• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.633-636
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• 2006

GE has developed a plastic substrate technology comprised of a superior high-heat polycarbonate substrate film and a unique transparent coating package that provides the ultrahigh barrier to moisture and oxygen, and chemical resistance to solvents used in device fabrication. This contribution will update recent progresses made at GEFlexible Ultra-high Gas Barrier Substrate for Organic Electronics on ultra-high barrier coated plastic substrate, both in batch mode and in roll-to-roll mode

• Journal of Welding and Joining
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• v.19 no.1
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• pp.104-111
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• 2001

This study presents an analysis method for heat flow and deformation of sheet metal laser welding. A heat source model for 2-dimensional heat flow analysis of laser welding process was suggested in this paper. To investigate the availability of the heat source model, the analysis results were compared and estimated with the results of previous researches. We could get a good agreement between the results of numerical analysis and experiments in the temperature distribution of weldment. Due to the characteristics of welding process, some kinds of deformations are usually generated in a welded structure. Generally, the degree of deformation is dependent on the welding sequence constraints as well as input power Therefore, in this paper we evaluate the deformation of gas pressure vessel according to the welding sequence and input power. In the analysis of weld deformation, 2-dimensional thermo-elasto-plastic analysis was performed for the gas pressure vessel by using a commercial FE program package.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.614-615
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• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• Structural Engineering and Mechanics
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• v.55 no.5
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• pp.913-929
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• 2015

The ratcheting and strain cyclic behaviour of joined conical-cylindrical shells under uniaxial strain controlled, uniaxial and multiaxial stress controlled cyclic loading are investigated in the paper. The elasto-plastic deformation of the structure is simulated using Chaboche non-linear kinematic hardening model in finite element package ANSYS 13.0. The stress-strain response near the joint of conical and cylindrical shell portions is discussed in detail. The effects of strain amplitude, mean stress, stress amplitude and temperature on ratcheting are investigated. Under strain symmetric cycling, the stress amplitude increases with the increase in imposed strain amplitude. Under imposed uniaxial/multiaxial stress cycling, ratcheting strain increases with the increasing mean/amplitude values of stress and temperature. The abrupt change in geometry at the joint results in local plastic deformation inducing large strain variations in the vicinity of the joint. The forcing frequency corresponding to peak axial ratcheting strain amplitude is significantly smaller than the frequency of first linear elastic axial vibration mode. The strains predicted from quasi static analysis are significantly smaller as compared to the peak strains from dynamic analysis.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.1
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• pp.47-52
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• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Welding and Joining
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• v.21 no.7
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• pp.71-77
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• 2003

In this study, an investigation based on the superposition principle to predict residual stress redistribution caused by crack propagation itself initially through residual tensile stress field was performed by finite element method. The tendency in residual stress redistribution caused by crack propagation recognized both from the analytical results and experimental result was the residual stress concentration consecutively occurred in the vicinity of crack tip even the situation that the crack propagated to the region initially residual compressive stress existed. The software for the analysis is ABAQUS, which is a general purpose finite element package. The analytical method that attempt to take the plastic deformation at the crack tip due to tensile residual stress into the consideration of residual stress redistribution caused by crack propagation was proposed. The plastic zone size at the tip of fatigue crack and redistributed residual stresses were calculated by finite element method on the bases of the concept of Dugdale model. Comparing these analytical results with experimental results, it is verified that the residual stress redistribution caused by crack propagation can be predicted by finite element method with the proposed analytical method.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Korean Journal of Agricultural Science
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• v.38 no.2
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• pp.205-212
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• 2011

The potential factors for quality loss of cleaned fresh ginseng and technology to be associated with the improvement of marketability through pre-packaging fumigation were examined. Major microorganisms isolated from fresh ginseng included Botrytis cinerea, and Erwinia sp. Others such as Cylindrocarpon sp., Fusarium spp., Pennicilium spp., Bacillus spp. were also found at relatively low frequency. The bacterial density of vacuum packaged fresh ginseng rapidly increased during simulated marketing. Little correlation between bacterial growth and package swelling was found. In order to improve packaging method of fresh ginseng, pre-packaging treatment of 2-phenylethyl alcohol (PE, 100 uL/L, 4 hr) was examined. The fumigation treatment effectively inhibited the growth of bacteria density and also effective on keeping firmness of ginseng root, especially in cortical portion. The internal gas compositions of plastic container packaged for ginseng were approximately ranged between 6 to 8% $O_2$and 3 to 4% $CO_2$. The $O_2$ level of fumigation treatment was lower than control whereas $CO_2$ level was higher. The upsurge of ethylene evolution I day after simulated marketing was found only in fumigation treatment but it returned to ordinary level at day 2. The sucrose content of 2-PE treatment was significantly reduced at 5 days after simulated marketing but reducing sugars like glucose and fructose remained at higher level. The difference in sugar levels was reduced after 10 days of simulated marketing. The decay of fresh ginseng began at the lateral or fine root, which is weak to physical damage, in general. The epidermis was more damaged. Plastic container packaging with PE fumigation could be an alternative to vacuum packaging, which allows an aerobic environment and prevents anaerobic respiration. Further study of pre-package fumigation is required to improve technology of fresh ginseng marketing.