• Title/Summary/Keyword: paste materials

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Microstructure of Non-Sintered Inorganic Binder using Phosphogypsum and Waste Lime as Activator

  • Kim, Ji-Hoon;An, Yang-Jin;Mun, Kyung-Ju;Hyung, Won-Gil
    • Journal of the Korea Institute of Building Construction
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    • v.18 no.3
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    • pp.305-312
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    • 2018
  • This study is about the development of a non-sintered binder (NSB) which does not require a sintering process by using the industrial by-products Phosphogypsum (PG), Waste Lime (WL) and Granulated Blast Furnace Slag (GBFS). In this report, through SEM analysis of the NSB paste hardening body, micropore analysis of paste using the mercury press-in method and microstructure observation were executed to consider the influence of the formation of the pore structure and the distribution of pore volume on strength, and the following conclusions were reached. 1) Pore structure of NSB paste of early age is influenced by hydrate generation amount by GBFS and activator. 2) Through observing the internal microstructure of NSB binder paste, it was found that the strength expression at early age due to hydration reaction was achieved with a large amount of ettringite serving as the frame with C-S-H gel generated at the same time. It was confirmed that C-S-H gel wrapped around ettringite, and as time passed, the amount generated continually increased, and C-S-H gel tightly filled the pores of hardened paste, forming a dense network-type web structure. 3) For NSB-type cement, the degree of formation of gel pores below $10{\mu}m$ had a greater influence on strength improvement than simple pore reduction by charging capillary pores, and the pore size that had the greatest effect on strength was micropores with diameter below $10{\mu}m$.

Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring (저온동시소성용 감광성 은(Ag)페이스트의 광식각 특성)

  • Park, Seong-Dae;Kang, Na-Min;Lim, Jin-Kyu;Kim, Dong-Kook;Kang, Nam-Kee;Park, Jong-Chul
    • Journal of the Korean Ceramic Society
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    • v.41 no.4
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    • pp.313-322
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    • 2004
  • Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.

Wettability and Intermetallic Compounds of Sn-Ag-Cu-based Solder Pastes with Addition of Nano-additives (나노 첨가제에 따른 Sn-Ag-Cu계 솔더페이스트의 젖음성 및 금속간화합물)

  • Seo, Seong Min;Sri Harini, Rajendran;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.1
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    • pp.35-41
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    • 2022
  • In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

Studies on the Substitution of raw Materials of Bean Paste and Red Pepper Paste. (된장 및 고추장의 원료 대체에 관한 연구)

  • 이택수;신보규;주영하;유주현
    • Microbiology and Biotechnology Letters
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    • v.1 no.2
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    • pp.79-87
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    • 1973
  • The superior materials for substitution of bean and red pepper paste were selected through the examination of chemical compositions and the function. The following results were obtained. (1) The enzyme activities were higher in the process of koji manufacturing for brewing bean paste and red pepper paste in barley koji and in corn powder koji, but those of wheat koji were inferior (2) Corn powder was proved as the most excellent substitute, because its components and functioning were the best. (3) In the production of the paste the use of corn powder and bean with equal amount was proved as good as those product of the traditional way of the brewing. (4) By using the corn powder, the production cost can be cut down to 25% in the production of bean paste, and to 23% in the production of red pepper paste, comparing with those of traditional brewing products

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EXPERIMENTAL STUDY ON THE ANTIBACTERIAL EFFECTS OF ROOT CANAL FILLING MATERIALS (근관충전재료의 살균효과에 관한 실험적 연구)

  • Kim, Young-Hoon
    • The Journal of the Korean dental association
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    • v.10 no.1
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    • pp.35-40
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    • 1972
  • 저자는 임상에서 널리 사용되는 근관충전재료인 산화아연유지놀, N2, MN2 및 Triozinc Paste의 살균효과를 비교하기 위하여 한천배양기 및 혈액가한천배양기상에서 백색포도상구균 및 α-용혈성연질상구균의 두균주를 사용, 실험하여 다음과 같은 결과를 얻었다. 1) 백색포도상구균을 심은 한천배양기상에서 비건조도판을 사용한 실험군에서의 균성장억제대는 MN2, 6. 83; Triozinc paste, 5. 77; N 2, 5. 61; 산화아연유지놀, 3.49mm였다. 2) 백색포도상구균을 심은 한천배양기상에서 건조도판을 사용한 실험군에서의 균성장억제대는 MN2, 4.40; Triozinc paste, 1.46; 산화아연유지놀, 0.99; ㅜ2, 0.84mm였다. 3) 백색포도상구균을 심은 혈액가한천배양기상에서 건조도판을 사용한 실험군에서의 균성장억제대는 MN 2, 1.15; Triozinc paste, 0.55; 산화아연유지놀, 0.54; N2, 0.43mm였다. 4) α-용혈성연질상구균을 심은 용혈가한천배양기상에서 건조도판을 사용한 실험군에서의 균성장억제대는 MN 2, 2.14; Triozinc paste, 1.00; 산화아연유지놀, 0.75; N 2, 0.43mm였다.

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Preparation and properties of BaO-ZnO-$B_2O_3$-$V_2O_5$-$SiO_2$ Glass for PDP paste (PDP용 BaO-ZnO-$B_2O_3$-$V_2O_5$-$SiO_2$계 glass past의 제조와 특성)

  • Son, Myung-Mo;Lee, Heon-Soo;Lee, Chang-Hee;Lee, Sang-Geun;Park, Hee-Chan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07b
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    • pp.1096-1099
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    • 2004
  • The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3$-$V_2O_5$. DTA, and XRD were used to characterize BaO-ZnO-$B_2O_3$-$V_2O_5$ glasses. In this present study, PbO free paste had thermal expansion of $74\times10^{-7}/^{\circ}C$, DTA softening point of $460^{\circ}C$, and firing condition of $520^{\circ}C$, 20min

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An experimental study on carbonation resistance of Mg(OH)2 mixed cement paste (Mg(OH)2 혼입 시멘트 페이스트의 탄산화 저항성에 관한 실험적 연구)

  • Chen, Zheng-Xin;Lee, Yun-Su;Lee, Han-Seung
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2017.05a
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    • pp.165-166
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    • 2017
  • Corrosion of reinforcement is the main factors affecting the durability of reinforced concrete in the world which lead to the failure of structures of reinforced concrete buildings. In this research, mixed brucite(Mg(OH)2) into ordinary portland cement paste in ratio of 5, 10 and 15% as a kind of CO2 fixation material. Samples were exposed to an accelerated carbonation enslavement of 20% CO2 concentration, 60% relative humidity, and a temperature of 20℃ until tested at 3d, 7d, 14d and 28d. After 28d CO2 accelerated curing, in the paste containing MH megnesian calcite was found by XRD and SEM-EDX. Meanwhile, paste containing Mg(OH)2 exhibit the better pore distribution than ordinary portland cement paste and relatively good compressive strength.

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Properties of Stretchable Electrode Pattern Printed on Urethane Film (우레탄 필름에 인쇄된 신축 가능한 전극 패턴의 특성)

  • Nam, Su-Yong;Kwon, Bo-Seok;Nam, Hyun-Jin;Nam, Ki-Woo;Park, Hyo-Zun
    • Journal of Power System Engineering
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    • v.22 no.1
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    • pp.64-71
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    • 2018
  • Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.

A constitutive model for fiber-reinforced extrudable fresh cementitious paste

  • Zhou, Xiangming;Li, Zongjin
    • Computers and Concrete
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    • v.8 no.4
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    • pp.371-388
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    • 2011
  • In this paper, time-continuous constitutive equations for strain rate-dependent materials are presented first, among which those for the overstress and the consistency viscoplastic models are considered. By allowing the stress states to be outside the yield surface, the overstress viscoplastic model directly defines the flow rule for viscoplastic strain rate. In comparison, a rate-dependent yield surface is defined in the consistency viscoplastic model, so that the standard Kuhn-Tucker loading/unloading condition still remains true for rate-dependent plasticity. Based on the formulation of the consistency viscoplasticity, a computational elasto-viscoplastic constitutive model is proposed for the short fiber-reinforced fresh cementitious paste for extrusion purpose. The proposed constitutive model adopts the von-Mises yield criterion, the associated flow rule and nonlinear strain rate-hardening law. It is found that the predicted flow stresses of the extrudable fresh cementitious paste agree well with experimental results. The rate-form constitutive equations are then integrated into an incremental formulation, which is implemented into a numerical framework based on ANSYS/LS-DYNA finite element code. Then, a series of upsetting and ram extrusion processes are simulated. It is found that the predicted forming load-time data are in good agreement with experimental results, suggesting that the proposed constitutive model could describe the elasto-viscoplastic behavior of the short fiber-reinforced extrudable fresh cementitious paste.

Printing performance of 3D printing cement-based materials containing steel slag

  • Zhu, Lingli;Yang, Zhang;Zhao, Yu;Wu, Xikai;Guan, Xuemao
    • Advances in concrete construction
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    • v.13 no.4
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    • pp.281-289
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    • 2022
  • 3D printing cement-based materials (3DPCBM) is an innovative rapid prototyping technology for construction materials. This study is tested on the rheological behavior, printability and buildability of steel slag (SS) content based on the extrusion system of 3D printing. 0, 8 wt%, 16 wt%, 24 wt%, 32 wt% and 40 wt% SS was replaced cement, The test results revealed that the addition of SS would increase the fluidity of the printed paste, prolong the open time and setting time, reduce the plastic viscosity, dynamic yield stress and thixotropy, and is beneficial to improve the pumping and extrudability of 3DPCBM. With the increase of SS content, the static yield stress developed slowly with time which indicated that SS is harmful to the buildability of printing paste. The content of SS in 3DPCBM can reach up to 40% at most under the condition of satisfying rheological property and buildability, it provides a reference for the subsequent introduction of SS and other industrial solid waste into 3DPCBM by explored the influence law of SS on the rheological properties of 3DPCBM.