• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.199-202
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on two kinds of polyimide (PI) surfaces using thin plastic substrates. The generated NLC pretilt angles on the pre-imidized type PI are about $3.8^{\circ}$ by the rubbing alignment method with thin plastic substrates, However, the pretilt angle measured at about $2.8^{\circ}$ lower on the polyamic acid type PI than by pre-imidized type PI surface with thin polymer film. The tilt angle increases as increasing curring temperature for making polyimide layer using polyamic acid type PI. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.672-676
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• 2009

Polymide is widely used alignment material of recent commercial LCD panel structure. Generally, polyimide alignment material is classified soluble polyimide type and polyamic acid type with their main bond structure of solution state. specially, compared to polyamic acid alignment layer, soluble polyimide type alignment layer have excellent reliability during long term LCD driving cause of their high imidazation ratio(%), high voltage holding ratio(%) and low ion density. The other side, this type alignment materials has significant DC image stickicng side effect for using in-plane switching mode lcd structure cause of their slow DC discharging property. we applied inorganic salt to usual soluble polyimide type alignment layer and found out this technique had good DC image sticking property without any loss of reliability property in inplane switching LCD cell structure. This approach leads excellent DC image sticking property with maintaining high reliability property this approach confirmed improves an image sticking and a reliability simultaneously from the horizontality aligned LCD mode whose relatively bad image sticking property.

• 한국환경과학회지
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• 제12권4호
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• pp.481-485
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• 2003

Two types of polyimide/silica composite films were prepared using sol-gel method through hydrolysis and polycondensation of tetraethoxysilane (TEOS) with the polyamic acid (PAA) and end-capped PAA solution. Samples were characterized by the means of differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, universal test, impedance analyzer, chemical resistance test, etc. All of the PAA/silanol solutions heat-treated at 300$^{\circ}C$ for 6h were transformed to polyimide/silica composites. It has been demonstrated that the properties of polyimide/silica composites were affected by the amount of silica addition and the bend type existed between polyimide and silica.

• 한국세라믹학회지
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• 제39권11호
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• pp.1063-1068
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• 2002

Polyimide와 silica에 물리적 또는 화학적으로 결합된 Polyimide/silica(PI/silica) 혼성체들을 졸-겔법을 통하여 Polyamic Acid(PAA) 또는 end-capped PAA 용액에 tetraethoxysilane을 가수 분해 및 축 중합시켜서 제조하였다. PAA 용액은 dimethylacetamide 용액 내에서 pyromellitic dianhydride와 oxydianiline 단량체들을 개환 반응으로 합성하였다. End-capped PAA 용액은 PAA 용액에 3-aminopropyltriethoxysilane을 첨가하여 제조하였다. 적외선 분광기, 시차 열분석기, X-선 회절 분석기, 주사 전자현미경 및 인장 강도 시험기를 통하여 PI/silica 혼성체 시편들의 특성을 분석하였다. 혼성체 시편들의 물성은 PI와 silica간의 결합형 및 silica의 함량에 의해 영향을 받는다는 것을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.972-973
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• 2007

Relationships between field effect mobility and grain size on pentacene thin-film transistors with $polyimide/SiO_2$ gate dielectrics have been studied. 6 kinds of polyimide were used as surface treatment gate dielectric layer. Grain size of the pentacene thin film were between 5 and $30\;{\mu}m$ and depended on the polyimide. The field effect mobility were also depended on the polyimide and the those values were from 0.027 to $0.69\;cm^2/(Vs)$. The field effect mobility tends to increase with increasing the grain size. Precursor type polyimide containing polyamic acid show better mobility of $0.69\;cm^2/(Vs)$ than soluble type polyimide. Bias stress characteristics in air are discussed in the basis of the grain size.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권2호
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• pp.128-132
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• 2004

This paper presents the design, fabrication sequence and measurement results of a highly sensitive capacitive-type humidity sensor using a polyimide film without hydrophobic elements. The structure of the humidity sensor is MIM (metalinsulator-metal). For a high sensitivity, a modified aromatic polyimides as a moisture absorbing layer has been synthesized instead of using general polyimides containing hydrophobic elements. The polyimide film was obtained by synthesizing and thermally polymerizing polyamic acid composed of m-pyromellitic dianhydride, phenelenediamine and dimethylacetamide. Characteristics of fabricated sensors which include sensitivity, hysteresis and stability have been measured. The measurement result shows the percent normalized capacitance change of 0.37/%RH over a range from 10 to 90%RH, hysteresis of 0.77% over the same %RH range and maximum drift of 0.25% at 50%RH. The result shows that the developed humidity sensor can be applied to evaluate a hermeticity of various sensors and actuator systems as well as micro packages.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 추계학술대회 논문집 학회본부
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• pp.222-224
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• 1994

This paper describes the optimum conditions for depositing PAAS(polyamic acid alkylamine salts) Langmuir-Blodgett (LB) films, which are a precursor of polyimide LB films. The optimum conditions were studied by $\pi$-A isotherma with a varication of temperatures, spreading amounts or solution, compression speeds, and etc. Transfer ratio was also measured depending on the type of LB films.

• 폴리머
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• 제30권2호
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• pp.162-167
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• 2006

1,2,3,4-시클로부탄 테트라카복시산 이무수물과 4,4'-디아미노디페닐에테르(DDE)를 용액 중합 반응하여 폴리암산(PAA) 용액을 제조한 후, 1,2-에폭시-3-페녹시프로판과 반응시켜 폴리암산에스테르(PAE)를 합성하였다. 여기에 용해억제재로서 30 wt%의 디아조나프토퀴논 유도체(DI)를 첨가하였다. $365{\sim}400nm$의 파장에서 $200mJ/cm^2$의 자외광을 조사한 후, 0.95 wt%의 테트라메틸암모니움히드록사이드 수용액으로 현상한 결과 $25{\mu}m$ 해상도의 양성형 미세 화상을 얻었다. 비노광부에 잔존하는 폴리이미드 박막은 400nm에서 92% 이상의 우수한 광투과도를 나타내었다.