• Journal of Welding and Joining
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• v.35 no.1
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• pp.34-42
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• 2017

This paper presents a comparative study of the AC and MFDC resistance spot welding process with consideration of sheet thickness. The previous studies have confirmed that there is difference in the optimum welding current and expulsion current with AC and MFDC. The aim of this study was revealing the effect of sheet thickness on weldable current range and expulsion behavior for AC and MFDC welding processes. The optimum welding current of AC was lower (1.6 kA) than MFDC welding process in 0.8 mm sheet thickness. Early nugget growth being caused by the peak current of AC developed weld interface deformation, which resulted in suppressing the growth of corona bond and occurrence of low current expulsion. The resistance spot welding for thicker sheet (1.4 mm) required lower current of 0.6 kA for the expulsion on the MFDC welding process. The growth of contact diameter (size of corona bond) and button diameter was linear up to the expulsion current with MFDC welding process. Therefore, more attention is required when the AC and MFDC resistance spot welding process is applied for different thickness of steel sheet combination for automotive application.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of Welding and Joining
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• v.26 no.6
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• pp.81-91
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• 2008

The weldability of resistance spot welding of TRIP1180 steels for automobile components investigated enhance in order to achieve understanding of weld fracture during tensile-shear strength (TSS) test. The main failure modes for spot welds of TRIP1180 steels were nugget pullout and interfacial fracture. The peak load to cause a weld interfacial failure was found to be related to fracture toughness of the weld and the weld diameter. Although interfacial fracture occurred in the spot welded samples, the load-carrying capacity of the weld was high and not significantly affected by the fracture mode. Substantial part of the weld exhibits the characteristic dimple (or elongated dimple) fractures on interfacial fractured surface also, dimple fracture areas were drawmatically increased with heat input which is propotional to the applied weld current. In spite of the high hardness values associated with the martensite microstructures due to high cooling rate. The high load-carrying ability of the weld is directly associated with the area of ductile fracture occurred in weld. Therefore, the judgment of the quality of resistance spot welds in TRIP1180 steels, the load-carrying capacity of the weld should be considered as an important factor than fracture mode.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.38-42
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• 2002

HAZ(Heat Affected Zone of weldm ents) properties were investigated for a high nitrogen austenitic stainless steel with a chemical composition of Fe-0.02C-0.15Si-6.00Mn-10.0Ni-23.0Cr-2.00Mo-0.48N-0.14V. Thermal cycle of HAZ was simulated by the thermal cycle simulator (Gleeble 1500). The heat treatment was applied to the Charpy test size sample without notch under various peak temperatures and/or the holding times condition. V-notch Charpy test was performed at the temperature range of 273~77 K. Metallographic examination also was carried out by using optical microscopy, scanning electron microscopy and transmission electron microscopy. The simulated specimens revealed a slight embrittlement compared with the base materials. The impact toughness of the specimens deteriorated with the decreasing test temperature. The results from Charpy V-notch test, however, showed that significant degradation of absorbed energy caused by brittle fracture was not observed for the specimen tested in the test temperature range.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.94-94
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• 2010

Fiber laser is a heat source which is introduced recently, and so has a little researched data compare with conventional laser processing. Moreover basic data for welding monitoring are also insufficient. Therefore, in this study, the change of signal with measuring position and angle of plasma emission signals were analysed as a basic experiment for real time monitoring in fiber laser welding. As a result, the signals measured from the side, front and rear had the biggest intensity at $60^{\circ}$, and frequency peak to reflect the behavior of keyhole and swing of plasma by shield gas was detected at $45{\sim}60^{\circ}$. However, both intensity of signal and the result of FFT for monitoring were satisfied at the angle of $45^{\circ}$ from the side.

• Journal of the Korean Society of Safety
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• v.22 no.6
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• pp.27-34
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• 2007

Static or dynamic elastomeric O-ring seals are installed between joining parts, and play key roles of high pressure-tightening. Sealing performance and structural safety of the O-ring are dependent on groove design, plain diameter, squeeze and applications such as pressure and temperature. In this study, to solve O-ring problem squeezed and highly pressurized under laterally one-sided constrained condition, hyperelastic FE analyses are performed, and FE results are compared with measured ones by computer-aided tomography, deformed shape and extrusion depth of the O-ring. Through the comparisons, FE analysis technique was verified. In order to evaluate design sensitivity, Taguchi method was used to select FE analysis cases. Adjustment parameters are clearance gap, groove comer radius, plain diameter and squeeze. By means of verified FE analysis technique, it has been analysed how the parameters have effects on contact stress fields, internal stress fields, and extrusion depths. Sealing performance has been evaluated based on contact stress fields and contact widths, and structural safety on internal stress and strain, extrusion lengths.

• Nuclear Engineering and Technology
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• v.51 no.3
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• pp.776-783
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• 2019

Laser welding is usually a more effective method than electron-beam one since a vacuum chamber is not required. It is important for joining Zr-1%Nb (E110) alloy in a manufacturing process of nuclear fuel rods. In the present work, effect of energy parameters of pulsed laser welding on properties of butt joints of sheets with a thickness of 0.5 mm is investigated. The most efficient combination has been found (8-11 J pulse energy, 10-14 ms pulse duration, 780-810 W peak pulse power, 3 Hz pulse frequency, 1.12 mm/s welding speed). The results show that ultimate strength under static loading can not be used as a quality criterion for zirconium alloys welds. Increased shielding gas flow rate does not allow to protect weld metal totally and contributes to defect formation without using special nozzles. Several types of imperfections of the welds have been found, but the major problem is branching microcracks on the surface of the welds. It is difficult to identify the cause of their appearance without additional research on improving the welding zone protection (gas composition and flow rate as well as nozzle configuration) and studying the hydrogen content in the welds.

• Journal of Surface Science and Engineering
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• v.56 no.6
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• pp.386-392
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• 2023

In this work, we describe the reduction kinetics of gold nanoparticles synthesized by plasma discharge in aqueous solutions with varied voltages and precursor (HAuCl₄) concentrations. The reduction rate of [AuCl₄]^- was determined by introducing NaBr to the gold colloidal solution synthesized by plasma discharge, serving as a catalyst in the reduction process. We observed that [AuCl₄]^- was completely reduced when its characteristic absorption peak at 380 nm disappeared, indicating the absence of [AuCl₄]^- for ligand exchange with NaBr. The reduction rate notably increased with the rise in discharge voltage, attributable to the intensified plasma generated by ionization and excitation, which in turn accelerated the reduction kinetics. Regarding precursor concentration, a lower concentration was found to retard the reduction reaction, significantly influencing the reduction kinetics due to the presence of active H⁺ and H radicals. Therefore, the production of strong plasma with high plasma density was observed to enhance the reduction kinetics, as evidenced by optical emission spectroscopy.