• KSCE Journal of Civil and Environmental Engineering Research
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• v.9 no.4
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• pp.125-133
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• 1989

For convergent photos, which are now widely adopted for terrestrial facility survey, a number of experimental studies and theoretical studies on the developments of accuracy predictional model according to the convergent angle change have been accomplished. And such studies are basically depend on the symmetrical geometric configuration at the normal direction to the center of the object. However, in may cases of facility survey such as building facades, bridges, dam surfaces, relatively flat topography, etc., the object features are almost like planar, and frequently the surroundings do not allow the photo station at normal direction, and the sufficient convergent angle can be hardly achieved. Considering those points, in this study, the accuracy analysis on three dimensional coordinates according to the variations of photo direction and of convergent angle to the planar object were attempted, and the optimum geometric configurations at the normal, side-looking, and the most side-looking direction were investigated. The result through this study show that from normal direction to the side-looking direction angle ${\tau}=30^{\circ}$, the larger the convergent angle, the higher the accuracy, and in case that right photo is at the most side-looking direction, the better accuracy can be achieved according to the convergent angle increase up to $60^{\circ}$.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.12 no.1
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• pp.1-13
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• 1994

The terrestrial phetogrammetry has the relative convenience of selecting the site of photo station in contrast with the aerial photogrammetry, and the flexibility in accuracy prediction of object point positioning. So it has the advantage in designing optimum photo taking system which can fulfill the required accuracy. For the convergent photos which are frequently used for the monitoring of cultural assets and ground facilities, almost all of the traditional studies for the optimum photo condition, both in theoretical or experimental, are basically depend on the symmetrical configuration at the normal direction to the center of the object. However, in many cases the surroundings of the object do not allow the normal photo direction or sufficient convergent angle, even more the object features are not always be seen as one panel like planar. In this paper, the accuracy variation of convergent photos for the multi-planar objects, which are composed by some orthogonal planes, are investigated to establish the optimum photo condition. The results of the accuracy analysis for the photo direction, convergent angle, as well as the object feature are expected to be utilized in system design of geometric configuration of convergent photos, which are adequate for the accurate monitoring of the objects, such as culural assets, facilities, precision instruments, deformation surveying, etc.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.10
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• pp.1910-1924
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• 1994

Curved 3D objects represented by range data contain large amounts of information compared with planar objects, but do not have distinct features for matching to those of object models. This makes it difficult to represent and identify a general 3D curved object. This paper introduces a new view-point independent approach to recognizing general 3D curved objects using range data. Our approach makes use of the relative geometric differences between particular points on the object surface and some model points. The model points are prespecified arbitrarily and keeping the task in mind so that the following task can be easily described using the model points. Our approach has several advantages. Since model points are specified arbitrarily and task dependently, further processing can be reduced in application by locating the model points at places which are useful for further operations in the task. The knowledge base is simple with less storage requirement. And, it is easy to compensate the uncertainties of positions estimation caused by noise and quantization error.

• KIPS Transactions on Software and Data Engineering
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• v.3 no.8
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• pp.309-314
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• 2014

To generate a complete 3D model from depth images of multiple RGB-D cameras, it is necessary to find 3D transformations between RGB-D cameras. This paper proposes a convenient view calibration technique using a spherical object. Conventional view calibration methods use either planar checkerboards or 3D objects with coded-pattern. In these conventional methods, detection and matching of pattern features and codes takes a significant time. In this paper, we propose a convenient view calibration method using both 3D depth and 2D texture images of a spherical object simultaneously. First, while moving the spherical object freely in the modeling space, depth and texture images of the object are acquired from all RGB-D camera simultaneously. Then, the external parameters of each RGB-D camera is calibrated so that the coordinates of the sphere center coincide in the world coordinate system.

• Korean Journal of Materials Research
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• v.13 no.10
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• pp.635-639
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• 2003

We investigated dry etching of GaAs and AiGaAs in a high density planar inductively coupled plasma system with BCl$_3$and BCl$_3$/Ar gas chemistry. A detailed etch process study of GaAs and ALGaAs was peformed as functions of ICP source power, RIE chuck power and mixing ratio of $BCl_3$ and Ar. Chamber process pressure was fixed at 7.5 mTorr in this study. The ICP source power and RIE chuck power were varied from 0 to 500 W and from 0 to 150 W, respectively. GaAs etch rate increased with the increase of ICP source power and RIE chuck power. It was also found that etch rates of GaAs in $15BCi_3$/5Ar plasmas were relatively high with applied RIE chuck power compared to pure 20 sccm $BCl_3$plasmas. The result was the same as AlGaAs. We expect that high ion-assisted effect in $BCl_3$/Ar plasma increased etch rates of both materials. The GaAs and AlGaAs features etched at 20 sccm $BCl_3$and $15BCl_3$/5Ar with 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr showed very smooth surfaces(RMS roughness < 2 nm) and excellent sidewall. XPS study on the surfaces of processed GaAs also proved extremely clean surfaces of the materials after dry etching.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.31-36
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• 2003

We investigated dry etching of GaAs and AlGaAs in a high density planar inductively coupled plasma system with $BCl_3$ and $BCl_3/Ar$ gas chemistry. A detailed process study as a function of ICP source power, RIE chuck power and $BCl_3/Ar$ mixing ratio was performed. At this time, chamber pressure was fixed at 7.5 mTorr. The ICP source power and RIE chuck power were varied from 0 to 500 W and from 0 to 150 W, respectively. GaAs etch rate increased with the increase of ICP source power and RE chuck power. It was also found that etch rate of GaAs in $BCl_3$ gas with 25% Ar addition was superior to that of GaAs in a pure $BCl_3$ (20 sccm $BCl_3$) plasma. The result was same with AlGaAs. We expect that high ion-assisted effect in $BCl_3$/Ar plasma increased etch rates of both materials. The GaAs and AIGaAs features etched at 20 sccm $BCl_3$ and $15BCl_3/5Ar$ with 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr showed very smooth surfaces(RMS roughness < 2 nm) and excellent sidewall. XPS study on the surfaces of processed GaAs also proved extremely clean surfaces of the materials after dry etching.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.490-490
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• 2011

Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

• Bulletin of the Korean Chemical Society
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• v.29 no.9
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• pp.1711-1716
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• 2008

The reaction of copper(II) chloride with phenyl-N-[(pyridine-2-yl)methylene]methaneamide (ppmma) leads to a new $\mu$ -chloro bridged dimeric [Cu(ppmma)$Cl_2$]$_2$ complex, whereas a reaction of copper(II) bromide with ppmma affords a monomeric Cu(ppmma)$Br_2$ complex. Both complexes have been characterized by X-ray crystallography and electronic absorption spectroscopy. The crystal structural analysis of [Cu(ppmma)$Cl_2$]$_2$ shows that the two Cu(II) atoms are bridged by two chloride ligands, forming a dimeric copper(II) complex and the copper ion has a distorted square-pyramidal geometry ($\tau$ = 0.2). The dimer units are held through a strong intermolecular $\pi-\pi$ interactions between the nearest benzyl rings. On the other hand, Cu(ppmma)Br2 displayed a distorted square planar geometry with two types of strong intermolecular π-π interaction. EPR spectrum of [Cu(ppmma)$Cl_2$]$_2$ in frozen glas s at 77 K revealed an equilibrium between the mononuclear and binuclear species. The magnetic susceptibilities data of [Cu(ppmma)$Cl_2$]$_2$ and Cu(ppmma)$Br_2$ follow the Curie-Weiss law. No significant intermolecular magnetic interactions were examined in both complexes, and magnetic exchange interactions are discussed on the basis of the structural features.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.49 no.4
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• pp.23-35
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• 2012

This paper presents a 3-D pose (position and orientation) estimation method for an elliptic object in 3-D space. It is difficult to resolve the problem of determining 3-D pose parameters with respect to an elliptic feature in 3-D space by interpretation of its projected feature onto an image plane. As an alternative, we propose a two points-based pose estimation algorithm to seek the 3-D information of an elliptic feature. The proposed algorithm determines a homogeneous transformation uniquely for a given correspondence set of an ellipse and two coplanar points that are defined on model and image plane, respectively. For each plane, two triangular features are extracted from an ellipse and two points based on the polarity in 2-D projection space. A planar homography is first estimated by the triangular feature correspondences, then decomposed into 3-D pose parameters. The proposed method is evaluated through a series of experiments for analyzing the errors of 3-D pose estimation and the sensitivity with respect to point locations.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.408-413
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• 2004

Numerical and experimental investigation were car-ried out to clarify the flow structure of underexpanded jet from a square nozzle. The square nozzle rep-resents one of the clustered combustors of a linear aerospike engine. From the numerical results, the three-dimensional shock wave of the underexpanded square jet was found to be composed of two shocks. One is the intercepting shock which corresponds to the shock observed in two-dimensional planar jet. The other is the recompression shock divided into two types. The expansion fans coming from the nozzle edges interact with each other at the comers of the nozzle exit, and overexpanded regions are generated. Therefore one of the two recompression shocks is formed at the comers of the nozzle exit behind the overexpanded regions. As the jet goes downstream, the overexpanded regions grow larger to coalesce at the symmetry planes. Then, the other type of the recompression shock is generated. The three-dimensional shock structure formed by the intercepting shock and the recompression shocks dominates the expansion of the jet boundary. The shock detection algorithm us-ing CFD results was developed to reveal the relation between the shock waves and the jet boundary, and it was found that the cross-sectional jet shape becomes cross-shape. The key features observed in the numerical investigation were verified by the experimental results. The shock structure at the diagonal plane was in good agreement with the experimental schlieren images. Moreover, the cross-sections visualized by the Mie scattering method confirmed that the cross-section of the jet becomes cross-shape.