• Title/Summary/Keyword: parameter-effect array

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Sweet Spot Analysis of Linear Array System with a Large Number of Loudspeakers by Geometrical Approach Method (다수의 스피커를 사용하는 선형 배열 시스템에서 기하학적 접근 방법을 통한 스윗 스팟 분석)

  • Yang, Hunmin;Park, Youngjin;Park, Youn-Sik
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.23 no.11
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    • pp.951-956
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    • 2013
  • This paper describes techniques used to analyze the sweet spot of sound field reproduced by ear-level linear arrays of loudspeakers by geometrical approach method. Previous researches have introduced various sweet spot definitions in their own way. In general, sweet spot is defined as an area whose stereophonic sound effect is valid. Its size is affected by the geometrical arrangement of the system. In this paper, a case when plane waves are generated by linear arrays of loudspeakers in the horizontal plane is considered. So the sweet spot is defined as an area in which the listener can perceive the desired azimuth angle. Because there are many loudspeakers, impulse responses at listener's ears are in the form of pulse-train and the time-duration of the pulse-train affects the localization performance of the listener. So we calculated the maximum time duration of pulse-train by geometrical approach method and identified with the results of impulse response simulation. This paper also includes parameter analysis with respect to aperture size, so it suggests a tool for sound engineers to expect the sweet spot size and listener's sound perception.

Effect of Printing Qualities on the Resonant Frequencies of Printed UHF RFID Tag Antennas (인쇄 UHF RFID 태그 안테나의 인쇄 품질에 따른 공진 주파수의 영향)

  • Kim, Chung-Hwan;Lee, Yong-Shik;Kim, Young-Guk;Kim, Dong-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.11
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    • pp.90-94
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    • 2008
  • Recently, a great deal of research is focused on the printed electronics. One of their mainly concerned products is printed RFID tag. RFID technology has attracted researchers and enterprises as a promising method for automatic identification, and they are expected to replace conventional bar codes in inventory tracking and management. The key to successful RFID technology lies in developing low-cost RFID tags and the first step in applying printing technology to RFID systems is to replace antennas that are conventionally produced by etching copper or aluminum. However, due to the printing quality variations, errors, and lower conductivity, the performance of the printed RFID antennas is lower than that of antennas manufactured by conventional etching methods. In this paper, the effect of variations in the printing conditions on the antenna performance is investigated. Three levels for each condition parameter is assumed and effect on the resonant frequency are examined experimentally based on orthogonal array. The most serious factor that affects the resonant frequency of the antenna is the non-uniformity of the edge and the resonant frequency is found to be lower as the non-uniformity increases.

The effect of coating wire on the performance of wire electrical discharge machining (코팅와이어가 와이어 방전가공 특성에 미치는 영향)

  • 임세환;김준현;김주현
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.177-185
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    • 2004
  • The machining performance of wire electrical discharge machining(WEDM), such as cutting speed, surface roughness and straightness depend on the electrode, and the machining parameters are diverse and affect each other. Therefore operator must have a lot of experiences of the parameter for the better machining performance in WEDM. An approach to minimize the time for determining of parameters setting is proposed. Based on the Taguchi method, the significant factors affecting the machining performance are determined. Types of electrodes are arranged at inner array in tables of orthogonal arrays so that we can estimate machining performances of each electrode. Coating wire shows better performances than brass wire in cutting speed but it produces poor surface roughness, and two wires shows similar performance in straightness

Quality Improvement of Black Oxide Process in Casting (주조품 Black Oxide 공정의 품질개선에 관한 연구)

  • Lee, Dong Hee;Lee, Kyung Keun;Yun, Won Young
    • Journal of Korean Society for Quality Management
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    • v.24 no.1
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    • pp.96-109
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    • 1996
  • In this paper, we consider the quality problem of black oxide process in casting for which Taguchi method is used. We explain simply the Taguchi method and existing problems in Black Oxide process. We analyze the problem by the quality improvement procedure proposed by Taguchi. The design factors and noises using cause-effect diagram are found, the experiment is made using orthogonal array. After ANOVA, the critical factors are determined and the optimal process condition is designed. After parameter design, we derive the tolerance levels. As a result of changing the levels of process parameters, the variance of quality characteristic was decreased by quarter and the average value was also decreased by half. We estimated the predictable profit of the improvement.

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Estimation of b-value for Earthquakes Data Recorded on KSRS (KSRS 관측자료에 의한 b-값 평가)

  • 신진수;강익범;김근영
    • Proceedings of the Earthquake Engineering Society of Korea Conference
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    • 2002.09a
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    • pp.28-34
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    • 2002
  • The b-value in the magnitude-frequency relationship logN(m) = $\alpha$ - bmwhere N(m) is the number of earthquakes exceeding magnitude m, is important seismicity parameter In hazard analysis. Estimation of the b-value for earthquake data observed on KSRS array network is done employing the maximum likelihood technique. Assuming the whole Korea Peninsula as a single seismic source area, the b-value is computed at 0.9. The estimation for KMA earthquake data is also similar to that. Since estimate is a function of minimum magnitude, we can inspect the completeness of earthquake catalog in the fitting process of b-value. KSRS and KMA data lists are probably incomplete for magnitudes less than 2.0 and 3.0, respectively. Examples from probabilistic seismic hazard assessment calculated for a range of b-value show that the small change of b-value has seriously effect on the prediction of ground motion.

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A study on the optimized bead geometry using Taguchi method (Taguchi 방법을 이용하여 최적의 비드형상 예측에 관한 연구)

  • ;;;;Yu Xye
    • Proceedings of the KWS Conference
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    • 2003.11a
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    • pp.169-171
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    • 2003
  • In this paper, the prediction for the optimized bead geometry such as bead width, height, penetration and bead area in the Gas Metal Arc (GMA) welding with Taguchi method is presented. An orthogonal array, and the Signal-to-Noise (S/N) ratio employed to investigate the welding quality characteristics together in the selection of process parameters in the GMA welding process, to analyze the effect of each process parameter on the bead geometry and to finally determine the process parameters with the optimal bead geometry. Experimental results fi-om this research show that the Taguchi method provides an effective tool to enhance the accuracy of the optimized bead geometry.

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Effect of Test Parameter on Ball Shear Properties for BGA and Flip Chip Packages (BGA 및 Flip Chip 패키지의 볼전단 특성에 미치는 시험변수의 영향)

  • Gu, Ja-Myeong;Jeong, Seung-Bu
    • Proceedings of the KWS Conference
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    • 2005.06a
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    • pp.19-21
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    • 2005
  • The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

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Electrical Parameter Extraction of High Performance Package Using PEEC Method

  • Pu, Bo;Lee, Jung-Sang;Nah, Wan-Soo
    • Journal of electromagnetic engineering and science
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    • v.11 no.1
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    • pp.62-69
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    • 2011
  • This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

Wall Superheat Effect on Single Bubble Growth During Nucleate Boiling at Saturated Pool (풀 핵비등시 단일 기포 성장에 대한 벽면 과열도의 영향에 관한 연구)

  • Kim Jeong bae;Lee Han Choon;Kim Moo Hwan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.29 no.5 s.236
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    • pp.633-642
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    • 2005
  • Nucleate pool boiling experiments for R11 under a constant wall temperature condition were carried out. A microscale heater array was used for the heating and the measurement of high temporal and spatial resolution by the Wheatstone bridge circuit. Very sensitive heat flow rate data were obtained by the control for the surface condition with high time resolution. The measured heat flow rate shows a discernable peak at the initial growth stage and reaches an almost constant value. In the thermal growth region, bubble shows a growth proportional to $t^{\frac{1}{5}}$. The bubble growth behavior is analyzed with a dimensionless parameter to compare with the previous results in the same scale. As the wall superheat increases, the departure diameter and the departure time increase, and the waiting time decreases. But the asymptotic growth rate is not affected by the wall superheat change. The effect of the wall superheat is resolved into the suggested growth equation. Dimensionless parameters of time and bubble radius characterize the thermal growth behavior well, irrespective of wall condition. The comparison between the result of this study and the previous results shows a good agreement at the thermal growth region. The quantitative analysis for the heat transfer mechanism is conducted with the measured heat flow rate behavior and the bubble growth behavior. The required heat flow rate for the volume change of the observed bubble is about twice as much as the instantaneous heat flow rate supplied from the wall.

Development of Multi Dielectric Barrier Discharge Plasma Reactor for Water Treatment (수처리용 다중 유전체 방벽 방전 플라즈마 반응기 개발)

  • Kim, Dong-Seog;Park, Young-Seek
    • Journal of Environmental Science International
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    • v.22 no.7
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    • pp.863-871
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    • 2013
  • Dielectric discharges are an emerging technique in environmental pollutant degradation, which that are characterized by the production of hydroxyl radicals as the primary degradation species. For practical application of the plasma reactor, reactor that can handle large amounts of water are needed. Plasma research to date has focused on small-scale water treatment. This study was carried out basic study for scale-up of a single DBD (dielectric barrier discharge) plasma reactor. The degradation of N, N-Dimethyl-4-nitrosoaniline (RNO, indicator of the generation of OH radical) was used as a performance indicator of multi-plasma reactor. The experiments is divided into two parts: design parameters [effect of distance of single plasma module (1~14 cm), arrangement of ground electrode (single and multi), rector number (1~5) and power number (1~5)]; operation parameter [effect of applied voltage (60~220 V), air flow rate (1~5 L/min), electric conductivity of solution ($1.4{\mu}S/cm$, deionized water)~18.8 mS/cm (addition of NaCl 10 g/L) and pH (5~9)]. Considering the electric stability of the plasma reactor, optimum spacing between the single plasma module was 2 cm. Multi discharge electrodes - single ground electrode array was selected. Combination of power 3-plasma module 5 was the optimal combination for maximum RNO degradation. The optimum 1st voltage and air flow rate for RNO degradation were 180 V and 4 L/min, respectively. The pH and conductivity of the solution was not influencing the RNO degradation.