• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.585-589
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• 2008

This study is performed to analyze the fluid flow about 150mm shower heads of semiconductor device. Under the air pressure, the ideal gas of moving fluid is injected as 5m/s velocity into inlet of shower heads and the flow distribution in shower heads is measured according to pitch of plasma distribution device. As results, the maximum and minimum value of fluid velocity are investigated with their position. The velocity values at outlet are also studied. From two experiment using the plasma distribution device, the results of CFD are compared with the experimental results. That results shows stable flow of fluid in that case of corrected design from CFD.

• 반도체디스플레이기술학회지
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• 제15권3호
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• 전기학회논문지
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• 제56권12호
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• pp.2179-2183
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• 2007

In this paper, to produce sheet plasma with high density for ion plating, we designed magnetic circuit of ion plating device consisting of solenoid coil and rectangular permanent magnet. And, we analyzed the effects of the magnetic field distribution using FEM (Finite Element Methode). Additionally, we made a sputtering system including ion plating technique on the basis of the design and verified the possibility of the sheet plasma application for advanced sputter system.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.98-99
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• 2012

Deposition of thin films using magnetron sputtering plasmas is a well-developed, classical technology. However, detailed investigations using advanced diagnostics are insufficient in magnetron sputtering, in comparison with plasma-aided dry etching and plasma-enhanced chemical vapor deposition. In this talk, we will show examples of diagnostic works on magnetron sputtering employing metal targets. Diagnostic methods which have fine spatial resolutions are suitable for magnetron sputtering plasmas since they have significant spatial distributions. We are using two-dimensional laser-induced fluorescence spectroscopy, in which the plasma space is illuminated by a tunable laser beam with a planer shape. A charge-coupled device camera with a gated image intensifier is used for taking the picture of the image of laser-induced fluorescence formed on the planer laser beam. The picture of laser-induced fluorescence directly represents the two-dimensional distribution of the atom density probed by the tunable laser beam, when an intense laser with a relatively wide line-width is used. When a weak laser beam with a relatively narrow linewidth is used, the laser-induced fluorescence represents the density distribution of atoms which feel the laser wavelength to be resonant via the Doppler shift corresponding to their velocities. In this case, we can obtain the velocity distribution function of atoms by scanning the wavelength of the laser beam around the line center.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1361-1366
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• 2009

This study is to see the internal flow for the plasma cutting fume collector. Plasma cutters are widely used in the canning industry and Fume cause the device because it will affect the performance of the design of dust collector. Therefore, to determine the distribution of the internal flow using CFD and Solver was used for calculated with commercial CFD code STAR-CCM+. The results show that design of chamber was incorrect after passed the filter for exhaust to the fan. And the location of the duct to the influx of dust collector and the design was incorrect. In addition, an array of filter was also inappropriate. As a result, present fume collector need to improvement.

• 산업융합연구
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• 제21권7호
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• pp.83-92
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• 2023

유전체 전위장벽방전방식에 의한 플라즈마 젯의 블렛 형상은 인가되는 유량과 전기장의 크기에 따라 달라지고 이러한 변화는 DBD 플라즈마 젯의 밀도차이에 의한 스펙트럼 분포의 차이로 나타난다. 발생된 플라즈마 젯의 스펙트럼의 분석을 통한 활성종의 발생과 강도의 차이는 장치를 활용하는데 있어서 중요한 요소이다. 본 논문에서는 Ar가스를 이용한 대기압 볼륨 DBD방식의 플라즈마 젯 발생장치를 제안된 설계방법에 따라 구성하였다. 플라즈마 젯의 발생을 위한 유량의 의존도를 규명하기 위한 Ar가스의 유동해석을 시뮬레이션을 통해 확인하였고 프로토타입 시스템에서는 MFC를 통한 유량제어를 통해 최적의 플라즈마 젯 불렛형상을 발생시키고 발생된 플라즈마 젯의 특성을 분석하기 위해 스펙트로미터를 이용한 플라즈마 젯의 특성을 분석하였다. 제안된 시스템의 설계방법을 통한 장치에서 최적의 플라즈마 젯 형상 확립방법과 EOS 상에서 활성종에 대한 결과를 확인하였다.

• 한국표면공학회지
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• 제29권5호
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• pp.338-344
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• 1996

This study was an investigation of plasma-induced damages on silicon substrate in the semiconductor manufacturing technology. The plasma-induced damage level on silicon substrate was analyzed and compared in various plasma etching systems. The analysis methods were therma wave, life-time recovery, SCA (Surface Charge Analyzer) and TRXF (Total Reflection X-ray Fluorescence) measurements, and the measured values were compared for each systems. In the comparison of the values which were obtained by a system that had low life-time recovery, there was not any differences in DC parameters. However, the reflesh time distribution of device of that system had decreased about 10 to 20m sec compared to a system which had high life-time recovery.

• 한국분말재료학회지
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• 제27권4호
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• pp.333-338
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• 2020

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu₃P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/㎠. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

• 한국진공학회지
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• 제21권3호
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• pp.121-129
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• 2012

진공을 기초로 한 극판 전력이 인가된 유도 결합 플라즈마 소스에 관한 대부분의 연구는 자기 바이어스 효과에만 한정되어 있으며, 다양한 반도체 및 디스플레이 식각 공정에서 공정 결과와 소자 품질에 결정적인 역할을 하는 플라즈마 변수들(전자 온도, 플라즈마 밀도)과 극판 전력의 상관관계에 대한 연구는 거의 없는 실정이다. 본 연구에서는 극판 전력이 플라즈마 변수에 미치는 영향에 관한 내용을 다루고 있으며, 최근의 연구 결과에 대한 리뷰를 포함하고 있다. 플라즈마 밀도는 극판 전력 인가에 의하여 감소 또는 증가하였으며, Fluid global model에 의한 결과와 잘 일치하는 경향을 보였다. 전자 온도는 RF 바이어스에 의하여 증가하였으며, 전자 에너지 분포 측정을 통하여 전자 가열 메커니즘을 관찰하였다. 또한, 플라즈마 밀도의 공간 분포는 극판 전력에 의하여 더욱 균일해짐을 알 수 있었다. 이러한 극판 전력과 플라즈마 변수들의 상관관계와 전자 가열 메커니즘에 대한 연구는 방전 특성의 물리적 이해뿐만 아니라, 반도체 식각 공정에서 소자 품질 및 공정 개선을 위한 최적의 방전조건 도출과 외부 변수 제어에 큰 도움을 주리라 예상된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.957-960
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• 2008

The influences of silicon and MgO seed particle on the reconstruction characteristics of MgO protective layer were investigated to clarify the mechanism of reconstruction and exaggerated grain growth (EGG) in AC-PDP. The reconstruction and EGG are closely correlated with the driving force for nucleation and growth, interface energy and initial size distribution of MgO protective layer in plasma space during discharge in AC-PDP.