• Journal of the Korean Society for Precision Engineering
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• v.15 no.8
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• pp.33-38
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• 1998

TiYN coated high speed steel tools have been developed and their tool lifes were assessed. First yttrium alloyed titanium target was manufactured, then using the arc ion plating(AIP) technique TiYN coating was deposited onto high speed steel substrate. Three kinds of varying thickness of TiYN coated tools were prepared. Cutting tests were carried out with theses tools and for comparison with the commercially available uncoated, TiN, TiCN and TiAlN coated tools. During the cutting tests flank wear width vs. cutting time was measured. It has been revealed that the newly developed TiYN coated tools show superior tool life characteristics to others.

• Journal of Surface Science and Engineering
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• v.32 no.2
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• pp.172-181
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• 1999

The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and electrochemical method. The deposition rate was dependent with DMAB concentration. The polarization resistance of the precipitation reaction was reduced with DMAB concentration. The precipitation reaction rate of Ni-B deposits was controlled by the oxidation rate of DMAB as the source of electron. The boron content of the deposit was constant at about 5.5wt%, even when DMAB concentration in the solution was increased. The effect of temperature and stabilizer ($Pb(NO_3)_2$) concentration on deposition rate was shown to have co-dependent behaviors.

• Journal of Surface Science and Engineering
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• v.40 no.5
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• pp.214-218
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• 2007

The objective of this study is to evaluate the diffusion behavior of Al and Si from a coatings in the microstucture of Fe-Si steel. Steel samples deposited with Al-Si alloy are prepared by ion plating process, followed by annealing treatments for diffusion at $1050^{\circ}C$. Several intermetallic phases are found in the coatings and they are identified as Fe-Al and an orderd Fe-Si compounds. Series of different concentration profiles through the sample have been obtained and Si content reaches about 5 wt% in case of 90 minutes of diffusion time.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.51-58
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• 1996

This report describes thick traveling-wave electrode formation and microwave transmission characteristics of the fabricated electrodes. Effective refractive indices of the microwave in the 5 micron CPW type traveling-wave electrodes is around 2.45 according to the results of time domain S parameter measurements. The bandwidth of the electrodes is about 10 GHz and could be extended to 15 GHz through optimization of the process. The developed process technique that enables plating of micropatterns upto 20 micron can be applied to broadband optical intensity modulators.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.136-137
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• 2007

Wear resistant TiAlN thin film has been widely deposited on the surface of cutting and forming tools by using Arc Ion Plating. TiAlN films are deposited by the processes designed by the Taguchi L18 experimental design. The L18 experimental design is applied to achieve surface properties and adhesion. The deposition parameters are working pressure, substrate temperature, bias voltage, arc power and pre-sputtering bias voltage and time. The most influential parameters on surface properties and adhesion are substrate bias voltage, working nitrogen pressure and arc power. The optimal coating processes are obtained for surface properties and adhesion.

• Journal of Surface Science and Engineering
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• v.16 no.3
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• pp.98-107
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• 1983

A study on the improvement of wear resistance of brasses by electroplating and diffusion treatment of tin was carried out. The optimum condition of the treatment obtained was as follows. Plating thickness of tin : 5 - 9 $\mu\textrm{m}$ Condition of diffusion treatment : atmosphere ; fused nitrate bath (KNO3 + NaNO3) temperature and time ; 1st step 320$^{\circ}C$, 60min. and 450$^{\circ}C$, 30min. During the diffusion treatment, internetallic compounds of Cu-Sn were formed and these compounds were identified as η, $\varepsilon$ and $\delta$ phase from the outer tin layer. It was considered that the improvement of wear resistance of brasses by the treatment is because of the formation of intemetallic compounds particalarly $\varepsilon$phase which is very hard, between soft tin layer brass.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.57-63
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• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.49-54
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• 2022

The copper plating process used to fabricate the submicron damascene pattern of Cu wiring for Si wafer was applied to the plating of a PCB pattern of several tens of microns in size using the same organic additives and current density conditions. In this case, the non-uniformity of the plating thickness inside the pattern was observed. In order to quantitatively analyze the cause, a numerical calculation considering the solution flow and electric field was carried out. The calculation confirmed that the depletion of Cu²⁺ ions in the solution occurred relatively earlier at the bottom corner than the upper part of the pattern due to the plating of the sidewall and the bottom at the corner of the pattern bottom. The diffusion coefficient of Cu²⁺ ions is 2.65 10^-10 m²/s, which means that Cu²⁺ ions move at 16.3 ㎛ per second on average. In the cases of small damascene patterns, the velocity of Cu²⁺ ions is high enough to supply sufficient ions to the inside of the patterns, while sufficient time is required to replenish the exhausted copper ions in the case of a PCB pattern having a size of several tens of microns. Therefore, it is found that the thickness uniformity can be improved by reducing the current density to supply sufficient copper ions to the target area.

• Korean Journal of Materials Research
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• v.6 no.7
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• pp.700-708
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• 1996

Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.