• Title/Summary/Keyword: particle deposition

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Computational Fluid Dynamics for Enhanced Uniformity of Mist-CVD Ga2O3 Thin Film (Ga2O3초음파분무화학기상증착 공정에서 유동해석을 이용한 균일도 향상 연구)

  • Ha, Joohwan;Lee, Hakji;Park, Sodam;Shin, Seokyoon;Byun, Changwoo
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.4
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    • pp.81-85
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    • 2022
  • Mist-CVD is known to have advantages of low cost and high productivity method since the precursor solution is misting with an ultrasonic generator and reacted on the substrate under vacuum-free conditions of atmospheric pressure. However, since the deposition distribution is not uniform, various efforts have been made to derive optimal conditions by changing the angle of the substrate and the position of the outlet to improve the result of the preceding study. Therefore, in this study, a deposition distribution uniformity model was derived through the shape and position of the substrate support and the conditions of inlet flow rate using the particle tracking method of computational fluid dynamics (CFD). The results of analysis were compared with the previous studies through experiment. It was confirmed that the rate of deposition area was improved from 38.7% to 100%, and the rate of deposition uniformity was 79.07% which was higher than the predicted result of simulation. Particle tracking method can reduce trial and error in experiments and can be considered as a reliable prediction method.

A study of unsteady heat and mass transfer in the modified chemical vapor deposition process (수정된 화학증착방법에서 비정상 열 및 물질전달 해석)

  • Park, Gyeong-Sun;Choe, Man-Su
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.1
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    • pp.79-88
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    • 1997
  • An analysis of unsteady heat and mass transfer in the Modified Chemical Vapor Deposition has been carried out including the effects of chemical reaction and variable properties. It was found that commonly used quasi-steady state assumption could be used to predict overall efficiency of deposition, however, the assumption would not provide detailed deposition profile. The present unsteady calculations of wall temperature profile and deposition profile have been compared with the existing experimental data and were in good agreement. The effects of variable torch speed were studied. Linearly varying torch speed case until time=120s resulted in much shorter tapered entry than the constant torch speed case.

A Study of Air Pollutants Dry Deposition (대기오염물질의 건성침적에 관한 연구)

  • Lee, Chi-Young;Kang, Dong-Ku
    • Journal of environmental and Sanitary engineering
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    • v.18 no.3 s.49
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    • pp.64-68
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    • 2003
  • Measurement of dried deposition for air pollutant was investigated in Gwang-ju Health college area for a year. The average value of air pollutants was investigated three times a month. Measured heavy metals and concentration of mass are not corelated. Heavy metals were thrown up air as state of large particles and they were moved by wind. Deposition of heavy metals and deposition velocities were high in the order of Fe > n > Cu > Pb > Cr and Pb > Fe > Cr > Zn > Cu, respectively. The pattems of deposition velocity of heavy metals for a year were much the same as each other except that Pb is faster than others.

Production of Ultra-fine Metal Powder with Gas Atomization Processes

  • Wang, M. R.
    • Journal of ILASS-Korea
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    • v.11 no.2
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    • pp.59-68
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    • 2006
  • Experimental results of the metal powder production with internal mixing, internal impinging and the atomizer coupled with substrate design are presented in this paper. In a test with internal mixing atomizer, mean powder size was decreased from $37{\mu}m\;to\;23{\mu}m$ for Pb65Sn35 alloy as the gas-to-melt mass ratio was increased from 0.04 to 0.17. The particle size further reduces to $16.01{\mu}m$ as the orifice area is increased to $24mm^2$. The micrograph of the metal powder indicates that very fine and spherical metal powder has been produced by this process. In a test program using the internal impinging atomizers, the mean particle size of the metal powder was decreased from $22{\mu}m\;to\;12{\mu}m$ as the gas-to-melt-mass ratio increased from 0.05 to 0.22. The test results of an atomizer coupled with a substrate indicates that the deposition rate of the molten spray on the substrate is controlled by the diameter of the substrate, the height of the substrate ring and the distance of the substrate from the outlet of the atomizer. This in rum determines the powder production rate of the spraying processes. Experimental results indicate that the deposition rate of the spray forming material decreases as the distance between the substrate and the atomizer increases. For example, the deposition rate decreases from 48% to 19% as the substrate is placed at a distance from 20cm to 40cm. On the other hand, the metal powder production rate and its particle size increases as the subsrate is placed far away from the atomizer. The production of metal powder with mean particle size as low as $3.13{\mu}m$ has been achieved, a level which is not achievable by the conventional gas atomization processes.

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Fabrication and Characterization of Polycrystalline Mereuric Iodide Films using Particle-in-Binder Methods (Particle-in-Binder(PIB) 법을 이용한 다결정 $HgI_2$ 필름 제작 및 특성 연구)

  • Cha, Byung-Youl;Cho, Sung-Ho;Kim, So-Yeong;Woon, Min-Seuk;Nam, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.330-330
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    • 2007
  • Polycrystalline mercuric iodide $HgI_2$) films are being developed as a new detector technology for digital x-ray imaging. The $HgI_2$ is generally vacuum deposited by physical vapor deposition (PVD) process. But the PVD thick deposition has been caused any instability in the biasing due to any defects or cracks. In this work we present a new particle-in-binder (PIB) methodologies used for the $HgI_2$ thick films. These growth techniques can be easily extended to produce much larger film areas. This paper, for the first time, presents results and comparison of polycrystalline $HgI_2$ films derived by various PIB methods. We investigated the structural and morphological properties of the films using X-ray diffraction (XRD) and scanning electron microscopy (SEM) analysis. The films were characterized with respect to their electrical properties and in response to x-ray photons. Physical and electrical results were also compared between conventional polycrystalline PVD and our detectors. Leakage current as low as $350\;pA/cm^2$ at the bias voltage of ~ 200 V has been observed. And high sensitivity and good linearity in the response to x-rays was obtained in the film derived by PIB sedimentation method. Our future efforts will concentrate on optimization of film growth techniques for uniform large area deposition on image readout arrays.

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Solid Particle Erosion of CVD Diamond (CVD 다이아몬드 코팅의 고체입자 Erosion 특성)

  • 김종훈;임대순
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1997.04a
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    • pp.69-73
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    • 1997
  • Microwave Plasma assisted CVD (Chemical Vapor Deposition) and DC Plasma CVD were used to prepare thin and thick diamond film, respectively. Diamond coated silicon nitride and fiee standing diamond thick film were eroded by silicon carbide particles. The velocity of the solid particle was about 220m/sec. Phase transformation and the other crack formation were investigated by using Raman spectroscopy and microscopy.

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Preparation and Characterization of Fine $TiO_2$ Powders by Vapor-Phase Hydrolysis of TiCl4 (사염화티타늄의 기상가수분해반응에 의한 $TiO_2$ 미분의 제조 및 입자특성)

  • 염선민;김광호;신동원;박찬경
    • Journal of the Korean Ceramic Society
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    • v.29 no.7
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    • pp.525-532
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    • 1992
  • TiO2 fine powder was synthesized in the gas phase by chemical vapor deposition using hydrolysis of TiCl4. Content of rutile phase in the powder was investigated. Powder characteristics such as size, crystallinity and morphology were also studied by means of TEM, SEM and XRD. Rutile phase in TiO2 powder started to be formed from 100$0^{\circ}C$ and the content increased with the reaction temperature and TiCl4 concentration. As the temperature increased from 80$0^{\circ}C$ to 140$0^{\circ}C$, the primary particle size increased while secondary particle size decreased. Spherical secondary particle with fine primary crystals agglomerated was produced at low temperature of 80$0^{\circ}C$ whereas the grown primary particle being final particle size was produced at higher temperature of 140$0^{\circ}C$. Other effects of TiCl4 and H2O partial pressures on particle size were also reported in this study.

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Development of real-time nanoscale contaminant particle characteristics diagnosis system in vacuum condition (진공공간 내 나노급 오염입자의 실시간 진단시스템 개발)

  • Kang, Sang-Woo;Kim, Taesung
    • Vacuum Magazine
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    • v.2 no.3
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    • pp.11-15
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    • 2015
  • Particle characteristics diagnosis system (PCDS) was developed to measure submicron particle characteristics by modulation of particle beam mass spectrometry (PBMS) with scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS). It is possible to measure the particle size distribution in real-time, and the shape, composition can be measured in sequence keeping vacuum condition. Apparatus was calibrated by measuring the size classified NaCl particle which generated at atmospheric pressure. After the calibration, particles were sampled from the exhaust line of plasma enhanced chemical vapor deposition (PECVD) process and measured. Result confirms that PCDS is capable for analyzing particles in vacuum condition.

Effect of the particle size on the electrical contact in selective electro-deposition of copper (구리의 선택적 전착에서 결정 입자의 크기가 전기적 접촉성에 미치는 영향)

  • Hwang, Kyu-Ho;Lee, Kyung-Il;Joo, Seung-Ki;Kang, Tak
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.1 no.2
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    • pp.79-93
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    • 1991
  • With the advent of ULSI, many problems in previous metallization techniques and interconnection materials have become more serious. In this work, selective deposition of copper to fill the submicron contact has been tried. After forming electro-deposited copper films on p-type (100) silicon wafer using 0.75M $CuSO_4{\cdot}$5H_2O$ as an electrolyte, the effect of deposition time, current density and concentration of an additive on film properties were investigated. Film thickness, particle size and resistivity were analyzed by Alpha Step, SEM and 4 - point probe measurement respectively. The deposition rate was about $0.5-0.6\mu\textrm{m}$/min at $2A/dm^2$ and the particle size increased with increasing current density. The resistivities of electro-deposited copper films were about $3-6{\mu}{\Omega}{\cdot}$cm for the particle size above $4000{\AA}$. By the addition of 0.2 g/l gelatin, the particle size was reduced to less than $0.1{\mu}m $ and selective plugging of copper on submicron contacts could be successfully achieved.

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Effect of Deposition Time on the Properties of TiN-coated Layer of SM45C Steel by Arc Ion Plating (AIP법에서 증착시간이 SM45C 강의 TiN 코팅층 성질에 미치는 영향)

  • Kim, Hae-Ji
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.5
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    • pp.44-50
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    • 2011
  • The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.