• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.8
• /
• pp.658-663
• /
• 1998

Ferrite plating enables were grown by ferrite by plating method in solution at low temperature(<10$0^{\circ}C$). This faciltates the fabrication of new ferrite thin film devices using non- heat-resistant materials(plastic, GaAs ect) as substrates. Combining the ferrite plating with sonochemistry, application of power ultrasonic waves to stimulate chemical reactions, the crystallinity and qualities of films were improved. Modifying the reactions cell and plating conditions further improved the film quality.

• Journal of the Korean Society for Precision Engineering
• /
• v.34 no.3
• /
• pp.199-203
• /
• 2017

Hot embossing techniques are used to engrave patterns on plastic substrates. Roll based hot embossing uses a heated roll for a continuous process. A heated roll with relief patterns is impressed on a preheated plastic substrate. Then, the substrate is cooled down quickly to prevent thermal shrinkage. The roll speed is normally very slow to ensure substrate temperature increase up to the glass transition temperature. In this paper, we propose a noncontact preheating technique using focused infrared light. The infrared light is focused as a line beam on a plastic substrate using an elliptical mirror just before entering the hot embossing roll. The mid range infrared light efficiently raises the substrate temperature. For preliminary tests, substrate deformation and temperature changes were monitored according to substrate speed. The experiments show that the proposed technique is a good possibility for high speed hot embossing.

• Journal of the Korean Vacuum Society
• /
• v.13 no.1
• /
• pp.29-33
• /
• 2004

In this paper, we investigated the ultra-low temperature(<$150^{\circ}C$) polycrystalline silicon film on plastic substrate application using RF-magnetron sputtering and excimer laser annealing. Amorphous silicon films were deposited using Ar/He mixture gas at $120^{\circ}C$ and in-film argon concentration was less than 2%, which was measured to Rutherford Backscattering Spectrometry. At energy density 320mJ/$\textrm{cm}^2$, RMS roughness was 267$\AA$ and UV crystallinity was 62%. The grain size varies from 50nm to 100nm after excimer laser irradiation.

• Journal of Sensor Science and Technology
• /
• v.28 no.6
• /
• pp.390-394
• /
• 2019

This paper presents an inkjet-printed plastic force sensor using PEDOT:PSS. Using a piezoelectric-type inkjet printer, the force sensor was manufactured by printing PEDOT:PSS ink onto a polyimide (PI) substrate film. Applying a vertical force of 0 to 100 N to the force sensor on the PI substrate with a thickness of 64 mm, the resistance of the force sensor increased in proportion to the input force by the length deformation of the PI substrates and the sensor pattern. As a result, the fabricated sensor has a characteristic of 0.001% /N with a linearity of 99.38%. In addition, as the thickness of the PI substrate film increased, the sensitivity of the sensor increased linearly. The fabricated force sensor is expected to be applied to industrial sites and healthcare fields.

• Journal of International Society for Simulation Surgery
• /
• v.4 no.1
• /
• pp.1-8
• /
• 2017

In the field of tissue engineering, researches have been actively conducted to regulate stem cell fate by understanding the interaction between cell and materials. This approach is expected as a promising therapeutic method in the future medicine by utilizing differentiation of stem cells into desired cells or tissues using biomaterial. For this regenerative medicine, there exist lots of attempts to construct optimized structures of various shapes and sizes that can regulate the stem cell fate. In this review, we will empathize the topographic effect as stem cell niche on the mesenchymal stem cell (MSC) response (cell attachment, proliferation, and differentiation) according to the shape and size of the structure of the substrates, and comprehensively analyze the importance and the effect of shape and size of the surface topography.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.5
• /
• pp.379-385
• /
• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Macromolecular Research
• /
• v.13 no.2
• /
• pp.114-119
• /
• 2005

We synthesized two new series of alternating copolymers, poly[bis(2-(4-phenylenevinylene)-2-cyanoethenyl)-9,9-dihexyl-9H-fluoren-2,7-yl-alt-1,4-phenylene](Polymer-I)and poly[bis(2-(4-phenylenevinylene)-2­cyanoethenyl)-9,9-dihexyl-9H-fluoren-2,7-yl-alt-2,7-(9,9-dihexylfluorene)](Polymer-II), via the Suzuki coupling reaction, for use in light-emitting diodes (LEDs). Defect-free uniformly thin films of these polymers were found to be easily formed on indium-tin oxide (ITO) coated glass substrates. Multi-layer LEDs with ITO/PEDOT/Polymer/ LiF/Al configurations with or without an $Alq_3$ electron transport layer were fabricated with these polymers. The maximum EL emissions of Polymer-I and Polymer-II with an $Alq_3/LiF/Al$ cathode were observed at 516 and 533 nm, respectively. The maximum brightness and external luminance efficiency of the devices fabricated with the EL polymers were found to be $411 cd/m^2$ and 0.16 cd/A, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.5
• /
• pp.368-372
• /
• 2016

In this study, we develop a novel high-throughput micronanopatterning system that can implement continuous mechanical pattern inscribing on flexible substrates using a rigid grating mold edge. We perform a conceptual design of the process principle, specific modeling, and buildup of a real system prototype. This research also carefully addresses several important issues related to processing and controlling, including precision motion, alignment, heating, and sensing to enable a successful micronanopatterning in a continuous and high-speed fashion. Various micronanopatterns with the desired profiles can be created by tuning the mold shape, temperature, force, and substrate material toward many potential applications involving electronics, photonics, displays, light sources, and sensors, which typically require a large-area and flexible configurations.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07a
• /
• pp.61-63
• /
• 2005

Pentacene based OTFT on PC and PES plastic substrates have been fabricated in a scale of 5 inches. We could get a small OTFT device enough to be applicable for AMOLED by acquiring the at least misalignment margin through a contact aligner. And also we could find out the degradation of device parameter through the integration processes and improve the properties by using a buffer layer as an etch stopper in an active patterning. Through these, the mobility of device is more than about $0.2cm^2/Vs$ and $I_{on}/I_{off}$ is higher than $10^5$.

• Journal of the Korean Vacuum Society
• /
• v.22 no.4
• /
• pp.211-217
• /
• 2013

Two types of organic thin film solar cell devices with bulk hetero-junction (BHJ) structure were fabricated on plastic substrates using conjugated polymers of $PCDTBT:PC_{71}BM$ and $PTB7:PC_{71}BM$ blended as active channel layer. Time-variant characteristics of the organic thin film solar cell devices were investigated: short circuit current density ($J_{SC}$); open circuit voltage ($V_{OC}$); ; fill factor (FF); power conversion efficiency (PCE, ŋ). All the performance parameters were degraded by progress of the measurement time, while $V_{OC}$ showed the most drastic decrease with time. Possible factors to cause the time-variant alteration of performance parameters were discussed to be clarified.