• Title/Summary/Keyword: pinholes

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Application of Neural Inverse Modeling Scheme to Optimal Parameter Tuning of Filter Test Equipment

  • Kim, Sung-Ho;Han, Yun-Jong;Bae, Geum-Dong
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.4 no.2
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    • pp.172-175
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    • 2004
  • Generally, the yield rate of semiconductors is the major factor that affects directly the price of semiconductors. For a high yield rate of semiconductors, the air inside clean room is needed to be purified and high efficient filters are used for this. The filter are made of super-fine fiber and certain pinholes can be easily produced on the filter's surface by inadvertent manufacturing. As these pinholes are not easily detected with the bare sight, these pinholes exert a negative impact to filtration performance of the filter. In this research, not only the automatic test equipment for detecting pinholes is proposed, but also inverse modeling scheme based on artificial neural network is applied for tuning of its important parameters.

Degradation of Membrane With Pinholes in PEMFC (고분자 전해질 연료전지에서 Pinhole 있는 막의 열화)

  • Kim, Tae-Hee;Lee, Ho;Lim, Tae-Won;Park, Kwon-Pil
    • Transactions of the Korean hydrogen and new energy society
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    • v.19 no.2
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    • pp.103-110
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    • 2008
  • The most failure mode of PEM fuel cell is gas crossover caused by pinhole formation in MEAs. The degradation phenomena of MEA with pinholes were evaluated in various accelerated operation condition, such as OCV, low humidity and high partial pressure of oxygen. The performances of MEA with pinholes were almost same before and after normal 144 hours operation($70^{\circ}C$, $640mA/cm^2$, 65%RH $H_2/air$). The results of accelerated operation showed that OCV and low humidity condition more deteriorated MEA than gas crossover owing to pinholes. When oxygen was used as cathode gas, the pinholes of MEA were enlarged due to heat of combustion reaction on Pt catalyst of electrodes. This combustion reaction occurred at pinholes near gas inlet and resulted in local MEA failure.

FPGA based System for Pinhole Detection in Cold Rolled Steel (FPGA 기반의 냉연강판 핀홀 검출 시스템)

  • Ha, Sung-Kil;Lee, Jung Eun;Moon, Woo Sung;Baek, Kwang Ryul
    • Journal of Institute of Control, Robotics and Systems
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    • v.21 no.8
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    • pp.742-747
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    • 2015
  • The quality of steel plate products is determined by the number of defects and the process problems are estimated by shapes of defects. Therefore pinholes defects of cold rolled steel have to be controlled. In order to improve productivity and quality of products, within each production process, the product is inspected by an adequate inspection system individually in the lines of steelworks. Among a number of inspection systems, we focus on the pinholes detection system. In this paper, we propose an embedded system using FPGA which can detect pinholes defects. The proposed system is smaller and more flexible than a traditional system based on expensive frame grabbers and PC. In order to detect consecutive defects, FPGAs acquire two dimensional image and process the image in real time by using correlation of lines. The proposed pinholes detection algorithm decreases arithmetic operations of image processing and also we designed the hardware to shorten the data path between logics due to decreasing propagation delay. The experimental results show that the proposed embedded system detects the reliable number of pinholes in real time.

Micro-pinholes in Composite Cobalt Nickel Silicides (코발트 니켈 합금 구조에서 생성된 실리사이드의 마이크로 핀홀의 발생)

  • Song, Oh-Sung;Kim, Sang-Yeob;Jeon, Jang-Bae;Kim, M.J.
    • Korean Journal of Materials Research
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    • v.16 no.10
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    • pp.656-662
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    • 2006
  • We fabricated thermal evaporated 10 nm-$Ni_xCo_{1-x}$ (x=0.2, 0.5 and 0.8) /(poly)Si films to form nanothick cobalt nickel composite silicides by a rapid thermal annealing at $700{\sim}1100^{\circ}C$ for 40 seconds. A field emission scanning electron microscope and a micro-Raman spectrometer were employed for microstructure and silicon residual stress characterization, respectively. We observed self-aligned micro-pinholes on single crystal silicon substrates silicidized at $1100^{\circ}C$. Raman silicon peak shift indicates that the residual tensile strain of $10^{-3}$ in single crystal silicon substrates existed after the silicide process. We propose thermal stress from silicide exothermic reaction and high temperature silicidation annealing may cause the pinholes. Those pinholes are expected to be avoided by lowering the silicidation temperature. Our results imply that we may use our newly proposed composite silicides to induce the appropriate strained layer in silicion substrates.

Automatic Visual Inspection System Development for Tarpaulin's Pinholes Defect Detection (다포린 원단의 함침 자동 검출 시스템 개발)

  • O, Chun-Seok;Lee, Hyeon-Min
    • The Transactions of the Korea Information Processing Society
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    • v.7 no.6
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    • pp.1973-1979
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    • 2000
  • Driving the need for machine vision system is growing consumer demand for quality and defect-free products. Especially it is the most important in tarpaulin's manufacturing process achieves automatically by machine vision instead of by man vision. In this paper pinholes detection is performed by using morphology algorithms. Top hat transform is one of morphology applications. This transform take high performance of defect detection in the case that unexpected changes occur in some non-uniform background. For pinholes defect, automatic visual inspection system has been developed, which was composed by a line-scan camera, illumination, a frame grabber, a motor driver and control units. This system has excellent capacity to defect pinholes to the 0.1 mm by 0.5 mm in size and to work in moving objects by maximum 20 m/min in speed.

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Si-buffer pinholes in the SEPOX (selective poly oxidation) process (SEPOX (selective poly oxidation) process에서 Si-buffer layer에 발생하는 pinhole 현상에 대한 연구)

  • 윤영섭
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.6
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    • pp.151-157
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    • 1996
  • We propose a mechanism for the formation of pinholes in the Si-buffer layer, through the observations with varying the process- and structure variables in the SEPOX (selective poly-oxidation) process, an isolation method for sub-u DRAMs. Pinholes are formed through the accumulation of Si vacancies generated by the oxidation of Si, in which Si atoms leave the sites (vacancies) at the Si/SiO$_{2}$ interfaces and diffuse into the oxide to be oxidized near interface. In the course of the accumulation of Si-vacancies, the stress induced in the Si-buffer layer affects the migration of vacancies to result in the final size and distribution of pinholes. This paper may be, to our knowledge, the first report about the oxidation-induced pinhole in the Si/SiO$_{2}$ system.

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The Effect of Pinholes on Magnetic Behaviour of Antiferromagnetically Coupled Ni-Fe/Cu Mulitlayers

  • Stobiecki, F;Lucinski, T;Dubowik, J;Szymanski, B;Urbaniak, M;Castano, F.J;Stobiecki, T
    • Journal of Magnetics
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    • v.3 no.3
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    • pp.89-91
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    • 1998
  • The magnetisation behaviour of polycrystalline permalloy/copper multilayers with mixed antiferromagnetic/ferromagnetic coupling was investigated as function of temperature. The results are discussed in a framework of a realistic model of anitferromagnetically coupled layers connected by ferromagnetic pinholes. A microstructure of pinholes (their density and dimensions) was varied either by a proper annealing treatment or by choosing samples with various Cu spacer thicknesses. It was demonstrated that the temperature changes of the net magnetic moment measured in a magnetic field smaller than the saturation field was strongly affected by the composition of the pinholes, their density, cross-sectional area and their lengths.

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A Study on the Surface Pre-treatment of Palladium Alloy Hydrogen Membrane (팔라듐 합금 수소 분리막의 전처리에 관한 연구)

  • Park, Dong-Gun;Kim, Hyung-Ju;Kim, Hyo Jin;Kim, Dong-Won
    • Journal of the Korean institute of surface engineering
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    • v.45 no.6
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    • pp.248-256
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    • 2012
  • A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

Influence of Surface Tension on Pinhole Phenomenon of Earthen Ware Glazes (도기유의 표면장력이 Pinhole 현상에 미치는 영향)

  • 지응업;이경재
    • Journal of the Korean Ceramic Society
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    • v.13 no.3
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    • pp.3-12
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    • 1976
  • The corelation between surface tensions and surface appearances of SK O5a opaque glazes for earthen wares were investigated. The surface tension values were theoretically calculated by using Dietzel's factors of constituent oxides of glaze. The surface appearances of glazes, especially the pinhole phenomena were strongly effected by the surface tension values showing the following general tendencies: (1) In the range of 305±3 dynes/cm of surface tensions, glazes showed almost no pjnholes. (2) In the range of surface tensions less than 300 dynes/cm, the large numbers of small pinholes or eggshell textures were observed. (3) In the range of surface tensions higher than 310 dynes/cm, large and deep pinholes were observed. (4) The contact angles of glazes on the wall tile body substrate are in the good proportional agreement with the surface tension values calculated by Dietzel's factors.

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AN EXPERIMENTAL STUDY ON PIN RETENTION OF THE DENTAL CEMENTS (치과용(齒科用) Cement가 Pin Retention에 미치는 영향(影響)에 관(關)한 실험적(實驗的) 연구(硏究))

  • Kim, Sung-Kan
    • The Journal of Korean Academy of Prosthodontics
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    • v.13 no.1
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    • pp.23-26
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    • 1975
  • The purpose of this study was to measure the retentive force of various kinds of dental cement. Cross-cutting the half of the occlusal surface, pinholes were prepared on the dentin with No. 557 carbide bur. No. 557 steel burs were cemented in the pinholes and retentive force was measured by removing the burs with Instron testing machine. The Instron testing machine was operated at a rate of 0.2 cm per minute. The following results were obtained : 1. The retentive force of zinc phosphate cement(A), reinforced zinc oxide and eugenol cement and polycarboxylate cement were similar to each other, but that of zinc phosphate cement (A) was the highest of all. 2. The retentive force of zinc phosphate cement (B) was the lowest of all.

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