• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• Macromolecular Research
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• v.8 no.1
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• pp.19-25
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• 2000

Aromatic diamine monomers containing allylic ester linkage, 1,5-bis(4-aminobenzoate)-1,2,3,4-tetrahydronaphthalene (4-DABTN) and 1,5-bis(3-amin obenzoate)-1,2,3,4-tetrahydronaphthalene (3-DABTN) were synthesized through the reaction of 1,5-dihydroxy-1,2,3,4-tetrahydronaphthalene and 4- or 3-nitrobenzoly chloride. By the reaction of these diamines with pyromellitic dianhydride (PMDA) or 4,4-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), poly(amic acid)s were obtained. The inherent viscosities of the poly(amic acid)s were between 0.55 and 1.31 dL/g. The poly(amic acid)s were converted to polyimides by chemical imidization. The thermogravimetric analysis (TGA) thermograms of these polyimides showed temperatures of 5% weight loss between 323 and 389$^{\circ}C$ in nitrogen atmosphere. The model compound ,1,5-bis (4-nitrobenzoate)-1,2,3,4-tetrahydronaphthalene (4-DNBTN), was decomposed to 4-nitrobenzoic acid and 5-(4-nitrobenzoate)-3,4-dihydronaphthalene upon addition of CF$_3$COOH.

• Polymer(Korea)
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• v.26 no.6
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• pp.701-709
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• 2002

To synthesize a new positive photosensitive polyimide precursor, parts of carboxylic acid groups in poly (amic acid) were esterified with 4,5-dimethoxy-2-nitrobenzyl bromide in the presence of K$_2$CO$_3$/HMPA followed by the chemical imidization of residual carboxylic acid units. The chemical structure of resulting polymer was characterized by $^1$H-NMR, UV/vis and FT-IR spectroscopic methods, and its thermal properties were examined by DSC and TGA. Upon UV irradiation, 4,5-dimethoxy-2-nitrobenzyl moiety underwent the photodegradation. As a result, the polymer became soluble in alkaline developer due to the formation of carboxylic acid moiety, which was used to make a micron-sized positive pattern. Sensitivity curves were obtained from the gel fraction experiments with respect to the various 4,5-dimethoxy-2-nitrobenzyl ester contents. From those curves, the sensitivity was ranged iron 4000 to 6000 mJ/㎠, and the contrast was measured to be from 3.1 to 4.9.

• Macromolecular Research
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• v.16 no.8
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• pp.725-733
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• 2008

Polyimide (PI) multilayer thin films were prepared by spin-coating from a poly(amic acid) (PAA) and poly(amic acid) ammonium salt (PAAS). PI was prepared from pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) PAA. Different compositions of PAAS were prepared by incorporating triethylamine (TEA) into PMDA-ODA PAA in dimethylacetamide. PI multilayer thin films were spin-coated from PMDA-ODA PAA and PAAS. The PAAS comprising cationic and anionic moieties were spherical with a particle size of $20{\sim}40\;nm$. Some particles showed layers with ammonium salts, despite poor ordering. Too much salt obstructed the interaction between the polymer chains and caused phase separation. A small amount of salt did not affect the interactions of the interlayer structure but did interrupt the stacking between chains. Thermogravimetric analysis (TGA) showed that the average decomposition temperature of the thin films was $611^{\circ}C$. All the films showed almost single-step, thermal decomposition behavior. The nanostructure of the multilayer thin films was confirmed by X -ray reflectivity (XRR). The LF 43 film, which was prepared with a 4:3 molar ratio of PMDA and ODA, was comprised of uniformly spherical PAAS particles that influenced the nanostructure of the interlayer by increasing the interaction forces. This result was supported by the atomic force microscopy (AFM) data. It was concluded that the relationship between the uniformity of the PAAS particle shapes and the interaction between the layers affected the optical and thermal properties of PI layered films.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.50-55
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• 2016

Aromatic diamines containing hexafluoroisopropylidene and ester moiety were synthesized from 4,4'-hexafluoroisopropylidene diphenol and nitrobenzoyl chloride. The reaction of aromatic diamines with hexafluoroisopropylidene phthalicdianhydride (6FDA) or pyromellitic dianhydride (PMDA) gave four kinds of poly(amic acid)s. Their inherent viscosities ranged from 0.196 to 0.346 dL/g. Poly(amic acid)s were converted to polyimides by thermal imidization. The glass transition temperatures ($T_g$) of polyimides were between 241 and $289^{\circ}C$. The 5% weight loss temperatures were recorded in the range of $430{\sim}492^{\circ}C$. The tensile strength of polyimide films were measured as 29.84~64.38 MPa.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.389-392
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• 2005

Poly(amic acid) precursors were prepared by mixing various main chain dianhydrides, main chain diamines and side chain diamines. The side chain diamine has an alkylbicyclohexyl group as a side chain. The copolyimide films, produced by casting the poly (amic acids) solution, exhibited the vertical alignment property without the rubbing process in the range of the curing themperature from $90^{\circ}C$ to $240^{\circ}C$ for 1h. The thermal and surface properties of the poly(amic acids) depending on the curing temperature was examined.

• Fibers and Polymers
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• v.2 no.2
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• pp.92-97
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• 2001

New film forming aromatic poly(amide-imide)s containing isoindoloquinazolinedione (IQ) unit in the backbone chain (polymer XIV) have been successfully synthesized by preparing prepolymers of poly(amic acid-carbonamide). followed by subsequent thermal cyclization of the prepolymers. 4,4-Diamino-3-carbamoylbenzanilide (DACB) V has been synthesized by reduction of 3-carbamoyl-4-amino-4-nitrobenzanilide IV. The prepolymers of poly(amic-acid-carbonamide) (polymers VII and VIII) which exhibit viscosities ranging from 1.4 to 1.7 dl/g have been prepared by a condensation polymerization of monomers such as BPDA, ODA, and DACB. Polymer XIV has been obtained by thermal cyclization of the polymers VII and VIII. During the thermal cyclization reaction, imide ring structure was first introduced and then transformed to the structure of IQ unit. The thermal degradation rate of the resultant polymers were influenced by the cleavage of amide bond but the final char yield was comparable to that of poly(BPDA-ODA).

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• Polymer(Korea)
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• v.34 no.4
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• pp.326-332
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• 2010

Nanocomposite films were prepared by blending poly(amic acid)(PAA), poly(o-hydroxyamide)( PHA) and organically modified montmorillonite (OMMT) that has a layered structure. XRD, SEM and TEM were used to study the morphology of PAA/PHA nanocomposites, and DMA, TGA, UTM, LOI and PCFC techniques were used to characterize the mechanical and thermal properties, and flame retardancy of the nanocomposites. TEM images revealed that OMMT layers were well dispersed in the PAA/PHA matrix and showed exfoliation and intercalation behavior. The addition of 3 wt% OMMT to the PAA/PHA blend increased the initial modulus of PAA/ PHA blend to 3.68 GPa that was ca. 48% higher than that of the control PAA/PHA blend. Above 4 wt%, however, both the initial modulus and the tensile strength were found to decrease, which might be due to the aggregation of OMMT in PAA/PHA matrix. When the OMMT content was below 3 wt%, the thermal stability and flame retardancy of the PAA/PHA nanocomposites increased with increasing OMMT content.

• Polymer(Korea)
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• v.30 no.2
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• pp.162-167
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• 2006

Polyamic acid (PAA) was prepared from cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) and 4,4'-fiaminodiphenyl ether (DDE). In order to impart a photosensitivity to the PAA, diazonaphthoquinone (DNQ) derivative (DI) was added. However, the addition of the DI was not enough to inhibit the dissolution of the PAA for a aqueous alkal solution. Therefore, we had synthesized poly(amic acid ester)s by an adding 1,2-epoxy-3-phenoxypropane to the PAA. That is, an acidity of the PAA could be controlled by an esterification reaction of 1,2-epoxy-3-phenoxypropane with the PAA. Significant difference of a dissolution rate of the poly(amic acid ester) between an o(posed and unexposed area was observed at an acid content of 60% and less. Resolution of the positively patterned film showed about $25{\mu}m$ at the exposure dose of $200mJ/cm^2$.