• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.11
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• pp.718-724
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• 2014

In this work, in order to manufacture the photoelectrode of dye-sensitized solar cells, the different anatase $TiO_2$ paste was prepared by simple route using hydrothermal method. In comparison with the traditional preparing process, the hydrothermally synthesized $TiO_2$ gel was used to make paste directly. Thus, the making process was simplified and the solar conversion efficiency was improved. In comparison with 5.34% solar energy efficiency of HP-1 photoelectrode, the 6.23% efficiency of HDP-1 electrode was improved by 16.67%. This is because hydrothermally synthesized $TiO_2$ gel was used to make paste directly, the dispersibility between $TiO_2$ particles was improved and get the smoother network, leading to the charge transport ability of the electron generated in dye molecular was improved. Further, HDP-2 photoelectrode delivered the best results with Voc (open circuit voltage), Jsc (short circuit current density) FF (fill factor) and ${\eta}$(solar conversion efficiency) were 0.695 V, $15.81mA\;cm^{-2}$, 61.48% and 6.80%, respectively. In comparison with 5.34% of HP-1 photoelectrode, it was improved by 27.34%.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.34-39
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• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.461-462
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• 2005

In order to improve the efficiency of dye-sensitized solar cell (DSC), $TiO_2$ electrode screen-printed on transparent conducting oxide (TCO) substrate was sintered in variation with different temperature(350 to $550^{\circ}C$). $TiO_2$ electrode on fluorine doped tin oxide (FTO) glass was assembled with Pt counter electrode on FTO glass. I-V properties of DSC were measured under solar simulator. Also, effect of sintering temperature on surface morphology of $TiO_2$ films was investigated to understand correlation between its surface morphology and sintering temperature. Such surface morphology was observed by atomic force microscopy (AFM). From the measurement results, at sintering temperature of $500^{\circ}C$, both efficiency and fill factor of DSC were mutually complementary, enhancing highest fill factor and efficiency. Consequently, it was considered that optimum sintering temperature of $\alpha$-terpinol included $TiO_2$ paste is at $500^{\circ}C$.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.05a
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• pp.230-231
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• 2017

The addition of a limestone filler(LF) to fill into the voids between cement and aggregate particles can reduce the cementitious paste volume. This paper aim to evaluate the influence of LF contents on the hydration kinetics and compressive strength. Hydration kinetics were evaluate using heat of hydration, ignition loss and thermal analysis. The heat of hydration was measured using Isothermal Calorimetry. The degree of hydration was measured using ignition loss. Hydration product analysis was carried out by Thermal Gravimetric and Differential Thermal Analysis. The results show that the addition of LF reduces not only the initial setting time and heat of hydration peak, also degree of hydration and rate of strength development at early age increase with the addition of LF. It can be concluded the LF fills the pore between cement particles due to formation of carboaluminate, which may accelerate the setting of cement pastes.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.9
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• pp.11-15
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• 2010

In this study, to fabricate a low-resistance and high optical transparency electrode film, the following steps were performed: the design and manufacture of electroforming stamp, the fabrication of a thermal roll-imprinted polycarbonate (PC) patterned films, the filled low-resistance Ag paste using doctor blade process on patterned PC films and spin coating by conductive polymers. As a result of PC films imprinted line width of $26.69{\pm}2\;{\mu}m$, channel length of $247.57{\pm}2\;{\mu}m$, and pattern depth of $7.54{\pm}0.2\;{\mu}m$. Ag paste to fill part of the patterned film with conductive polymer coating and then the following parameters were obtained: a sheet resistance of $11.1\;{\Omega}/sq$ optical transparency values at a wavelength of 550 nm was 80.31 %.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.571-575
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• 2005

In order to improve the efficiency of dye-sensitized solar cell (DSSC), $TiO_2$ electrode screen-printed on transparent conducting oxide (TCO) substrate was sintered in variation with different temperature$(350\;to\;550^{\circ}C)$. $TiO_2$ electrode on fluorine doped tin oxide (FTO) glass was assembled with Pt counter electrode on FTO glass. I-V properties of DSSCs were measured under solar simulator. Also, effect of sintering temperature on surface morphology of $TiO_2$ films was investigated to understand correlation between its surface morphology and sintering temperature. Such surface morphology was observed by atomic force microscopy (AFM). Below sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively lower due to lower open circuit voltage. Oppositely, above sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively higher due to higher open circuit voltage. In both cases, lower fill factor (FF) was observed. However, at sintering temperature of $500^{\circ}C$, both efficiency and fill factor of DSSCs were mutually complementary, enhancing highest fill factor and efficiency. Such results can be explained in comparison of surface morphology with schematic diagram of energy states on the $TiO_2$ electrode surface. Consequently, it was considered that optimum sintering temperature of a-terpinol included $TiO_2$ paste is at $500^{\circ}C$.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Journal of the Korea Institute of Building Construction
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• v.20 no.4
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• pp.321-330
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• 2020

The addition of a limestone filler(LF) to fill into the voids between cement and aggregate particles can reduce the cementitious paste volume. In previous studies, it has been found that the addition of LF to reduce the cementitious paste volume would substantially increase the compressive strength, and reduce the heat generation. This paper aim to evaluate the influence of LF contents on the hydration kinetics and compressive strength. Hydration kinetics were evaluate using heat of hydration, ignition loss and thermal analysis. The heat of hydration was measured using Isothermal Calorimetry. The degree of hydration was measured using ignition loss. Hydration product analysis was carried out by Thermal Gravimetric and Differential Thermal Analysis. The results show that the addition of LF reduces not only the initial setting time and heat of hydration peak, also degree of hydration and rate of strength development at early age increase with the addition of LF. It can be concluded the LF fills the pore between cement particles due to formation of carboaluminate, which may accelerate the setting of cement pastes.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1382-1383
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• 2011

결정질 실리콘 태양전지에서 전극 형성 공정은 Voc(Open-circuit voltage), Isc(Short-circuit current), Rser(Series resistance), Rshunt(Shunt resistance), FF(Fill factor) 특성에 영향을 주기 때문에 매우 중요하다. 하지만 paste와 선 공정에서의 조건에 따라 특성이 바뀌기 때문에 소성 공정을 최적화하기는 쉽지 않다. 본 연구에서는 Gravure Off-set printing 방식을 이용하여 결정질 실리콘 기판 표면에 미세 전극 형성 공정을 하고 소성 조건 최적화를 위해 peak 온도와 ramp-up 속도를 변화시켜 각 조건별 특성을 비교하였다. Peak 온도가 커질수록, contact resistance의 감소에 따라 Rser가 줄어들었다. 본 연구를 통해 Voc는 619mV, FF는 77.9%로 측정되는 Gravure Off-set 태양전지에 최적화된 소성 공정 조건을 확보하였다.