• Title/Summary/Keyword: plasma flow

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RENAL REGULATION OF UREA EXCRETION DURING UREA INFUSION IN ACUTE HEAT EXPOSED BUFFALOES

  • Chaiyabutr, N.;Buranakarl, C.;Loypetjra, P.
    • Asian-Australasian Journal of Animal Sciences
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    • v.5 no.1
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    • pp.81-90
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    • 1992
  • Five buffaloes kept in normal ambient temperature ($30^{\circ}C$) showed no significant changes in the heart rate, respiratory rate, packed cell volume, plasma constituents and renal hemodymics during intravenous infusion of urea for 4 h. The rate of urine flow, fractional urea excretion, urinary potassium excretion and osmolar clearance significantly decreased while the renal urea reabsorption markedly increased during urea infusion. The decrease of fractional potassium excretion was concomitant with the reduction of the rate of urine flow and urine pH. In animals exposed to heat ($40^{\circ}C$) the rectal temperature heart rate and respiratory rate significantly increased while no significant changes in GFR and ERPF were observed. An intravenous infusion of urea in heat exposed animals caused the reduction of the rate of urine flow with no changes in renal urea reabsorption, urine pH and fractional electrolyte excretions. During heat exposure, there were marked increases in concentrations of total plasma protein and plasma creatinine whereas plasma inorganic phosphorus concentration significantly decreased. It is concluded that an increase in renal urea reabsorption during urea infusion in buffaloes kept in normal ambient temperature depends on the rate of urine flow which affect by an osmotic diuretic effect of electrolytes. The limitation of renal urea reabsorption in heat stressed animals would be attributed to an increases in either plasma pool size of nitrogenous substance or body metabolism.

Thin Film Characterization on Refractive Index of PECVD SiO2 Thin Films

  • Woo Hyuck Kong;In Cheon Yoon;Seung Jae Lee;Yun Jeong Choi;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.35-39
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    • 2023
  • Silicon oxide thin films have been deposited by plasma-enhanced chemical vapor deposition in SiH4 and N2O plasma along the variation of the gas flow ratio. Optical emission spectroscopy was employed to monitor the plasma and ellipsometry was employed to obtain refractive index of the deposited thin film. The atomic ratio of Si, O, and N in the film was obtained using XPS depth profiling. Fourier Transform Infrared Spectroscopy was used to analyze structures of the films. RI decreased with the increase in N2O/SiH4 gas flow ratio. We noticed the increase in the Si-O-Si bond angles as the N2O/SiH4 gas flow ratio increased, according to the analysis of the Si-O-Si stretching peak between 950 and 1,150 cm-1 in the wavenumber. We observed a correlation between the optical emission intensity ratio of (ISi+ISiH)/IO. The OES intensity ratio is also related with the measured refractive index and chemical composition ratio of the deposited thin film. Therefore, we report the added value of OES data analysis from the plasma related to the thin film characteristics in the PECVD process.

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Lifetime Prolongation of Poly (dimethylsiloxane) Surface Modification via 2-Hydroxyethyl Methacrylate Grafting for Electroosmotic Flow

  • Park, Eun-Soo;Yang, Sang-Sik
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.4
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    • pp.142-144
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    • 2004
  • To use Poly-dimethylsiloxane (PDMS) for the electrokinetic flow channel, the PDMS surface must be modified to be hydrophilic. With $O_2$ plasma treatment, it is difficult to maintain hydrophilicity for more than one day. In this paper, we present the chemical modification of the PDMS surface using 2-Hydroxyethyl methacrylate (HEMA) to prolong hydrophilicity lifetime. The oxide radicals generated temporarily on the PDMS surface by $O_2$ plasma are grafted with HEMA. Once the PDMS samples have been grafted, they demonstrate improved hydrophilicity retainment and electroosmotic flow characteristics compared to the untreated PDMS and the oxidized PDMS following the $O_2$ plasma process. This phenomenon was verified by the contact angles, Fourier transform infrared (FTIR) spectra and electro osmotic flow rates observed for more than 300 hours.

A Study of Atmospheric-pressure Dielectric Barrier Discharge (DBD) Volume Plasma Jet Generation According to the Flow Rate (유량에 따른 대기압 유전체 전위장벽방전(DBD) 플라즈마 젯 발생에 관한 연구)

  • Byeong-Ho Jeong
    • Journal of Industrial Convergence
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    • v.21 no.7
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    • pp.83-92
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    • 2023
  • The bullet shape of the plasma jet using the atmospheric-pressure dielectric barrier discharge method changes depending on the applied fluid rate and the intensity of the electric field. This changes appear as a difference in spectral distribution due to a difference in density of the DBD plasma jet. It is an important factor in utilizing the plasma device that difference between the occurrence of active species and the intensity through the analysis of the spectrum of the generated plasma jet. In this paper, a plasma jet generator of the atmospheric pressure volume DBD method using Ar gas was make a prototype in accordance with the proposed design method. The characteristics jet fluid rate analysis of Ar gas was accomplished through simulation to determine the dependence of flow rate for the generation of plasma jets, and the characteristics of plasma jets using spectrometers were analyzed in the prototype system to generate optimal plasma jet bullet shapes through MFC flow control. Through the design method of the proposed system, the method of establishing the optimal plasma jet characteristics in the device and the results of active species on the EOS were verified.

Effects of Nozzle Locations on the Rarefied Gas Flows and Al Etch Rate in a Plasma Etcher (플라즈마 식각장치내 노즐의 위치에 따른 희박기체유동 및 알루미늄 식각률의 변화에 관한 연구)

  • 황영규;허중식
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.10
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    • pp.1406-1418
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    • 2002
  • The direct simulation Monte Carlo(DSMC) method is employed to calculate the etch rate on Al wafer. The etchant is assumed to be Cl$_2$. The etching process of an Al wafer in a helicon plasma etcher is examined by simulating molecular collisions of reactant and product. The flow field inside a plasma etch reactor is also simulated by the DSMC method fur a chlorine feed gas flow. The surface reaction on the Al wafer is simply modelled by one-step reaction: 3C1$_2$+2Allongrightarrow1 2AIC1$_3$. The gas flow inside the reactor is compared for six different nozzle locations. It is found that the flow field inside the reactor is affected by the nozzle locations. The Cl$_2$ number density on the wafer decreases as the nozzle location moves toward the side of the reactor. Also, the present numerical results show that the nozzle location 1, which is at the top of the reactor chamber, produces a higher etch rate.

Decomposition Characterist of Toluene Using a Glidarc Water-jet Plasma (Glidarc 워터젯 플라즈마를 이용한 톨루엔 분해 특성)

  • Kim, Seong-Cheon;Chun, Young-Nam
    • Journal of Korean Society for Atmospheric Environment
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    • v.24 no.3
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    • pp.329-335
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    • 2008
  • Volatile organic compounds emitted to the atmosphere can cause adverse effects on human health and participate in photochemical smog formation reactions. The destruction of a series of VOCs has been carried out by non-thermal plasma in other researches. And the characteristic of non-thermal plasma was operated at atmospheric pressure and low temperature. A new type non-thermal plasma reactor was investigated combined Glidarc plasma with water jet in this research. Also, it was found that the water-jet had an significant effect on the toluene removal efficiency. But too much water content does not favor toluene decomposition by decreasing of reaction temperature. The input toluene concentration, gas flow rate, water flow rate and specific energy input were used as experiment variables. The toluene removal efficiency, energy efficiency and specific energy input were 75.3%, 146.6 g/kWh and $1.12kWh/m^3$ at a water flow rate of 100 mL/min.

Electrical Characteristics of Carbon Nanotubes by Plasma and Microwave Surface Treatments

  • Cho, Sang-Jin;Shrestha, Shankar Prasad;Lee, Soon-Bo;Boo, Jin-Hyo
    • Bulletin of the Korean Chemical Society
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    • v.35 no.3
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    • pp.905-907
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    • 2014
  • The plasma and microwave surface treatments of carbon nanotubes that loaded on plastic substrates were carried out with expecting a change of carbon nanotube dispersion by increasing treatment time. The microwave treatment process was undergone by commercial microwave oven (800 W). The electrical property was measured by hall measurement and resistance was increased by increasing $O_2$ flow rate of plasma, suggesting an improvement of carbon nanotube dispersion and a possibility of controlling the resistances of carbon nanotubes by plasma surface treatment. The resistance was increased in both polyethylene terephthalate and polyimide substrates by increasing $O_2$ flow rate. Resistance changes only slightly with different $O_2$ flow treatment in measure rho for all polyimide samples. Sheet resistance is lowest in polyimide substrate not due to high carbon nanotube loading but due to tendency to remain in elongated structure. $O_2$ or $N_2$ plasma treatments on both polyethylene terephthalate and polyimide substrates lead to increase in sheet resistance.

Fundamental Experiments of Drag Reduction for a High Speed Vehicle Using Plasma Counterflow Jets (플라즈마 분사장치를 활용한 초고속 비행체의 항력감소 기초 실험)

  • Kang, Seungwon;Choi, Jongin;Lee, Jaecheong;Huh, Hwanil
    • Journal of the Korean Society of Propulsion Engineers
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    • v.21 no.6
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    • pp.57-63
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    • 2017
  • In this study, the fundamental test for drag reduction is carried out by using a plasma generator. Fundamental test setup is constructed of visualization and drag measurement system. The schlieren technique is used to visualize the plasma counterflow in supersonic flow. The penetration of the plasma jet and the change of the flow structure are observed through visualization results. Load cell is used to confirm possibility of drag reduction. Results show that drag was reduced by 6.2% using plasma jet in supersonic flow.

Effect of the Plasma-assisted Patterning of the Organic Layers on the Performance of Organic Light-emitting Diodes

  • Hong, Yong-Taek;Yang, Ji-Hoon;Kwak, Jeong-Hun;Lee, Chang-Hee
    • Journal of Information Display
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    • v.10 no.3
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    • pp.111-116
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    • 2009
  • In this paper, a plasma-assisted patterning method for the organic layers of organic light-emitting diodes (OLEDs) and its effect on the OLED performances are reported. Oxygen plasma was used to etch the organic layers, using the top electrode consisting of lithium fluoride and aluminum as an etching mask. Although the current flow at low voltages increased for the etched OLEDs, there was no significant degradation of the OLED efficiency and lifetime in comparison with the conventional OLEDs. Therefore, this method can be used to reduce the ohmic voltage drop along the common top electrodes by connecting the top electrode with highly conductive bus lines after the common organic layers on the bus lines are etched by plasma. To further analyze the current increase at low voltages, the plasma patterning effect on the OLED performance was investigated by changing the device sizes, especially in one direction, and by changing the etching depth in the vertical direction of the device. It was found that the current flow increase at low voltages was not proportional to the device sizes, indicating that the current flow increase does not come from the leakage current along the etched sides. In the etching depth experiment, the current flow at low voltages did not increase when the etching process was stopped in the middle of the hole transport layer. This means that the current flow increase at low voltages is closely related to the modification of the hole injection layer, and thus, to the modification of the interface between the hole injection layer and the bottom electrode.

Numerical Simulation: Effects of Gas Flow and Heat Transfer on Polymer Deposition in a Plasma Dry Etcher

  • Joo, Junghoon
    • Applied Science and Convergence Technology
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    • v.26 no.6
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    • pp.184-188
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    • 2017
  • Polymer deposition pattern on the ceramic lid surface is analyzed by numerical modeling. Assumption was made that is affected by gas flow pattern from the horizontal and vertical nozzles, temperature profile from the finger-like branches made of graphite and electrostatic potential effect. Calculated results showed gas flow dynamics is less relevant than two others. Temperature and electrostatic effects are likely determining the polymer deposition pattern based on our numerical simulation results.