• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.700-702
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• 2005

A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

• Proceedings of the Korea Crystallographic Association Conference
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• 2007.11a
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• pp.7-7
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• 2007

• Proceedings of the Korean Vacuum Society Conference
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• 2007.02a
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• pp.132-132
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• 2007

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.231-233
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• 2005

In this paper, we discuss the potential applications for electronic systems on flexible substrates. The barriers to the successful development of commercial markets are analyzed. For each promising application, the critical technical features are identified. Ways to bridge the gap between research and commercialization are suggested.

• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.140-141
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• 2005

• 전자공학회논문지 IE
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• v.44 no.3
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• pp.42-50
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• 2007

In this paper, elastic and plastic adhesion index was very important in deciding adhesive characteristics and varying elastic and plastic index, dimensionless load and pull-off force were analyzed and simulated. Finally, using AFM, experimental surface roughness parameters of substrates and pull-off force between tip and substrates were produced. Using these values, pull-off forces were calculated and were compared with experimental pull-off forces. Through simulation and experiment, it was found that interaction of asperity also had very important influence on adhesive contact.

• Bulletin of the Korean Chemical Society
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• v.32 no.9
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• pp.3311-3316
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• 2011

New poly(arylene ether)s (PAEs) with both transparency and heat-resistance were prepared by a polycondensation of FBPODS, an ordered-sequence aromatic dihalide, and cardo typed aromatic diols containing fluorene and/or adamantane moiety and also non-cardo typed 1,5-naphthalene diol. The resulting polymers had their glass transition temperatures ranged from 202 to $247^{\circ}C$. Based on TGA data, they exhibited excellent thermal stabilities, showing 5% weight loss at $434-487^{\circ}C$. They had low thermal expansion coefficients of 58-59 ppm at temperature range of $50-200^{\circ}C$ as well as good mechanical properties with moduli of 1757-2143 MPa. The optical transmittance for the PAE films was over 70% at 550 nm, except for the PAE that contains naphthalene moiety (30% at 550 nm). They also showed water uptake of about 0.68% regardless of their chemical compositions. Therefore, the newly developed PAEs show strong potential as plastic substrates for flexible devices for display, solar cell and e-paper.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.670-673
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• 2008

Good mechanical properties of thin-film transistors on plastic substrates are an essential parameter in the development of robust flexible displays. In this paper, a careful investigation is carried out on TFT backplane on plastic substrates under cyclic bending conditions. Bending modes of tensile and compressive as well as parallel and perpendicular orientation-dependent bending of channel have been analyzed carefully. This analysis will be helpful in knowing the electro-mechanical performance boundaries of the TFT devices so as to determine the bending limitations of our flexible displays.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.785-789
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• 2005

Low temperature deposition of silicon and silicon nitride films by catalytic CVD technique was studied for application to thin film transistors on plastic substrates for flexible AMOLEDs. The substrate temperature initially held at room temperature, and was controlled successfully below $150^{\circ}C$ during the entire deposition process. Amorphous silicon films having good adhesion, good surface morphology and sufficiently low content of atomic hydrogen were obtained and could be successfully crystallized using excimer laser without a prior dehydrogenation step. $SiN_x$ films showed a good refractive index, a high deposition rate, a moderate breakdown field and a dielectric constant. The Cat-CVD silicon and silicon nitride films can be good candidates for fabricating thin films transistors on plastic substrates to drive active-matrix organic light emitting display.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1112-1114
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• 2009

In this paper, we have studied manufacturing process for liquid crystal displays (LCDs) using plastic substrates. Because the thermal and dimensional stabilities of plastic substrates are decisive issues, both the process and materials were improved to fit the manufacturing requirements of flexible twisted-nematic (TN) and color super-twisted nematic (CSTN) LCDs. Finally, to broaden the flexible display applications, we take advantage of the unique properties of flexible display to design several innovative products.