• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.417-420
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• 2003

Exitech has developed a range of advanced laser ablation tools for the manufacture of display device structures on super large glass and plastic substrates. Technical information and cost of ownership data about these tools together with key areas of application are presented

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1125-1131
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• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on the two kinds of polyimide (PI) surfaces using thin plastic substrates. The NLC pretilt angles generated on thin plastic substrates are higher than that on the glass substrate. We study that AFM (atomic force microscope) image of rubbed PI surface with polymer film has formed the micro-groove. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer are almost the same as that of the TN-LCD with a rubbed PI surface based on glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.487-488
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• 2005

We have investigated the Electro-Optical Characteristics for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. EO characteristics of the TN-LCD with a rubbed PI surface based on polymer are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on glass.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.655-656
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• 2005

In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1459-1462
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• 2008

In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.39-40
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• 2000

STN LCDs on Plastic Film substrates for mobile communication devices have been researched and developed at KETI in KOREA. The Plastic Film substrate is so weak to heat and pressure that its fabrication process is limited to $110^{\circ}C(Tg)$. In order to maintain uniform pressure on Plastic Film substrate we used newly designed jig and fabrication process. Electro-optical characteristics are better than or equivalent to those of typical glass LCD though it is thinner, lighter-weight, and more robust than glass LCD.

• Korean Journal of Agricultural Science
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• v.39 no.1
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• pp.35-41
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• 2012

This research was conducted to investigate the influence of organic bed soil substrates on growth and yield of organically grown ginseng transplantation in a shaded plastic houses. The pH and EC of the substrates used for this study were 5.93-6.78 and 0.03-0.15 dS/m, respectively. The concentrations of NH4-N and $NO_3$-N were 14.01-68.63 mg/L, 5.60-58.83 mg/L respectively. and the average quantum in the shaded plastic houses was 11-15% of natural light. The maximum temperature in the shaded plastic houses is higher ($3-7^{\circ}C$) than that of outside open field from the last part of April to early in August. Emergence date of ginseng was on March 21 in the mongolian type shaded plastic house, and was on March 29 in normal type shaded plastic house. Both roots and shoot growth of ginseng were excellent in the bed soils with PPV-2, compared with other compounds used. We concluded that the PPV-2 could be promising a good bed soil substrate for organic ginseng cultivation in shaded plastic house.

• Information Display
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• v.7 no.3
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• pp.41-49
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• 2006

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.506-509
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• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using thin plastic substrates. The LC aligning capabilities and pretilt angle of the thin plastic substrates by in-situ photoalignment method were better than that of the glass substrate by general photoalignment. Also, the LC pretilt angle increased with increasing heating temperature and exposure time. And EO characteristics of photoaligned TN-LCDs using in-situ photodissociation method on glass substrate and on plastic substrate are also excellent.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.62-65
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• 2007

Conventional semiconductor processes have been utilized to fabricate 3.5-inch OTFT-driven OLEDs with a resolution of $176\;{\times}\;144$ pixels on plastic substrates. By using a PC-OVD method to deposit a pentacene layer and optimizing patterning and the following processes, we could complete a uniform and reliable integration procedure for an active matrix organic light emitting devices on a plastic substrate. The technical importance of ours is the applicability of conventional semiconductor process to organic materials on plastic substrates. Although there are many hurdles to overcome, our approach and technical improvements are proved to be applicable to plastic electronics.