• Proceedings of the Korean Institute of Resources Recycling Conference
• /
• 2001.05b
• /
• pp.19-22
• /
• 2001

In recent years, the creation of waste recycling society has been required to cope with the traditional ways of waste treatments. In accordance with the package recycling law in force, calls for the developments of new waste treatment techniques suitable for 21st century are growing higher. A new ash melting furnace system named Eco Burner Ash Melting Furnace System has been developed. It is a burner type ash melting system in which the fluffs made of the plastics segregated from municipal solid wastes are directly fired at high temperature in the furnace. This system provides an economical ash melting system because plastic wastes or paper scraps that have heretofore been considered hard to recycle are used in compensation for fossil fuel. In this paper, we describe the ash melting test results obtained from a substantiative facility.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2006.02a
• /
• pp.1-14
• /
• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• Laser Solutions
• /
• v.11 no.1
• /
• pp.7-11
• /
• 2008

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.1
• /
• pp.91-100
• /
• 1998

본논문에서는 현재 다 핀용 패키지로 주종을 이루고 있는 기존의 PQEP의 성능을 향상시키기 위하여 스트립 라인 배선 구조를 갖는 새로운 PQEP를 제안하였다. 기존의 208 핀 PQFP와 제안한 208핀 PQFP의 전기적 특성을 Ansoft사의 Maxwell TMA사의 Raphael 과 Avanti사의 HSPICE를 이용하여 시뮬레이션하여 비교하였다. 새로운 패키지에서는 신호 선과 파워버스라인을 스트립 구조로 만들고 감결합커패시터를 장착하여 크로스톡 잡음과 스 위칭 잡음을 크게 감소시켰다. 패키지의 리드프레임을 스트립구조로 만들기 위하여 구리가 도포된 유연성 쿠폰을 리드프레임의양측면에 부착하였다. 신호선의 특성 임피던스는 쿠폰의 유전층 두께변화를 조절함으로써 최적화하였고 유전층 두께가 100$\mu$mdlfEo 45$\Omega$의 값을 얻 었다. 시뮬레이션 결과와 측정결과 32개의 소자가 동시에 스위칭하고 전원/접지핀이 전체 리드 수의 33%일 때 동작주파수가 330Mhz됨을 확인하였으며 이는 기존 PQFP의 최대 동 작주파수인 100MHz에 비하여 3배 이상 향상됨을 보였다.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.8
• /
• pp.797-801
• /
• 2013

Today's automotive industry is evolving toward low-emissions or zero-emissions high-efficiency vehicles. Highly efficient power sources are required, as well as high strength steels for various parts to increase safety. In this study, we investigated the roll-forming process for the development of high strength, lightweight steel bumper beams. The roll-forming process was analyzed using the software package Shape-RF in combination with a rigid-plastic finite element method model. An optimal roll-forming process based on roll-pass was obtained using finite element method simulations.

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2006.11a
• /
• pp.103-107
• /
• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Proceedings of the KOR-BRONCHOESO Conference
• /
• 1981.05a
• /
• pp.8.4-8
• /
• 1981

Foreign bodies in the esophagus are frequently seen in the otolaryngologic field and there are numerous reports of them. Also the kinds of these foreign bodies are valiable and almost all things arround us are likely to be foreign bodies. Authors have recently experienced three cases of rare and interesting foreign bodies in the esophagus. Foreign bodies were removed by endoscopy and all of these were sharp square shaped hard plastic package which enclosing tablet of medicine. This is the report of clinical findings on these cases along with literature review.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.8 no.2
• /
• pp.49-59
• /
• 2002

The main function of plastic materials in food packaging is to preserve a food for safe transportation and storage. The interactions between food and plastic materials in food packaging have become increasingly important for food quality and safety because monomer, low molecular weight components, or additives of plastic packaging materials can migrate into a food. The use of antioxidants in plastic materials can help protect the degradation of film itself and retard the oxidation of a packaged food containing lipid, through the migration of antioxidant from the packaging to a product via an evaporation / sorption mechanism. Nowadays, antioxidant (BHT) impregnated plastic materials are used for commercial food packaging application with the intention of achieving an extended shelf life of food in USA. Alpha tocopherol, as one of the most important free radical scavengers, has been well known in biological systems. Moreover, the potential use of alpha tocopherol as an additive for polymers used in the packaging industry may offer the most positive perception from both consumers and manufacturers. Alpha tocopherol has been used as an antioxidant for polyolefin resins fabricated to both bottles and film and has applications in the food packaging industry as a replacement for BHT. Today, alpha tocopherol offers an attractive choice for use as an antioxidant in polymers. This paper provides an overview of antioxidant effectiveness and applications for its use by the food packaging industry based on the evaporation-sorption mechanism of a packaging model product, where quality is associated with lipid oxidation. Important analytical techniques for predicting antioxidant interaction between the package system and product are discussed.

• Journal of Sensor Science and Technology
• /
• v.8 no.1
• /
• pp.38-44
• /
• 1999

In this paper, we have constructed a self-diagnostic circuit which could detect erroneous signals in most cases that a eight-beam piezoresistive accelerometer were destroyed more than its one beam. To confirm the function of the circuit, PSPICE simulation was carried out. An IC chip was fabricated with a layout of KA 324 amplifier using a bipolar standard processing. After a package of the chip was sealed using a plastic package with 24 pins, the self-diagnostic characteristics were investigated. Then, the measured self-diagnostic characteristics of the circuit were compared with the PSPICE simulated result.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.305-308
• /
• 2006

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.