• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Tribology and Lubricants
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• v.21 no.2
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• pp.71-76
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• 2005

This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a non-contact position measuring system based on the principle of capacitance micrometry with 0.1nm resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.79-83
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• 2012

LTCC (Low temperature co-fired ceramic) package have been paid much attention due its good reliability, miniaturization, and application of silver paste with complex wiring and printing. Therefore, LTCC package has been expected to replace vulnerable plastic package in the field of high power LED device. Currently, LTCC ceramic package is mainly made up of aluminum oxide powder. In this study, zinc oxide powder is added or replaced for the fabrication of LTCC ceramic body. By adding small amount of ZnO, thermal conductivity of the LTCC ceramic body could be remarkably increased by 25% leading to the extension of LED life time. The LTCC package structure with composition including ZnO has an increased thermal flux by 56% as a result of ANSYS simulation. Actually, the fabricated LED package with the addition of ZnO exhibits a decreased thermal resistivity by 14.9%.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.3
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• pp.113-121
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• 2009

Behavior of a package of a microwave oven under the clamping condition is evaluated by tests and the finite element analyses. PAM-CRASH software is used for the finite element analyses. Results of the analyses are compared with those of the tests and accuracy is shown to be favorable. Under the clamping condition of the original design, severe deformation occurs and an improved design of the outer case and upper EPS(Expandable Poly Styrene) is proposed to reduce it. Face beads of the outer case are introduced and shape of the upper EPS is modified to reduce the deformation resulting from the clamping load. The improved design model is analyzed and its deformation is shown to be satisfactory. A prototype is produced according to the improved design and tests are performed. Results of the clamping test of the prototype show that the plastic deformation is removed totally.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Food Science and Preservation
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• v.1 no.2
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• pp.93-98
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• 1994

Fresh ginseng was packed by using available commercial plastic films of polyvinyl chloride (PVC), cast polypropylene (CPP) and low density polyethylene (LDPE). PVC was used as a wrapping on polystyrene tray, and CPP and LDPE were applied as pouch packages. Gas composition of the package and keeping quality of ginseng in the packages were evaluated for 20 day storage at 5$^{\circ}C$. LDPE (27$\mu\textrm{m}$ thick) Package modified the Package atmosphere to 11.7% O2 and 2.1% CO2, gave low microbial growth and good sensory score after 20 day storage.

• Archives of Plastic Surgery
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• v.43 no.1
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• pp.84-87
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• 2016

Titanium micro-mesh implants are widely used in orbital wall reconstructions because they have several advantageous characteristics. However, the rough and irregular marginal spurs of the cut edges of the titanium mesh sheet impede the efficacious and minimally traumatic insertion of the implant, because these spurs may catch or hook the orbital soft tissue, skin, or conjunctiva during the insertion procedure. In order to prevent this problem, we developed an easy method of inserting a titanium micro-mesh, in which it is wrapped with the aseptic transparent plastic film that is used to pack surgical instruments or is attached to one side of the inner suture package. Fifty-four patients underwent orbital wall reconstruction using a transconjunctival or transcutaneous approach. The wrapped implant was easily inserted without catching or injuring the orbital soft tissue, skin, or conjunctiva. In most cases, the implant was inserted in one attempt. Postoperative computed tomographic scans showed excellent placement of the titanium micro-mesh and adequate anatomic reconstruction of the orbital walls. This wrapping insertion method may be useful for making the insertion of titanium micro-mesh implants in the reconstruction of orbital wall fractures easier and less traumatic.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.1
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• pp.1-6
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• 2014

Properly designed plastic packages of fresh produce can preserve the quality by maintaining the optimal modified atmosphere (MA) at optimal low temperature conditions, but cannot do so at temperature abuse conditions in retail stage due to occurrence of injurious package atmosphere coming from imbalance between respiration and package gas permeation. Master packaging system consisting of a double-layered secondary package wrapping several individual (primary) packages has been proposed and applied recently to the commodities of sweet persimmon, king oyster mushroom, chestnut and strawberry. The master (secondary) pack is designed to be stored and distributed under chilled temperature, and then dismantled when moved to the retail display from the presale chilled storage. The master packaging system taking into consideration temperature dependence of produce respiration and package gas transfer was looked into with examination of its design variables to maintain the beneficial MA. Mathematical model was provided to help the design of master packaging system creating the desired MA. Its benefits of quality preservation and its limitations in practices of fresh produce marketing were discussed. Further research direction to extend the applicability of the produce master packaging system was presented.

• Journal of the Korean Society of Food Science and Nutrition
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• v.28 no.2
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• pp.429-437
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• 1999

A mathematical model was established for estimating changes in pressure and volume of permeable kimchi packages. The model comprises the CO2 gas production from kimchi and permeation of O2, CO2 and N2 through the permeable film or sheet. Using the developed model, the effects of various packaging variables on the pressure and volume changes were analyzed for rigid and flexible packag es of kimchi(3% salt content) at 15oC, and then effect of storage temperature was also looked into. In case of rigid pack of 400g, using the plastic sheet of high CO2 permeability and initial vacuumizing can help to relieve the problem of pressure build up. The lower fill weight can further reduce the pressure, but will result in higher packaging cost. For the flexible package of 3 kg, highly permeable films such as low density polyethylene(LDPE) and polypropylene can reduce the volume expansion. Higher ratio of CO2 permeability to O2 and N2 permeabilities are effective in reducing the volume expansion. Increased surface area cannot contribute to reduction of volume expansion for highly permeable flexible packages of kimchi. For the impermeable packages, pressure and volume at over ripening stage (acidity 1.0%) increase with decreased temperature, while those at optimum ripening stage(acidity 0.6%) change little with temperature. Pressure of permeable rigid LDPE package increases with tem perature at any ripening stage, and temperature affects the volume of flexible LDPE package very slightly. Experimental verification of the present results and package design with economical consid eration are needed as a next step for practical application.

• Steel and Composite Structures
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• v.24 no.3
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• pp.339-349
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• 2017

In this paper, a conventional refined plastic hinge analysis is improved to account for the effects of local buckling and lateral-torsional buckling. The degradation of flexural strength caused by these effects is implicitly considered using practical LRFD equation. The second-order effect is captured using stability functions to minimize modeling and solution time. An incremental-iterative scheme based on the generalized displacement control method is employed to solve the nonlinear equilibrium equations. A computer program is developed to predict the second-order inelastic behavior of space steel frames. To verify the accuracy and efficiency of the proposed program, the obtained results are compared with the existing results and those generated using the commercial finite element package ABAQUS. It can be concluded that the proposed program proves to be a reliable and effective tool for daily use in engineering design.