Bragg grating) covered with a polyimide film becomes wide and the Bragg wavelength is shifted. The sensor is implemented by fixing a 30 ㎛ thickness polyimide film on the surface of an optical fiber grating using an adhesive, and the characteristics of the device according to humidity are analyzed. The fabricated FBG RH sensor showed a high sensitivity of 0.0186 nm/RH% and a wide measurement range from 30% to 90%. The influence of environmental temperature on the characteristics of the RH sensor was also measured and analyzed. The feasibility of commercialization is presented.