• Title/Summary/Keyword: passivation effect

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Properties of Capacity on Carbon Electrode in EC:MA Electrolytes - I. Effect of Mixing Ratio on the Electrochemical Properties - (EC:MA 혼합전해질에서 카본 전극의 용량 특성 - I. 전기화학적 특성에 대한 혼합비의 영향 -)

  • Park, Dong-Won;Kim, Woo-Seong;Son, Dong-Un;Kim, Sung-Phil;Choi, Yong-Kook
    • Applied Chemistry for Engineering
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    • v.17 no.2
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    • pp.183-187
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    • 2006
  • The choice of solvents for electrolytes solutions is very important to improve the characteristics of charge/discharge in the Li-ion battery system. Such solvent systems have been widely investigated as electrolytes for Li-ion batteries. In this paper, the electrochemical properties of the solid electrolyte interphase film formed on carbon anode surface and the solvent decomposition voltage in 1 M LiPF6/EC:MA(x:y) electrolyte solutions prepared from the various mixing volume ratios are investigated by chronopotentiometry, cyclic voltammetry, and impedance spectroscopy. As a result, the solvent decomposition voltages are varied with the ionic conductivity of the electrolyte. Electrochemical properties of the passivation film were different, which are dependent on the mixture ratio of the solvents. Therefore, the most appropriate mixing ratio of EC and MA as a solvent in 1 M $LiPF_6/(EC+MA)$ system for Li-ion battery is approximately 1:3 (EC:MA, volume ratio).

Study on the Effects of Corrosion Inhibitor According to the Functional Groups for Cu Chemical Mechanical Polishing in Neutral Environment (중성 영역 구리 화학적 기계적 평탄화 공정에서의 작용기에 따른 부식방지제의 영향성 연구)

  • Lee, Sang Won;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • v.53 no.4
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    • pp.517-523
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    • 2015
  • As the aluminum (Al) metallization process was replaced with copper (Cu), the damascene process was introduced, which required the planarization step to eliminate over-deposited Cu with Chemical Mechanical Polishing (CMP) process. In this study, the verification of the corrosion inhibitors, one of the Cu CMP slurry components, was conducted to find out the tendency regarding the carboxyl and amino functional group in neutral environment. Through the results of etch rate, removal rate, and chemical ability of corrosion inhibitors based on 1H-1,2,4-triazole as the base-corrosion inhibitor, while the amine functional group presents high Cu etching ability, carboxyl functional group shows lower Cu etching ability than base-corrosion inhibitor which means that it increases passivation effect by making strong passivation layer. It implies that the corrosion inhibitor with amine functional group was proper to apply for 1st Cu CMP slurry owing to the high etch rate and with carboxyl functional group was favorable for the 2nd Cu CMP slurry due to the high Cu removal rate/dissolution rate ratio.

Hydrogenated and annealed effect of CdTe:In

  • ;Yuldashev
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.96-96
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    • 1999
  • CdTe는 일반적으로 광전 소자나 Xtjs 및 λ선 감지 소자로서 많은 연구가 되어지고 있는 물질이다. 특히 적외선 감지 소자로 쓰이고 있는 HgCdTe 물질의 기판으로서도 많은 연구가 진행되고 있다. 이러한 여러 가지 목적으로 사용함에 있어서 CdTe 내에 가지고 있는 여러 가지 불순물에 의한 영향으로 각종 결함밴드들이 형성됨으로서 소자로서의 응용에 많은 지장을 주고 있다. 이러한 이유로 여러 가지 방법으로 불순물 및 결합에 의한 준위에 관한 연구들이 진행되고 있다. 본 실험에서는 MBE 법으로 성장된 In 도핑된 CdTe 박막의 광학적 성질을 관찰하기 위하여 수소화 및 열처리를 하여 PL 법을 이용하여 관찰하여 보앗다. 열처리는 Cd 분위기의 50$0^{\circ}C$에서 5시간 동안 수행하였으며 수소화는 rf plasma 장치를 이용하여 8$0^{\circ}C$에서 50mW/c2의 출력으로 1시간동안 수행하여 주었다. 열처리한 시료의 경우 PL 신호는 갓 성장한 시료와 비교하여 깊은 준위에 관련된 신호들만 변화가 있었을뿐 그리 큰 변화가 있지는 않았다. 그러나 수소화시킨 시료의 경우 전체적으로 피크의 크기가 5배정도 감소하는 것을 볼 수 있었는데 이것은 수소에 의하여 passivation된 효과로 볼 수 있다. 정량적인 passivation 효과를 보기 위하여 온도의존성 PL 측정을 하여 보았다. 측정에서 관측된 (D,h) emission lines의 FWHM을 비교하여 본 결과 FWHM 온도가 증가함에 따라 선형적으로 증가하는 것이 아니라 급격한 증가를 q이는 구간을 관착할 수 있었다. 이것은 CdTe내에 존재하는 전하를 띠고 있는 주게와 받게의 결합의 결과로 나타나는 현상으로 보여진다. 이러한 결과를 통하여 얕은 준위에 있는 주게 불순물의 농도를 계산해 보았고 Hall 측정을 얻은 결과와 비교하여 보았다.판단된다. 따라서 이 기술은 기존의 광소자 제작을 위한 IFVD 방법의 문제점을 해결할 뿐만 아니라 결정 재성장 없이 도일한 기판상에 국부적으로 상이한 bandgap 영역을 만들 수 있기 때문에 광소자 제작에 적극 이용될 수 있다.나지 않았으며 BST 박막에서는 약 1.2V의 C-V이력현상이 보였다.를 이용하였으며, 이온주입후 열처리 온도에 따른 활성화 정도의 관찰을 위하여 4-point probe와 Hall measurement를 이용하였다. 증착된 다결정 SiGe의 두게를 nanospec과 SEM으로 분석한 결과 Gem이 함량이 적을 때는 높은 온도에서의 증착이 더 빠른 증착속도를 나타내었지만, Ge의 함량이 30% 되었을 때는 온도에 관계없이 일정한 것으로 나타났다. XRD 분석을 한 결과 Peak의 위치가 순수한 Si과 순수한 Ge 사이에 존재하는 것으로 나타났으며, ge 함량이 많아짐에 따라 순수한 Ge쪽으로 옮겨가는 경향을 보였다. SEM, ASFM으로 증착한 다결정 SiGe의 morphology 관찰결과 Ge 함량이 높은 박막의 입계가 다결정 Si의 입계에 비해 훨씬 큰 것으로 나타났으며 근 값도 증가하는 것으로 나타났다. 포유동물 세포에 유전자 발현벡터로써 사용할 수 있음으로 post-genomics시대에 다양한 종류의 단백질 기능연구에 맡은 도움이 되리라 기대한다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품 개발에 따른 새로운 수요 창출과 수익률 향상, 기존의 기능성 안료를 나노(nano)화하여 나노 입자를 제조, 기존의 기능성 안료에 대한 비용 절감 효과등을 유도 할 수 있다. 역시 기술적인 측면에서도 특수소재 개발에 있어 최적의 나노 입자 제어기술 개발 및 나노입자를 기능성 소재로 사용하여 새로운 제품의 제조와 고압 기상 분사기술의 최적화에 의한 기능성 나노 입자 제조 기술을 확립하고 2차 오염 발생원인 유

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An Investigation of Electrical Properties in Cation-anion Codoped ZnO by Atomic Layer Deposition (원자층 증착법 기반 양이온-음이온 이중 도핑 효과에 따른 ZnO 박막의 전기적 특성 비교 연구)

  • Dong-eun Kim;Geonwoo Kim;Kyung-Mun Kang;Akendra Singh Chabungbam;Hyung-Ho Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.94-101
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    • 2023
  • Zinc oxide(ZnO) is a semiconductor material with a bandgap of 3.37 eV and an exciton binding energy of 60 meV for various applications. Recently ZnO has been proven to enhance its electrical properties for utilization as an alternative for transparent conducting oxide (TCO) materials. In this study, cation(Al, Ga)-anion(F) single and double doped ZnO thin films were grown by atomic layer deposition (ALD) to enhance the electrical properties. The structural and optical properties of doped ZnO thin films were analyzed, and doping effects were confirmed to electrical characteristics. In single doped ZnO, it was observed that the carrier concentration was increased after doping, acting as a donor to ZnO. Among the single doping elements, F doped ZnO(FZO) showed the highest mobility and conductivity due to the passivation effect of oxygen vacancies. In the case of double doping, higher electrical characteristics were observed compared to single doping. Among the samples, Al-F doped ZnO(AFZO) exhibited the lowest resistance value. This results can be attributed to an increase in delocalized electron states and a decrease in lattice distortion resulting from the differences in ionic radius. The partial density of states(PDOS) was also analyzed and observed to be consistent with the experimental results.

Effect of Austenitizing Ratio on the Delta Ferrite Volume Fraction and Corrosion Resistance of Shell Mold Cast SSC13 Elbow Fitting (셀 몰드 주조한 SSC13 엘보우 피팅 주강의 고용화율에 따른 델타 페라이트 분율 변화와 내부식특성)

  • Kim, Kuk-Jin;Lim, Su-Gun;Ju, Heong-kyu;Pak, Sung-Joon
    • Journal of Korea Foundry Society
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    • v.35 no.5
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    • pp.109-113
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    • 2015
  • In this study, the measurement of FN (ferrite volume fraction) and the solution annealing ratio at a temperature of $1130^{\circ}C$ were determined with 15A elbow fittings of shell cast SSC13, and the corrosion resistance with and without austenitizing solution annealing were investigated in comparison with AISI304. The delta ferrite phase was observed in the material due to the slow cooling effect of the shell mold casting. However, the delta ferrite phase decreased gradually with the solution annealing at a temperature of $1130^{\circ}C$. The hardness generally decreased with a heat treatment; however, its corrosion resistance was improved with the heat treatment. In addition, when a passivation treatment was applied, its corrosion ratio showed the lowest value. The pattern of general corrosion decreased due to the decrease in the delta ferrite phase with the solution annealing treatment. Consequently, it is suggested that the corrosion resistance of SSC13 elbow fittings can be improved by increasing the ratio of any solution annealing treatment used and by decreasing the ferrite phase. The relationship between the ratio of solution annealing and delta ferrite is expressed as follows: SA (solution annealing ratio,%) = 98 - FN (ferrite volume fraction, %).

Analysis of calcium phosphate nanoclusters using the TOF-MEIS

  • Jung, Kang-Won;Park, Jimin;Yang, Ki Dong;Nam, Ki Tae;Moon, DaeWon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.228.2-228.2
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    • 2015
  • We have developed a TOF-MEIS system using 70~100 keV He+. A TOF-MEIS system was designed and constructed to minimize the ion beam damage effect by utilizing a pulsed ion beam with a pulse width < 1 ns and a TOF delay-line-detector with an 120 mm diameter and a time resolution of 180 ps. The TOF-MEIS is an useful tool for interfacial analysis of the composition and structure of nano and bio systems. Our recent applications are reported. We investigated the effect with Polyaspartic Acid (pAsp) and Osteocalcin on the initial bone growth of calcium hydroxyl appatite on a carboxyl terminated surface. When pAsp is not added to the self-assembled monolayers of Ca 2mM with Phosphate 1.2 mM, the growth procedure of calcium hydroxyl appatite cannot be monitored due to its rapid growth. When pAsp is added to the SAMs, the initial grow stage of the Ca-P can be monitored so that the chemical composition and their nucleus size can be analyzed. Firstly discovered the existence of 1-nm-sized abnormal calcium-rich clusters (Ca/P ~ 3) comprised of three calcium ions and one phosphate ion. First-principles studies demonstrated that the clusters can be stabilized through the passivation of the non-collagenous-protein mimicking carboxyl-ligands, and it progressively changes their compositional ratio toward that of a bulk phase (Ca/P~1.67) with a concurrent increase in their size to ~2 nm. Moreover, we found that the stoichiometry of the clusters and their growth behavior can be directed by the surrounding proteins, such as osteocalcin.

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Influence of Citric Acid on the Metal Release of Stainless Steels

  • Mazinanian, N.;Wallinder, I. Odnevall;Hedberg, Y.S.
    • Corrosion Science and Technology
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    • v.14 no.4
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    • pp.166-171
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    • 2015
  • Knowledge of how metal releases from the stainless steels used in food processing applications and cooking utensils is essential within the framework of human health risk assessment. A new European standard test protocol for testing metal release in food contact materials made from metals and alloys has recently been published by the Council of Europe. The major difference from earlier test protocols is the use of citric acid as the worst-case food simulant. The objectives of this study were to assess the effect of citric acid at acidic, neutral, and alkaline solution pH on the extent of metal release for stainless steel grades AISI 304 and 316, commonly used as food contact materials. Both grades released lower amounts of metals than the specific release limits when they were tested according to test guidelines. The released amounts of metals were assessed by means of graphite furnace atomic absorption spectroscopy, and changes in the outermost surface composition were determined using X-ray photoelectron spectroscopy. The results demonstrate that both the pH and the complexation capacity of the solutions affected the extent of metal release from stainless steel and are discussed from a mechanistic perspective. The outermost surface oxide was significantly enriched in chromium upon exposure to citric acid, indicating rapid passivation by the acid. This study elucidates the effect of several possible mechanisms, including complex ion- and ligand-induced metal release, that govern the process of metal release from stainless steel under passive conditions in solutions that contain citric acid.

Effect of Current Density on Material Removal in Cu ECMP (구리 ECMP에서 전류밀도가 재료제거에 미치는 영향)

  • Park, Eunjeong;Lee, Hyunseop;Jeong, Hobin;Jeong, Haedo
    • Tribology and Lubricants
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    • v.31 no.3
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    • pp.79-85
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    • 2015
  • RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.

Effects of Firing Ambient on Rear Metallization for Silicon Solar Cells (분위기에 따른 실리콘 태양전지 후면 전극 및 후면 전계의 형상과 특성 분석)

  • Park, Sungeun;Kim, Young Do;Park, Hyomin;Kang, Yoonmook;Lee, Hae-Seok;Kim, Donghwan
    • Korean Journal of Materials Research
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    • v.25 no.7
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    • pp.336-340
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    • 2015
  • For rear metallization with Al paste, Al back contacts require good passivation, high reflectance, and a processing temperature window compatible with the front metal. In this paper, the effect of the firing ambient during the metallization process on the formation of Al rear metal was investigated. We chose three different gases as ambient gases during the firing process. Using SEM, we observed the formation of a back surface field in $N_2$, $O_2$, and Air ambients. To determine the effect of the ambient on Voc, the suns-Voc tool was used. In this study, we described the mechanism of burn-out of organic materials in Al paste during the firing process. The oxygen ambient plays an important role in the burn-out process. We calculated the efficiency with obtained the back surface recombination velocities using PC1D simulation. It was found that the presence of oxygen during the firing process influenced the uniform back surface field because the organic materials in the Al paste were efficiently burned out during heating. The optimized temperature with oxygen flow shows an absolute efficiency of 19.1% at PC1D simulation.

Effect of pH in Sodium Periodate based Slurry on Ru CMP (Sodium Periodate 기반 Slurry의 pH 변화가 Ru CMP에 미치는 영향)

  • Kim, In-Kwon;Cho, Byung-Gwun;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.117-117
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    • 2008
  • In MIM capacitor, poly-Si bottom electrode is replaced with metal bottom electrode. Noble metals can be used as bottom electrodes of capacitors because they have high work function and remain conductive in highly oxidizing conditions. In addition, they are chemically very stable. Among novel metals, Ru (ruthenium) has been suggested as an alternative bottom electrode due to its excellent electrical performance, including a low leakage of current and compatibility to high dielectric constant materials. Chemical mechanical planarization (CMP) process has been suggested to planarize and isolate the bottom electrode. Even though there is a great need for development of Ru CMP slurry, few studies have been carried out due to noble properties of Ru against chemicals. In the organic chemistry literature, periodate ion ($IO_4^-$) is a well-known oxidant. It has been reported that sodium periodate ($NaIO_4$) can form $RuO_4$ from hydrated ruthenic oxide ($RuO_2{\cdot}nH_2O$). $NaIO_4$ exist as various species in an aqueous solution as a function of pH. Also, the removal mechanism of Ru depends on solution of pH. In this research, the static etch rate, passivation film thickness and wettability were measured as a function of slurry pH. The electrochemical analysis was investigated as a function of pH. To evaluate the effect of pH on polishing behavior, removal rate was investigated as a function of pH by using patterned and unpatterned wafers.

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