• 제목/요약/키워드: panel size

검색결과 872건 처리시간 0.024초

Fabrication of Test Panel for AMOLED driven by Pentacene TFTs

  • Ryu, Gi-Seong;Byun, Hyun-Sook;Xu, Yong-Xian;Choe, Ki-Beom;Song, Chung-Kun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.1034-1037
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    • 2004
  • In this paper we fabricated a test panel for AMOLED on glass and PET substrate. The test panel consisted of the various size of OTFTs and OLEDs and the current driving capability of OTFTs for OLEDs has been investigated. OTFTs were made of the inverted staggered structure and employed polyvinylphenol (PVP) as the gate insulator and pentacene thin film as the active layer. The OTFTs produced the filed effect mobility of 0.3$cm^2$/V.sec and on/off current ratio of $10^5$. OLEDs consisted of TPD for HTL and Alq3 for EML with 35nm thick, generating green monochrome light. We found that OTFT with channel length of 70${\mu}m$and channel width of over 3.5mm provided the sufficient current to OLED to generate the luminescence of 0.3Cd/$m^2$.

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Fabrication of Triode-Type CNT-FED by A Screen-printing of CNT Paste

  • Kwon, Sang-Jik;Shon, Byeong-Kyoo;Chung, Hak-June;Lee, Sang-Heon;Choi, Hyung-Wook;Lee, Jong-Duk;Lee, Chun-Gyoo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.866-869
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    • 2004
  • A carbon nanotube field emission display(CNT FED) panel with a 2 inch diagonal size was fabricated by using a screen printing of a prepared photo-sensitive CNT paste and vacuum in-line sealing technology. After a surface treatment of the patterned CNT, only the carbon nanotube tips are uniformly exposed on the surface. The diameter of the exposed CNTs are usually about 20nm. The sealing temperature of the panel was around 390 $^{\circ}C$ and the vacuum level was obtained with $1.4{\times}10^{-5}$torr at the sealing. The field emission properties of the diode type CNT FED panel were characterized Now, we are developing a triode type CNT FED with a self-aligned gate-emitter structure.

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알루미늄 하니컴 샌드위치 판넬의 저속충격거동 (Low-velocity Impact Behavior of Aluminum Honeycomb Sandwich Panel)

  • 이현석;배성인;함경춘;한경섭;송정일
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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    • pp.78-82
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    • 2001
  • Impact behaviors of Aluminum Honeycombs Sandwich Panel(AHSP) by drop weight test were investigated. Two types of specimens with 1/2" and 1/4" cell size were tested by two impactors which are weight of $5.25\textrm{kg}_{\textrm{f}}$ and $11.9\textrm{kg}_{\textrm{f}}$. Parametric studies were achieved including the impactor weight and impact sites which consist face, long-edge, short-edge, and point of the specimen. Face one of impact sites was the strongest and short-edge one of impact sites was the weakest. The damaged area of AHSP was enlarged with the increase of impactor weight that is equal to impact energy. After 3 point bending test, fracture modes of AHSP were analyzed with AE counts. Lower facesheet was fractured in the long-edge direction and then separated between facesheet and core. In the short-edge direction after core wrinkled, lower facesheet tear occurred. Impact behavior by FE analysis were increased localized damage in fast velocity because the faster velocity of the impact was, the smaller the stress of core was. Consequently, impactor weight had an effect on widely damaged area, while the impact velocity was caused on the localized damaged area.aged area.

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광생물반응기에서 도광판의 두께가 Chlorella vulgaris 증식에 미치는 영향 (Influence of Thickness of Optical Panel on the Growth Rate of Chlorella vulgaris in Photobioreactor)

  • 최희정;이승목
    • 한국물환경학회지
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    • 제29권2호
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    • pp.270-275
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    • 2013
  • The aim of this study was to investigate the efficiency of thickness of optical panel (OP) on the growth rate of Chlorella vulgaris. The size of Chlorella vulgaris (FC-16) was $3-8{\mu}m$, having round in shape. The cells of Chlorella vulgaris was cultured in the Jaworski's Medium with deionized water at $22^{\circ}C$ for 15 days. For this experiment, three OP samples were prepared to evaluate the efficiency of thickness of OP on the growth rate of Chlorella vulgaris; 4 mm OP with LED (Light Emitting Diode) (Run 1), 6 mm OP with LED (Run 2) and 8 mm with LED (Run 3). The diffuse rate was reached 86%, 91% and 92% for Run 1, Run 2 and Run 3, respectively. Average biomass of Run 2 and Run 3 were measured 11.18% higher than that of Run 1. However, the specific growth rate for all fractions were almost same. In addition, chlorophyll content per cell and cell volume were found to be slice difference between Run 2 and Run 3. Therefore, Run 2 has more effect on growth rate of biomass for Chlorella vulgaris than Run 1 and Run 3.

A Study on the Productivity Measurement and Effect Factors of Management Evaluation in Public Firms with a Focus on the Port Authorities

  • Eom, Ki-Yong;Ahn, Ki-Myung
    • 한국항해항만학회지
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    • 제44권5호
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    • pp.400-406
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    • 2020
  • In this study, we first measured the malmquist productivity index by DEA among the Korean public firms. Second, there are 12 public corporations whose productivity (MPI) has decreased compared to 2014. This is mainly because of a decrease in productivity, as well as a decrease in the technical efficiency change index (TECI), impacted by the internal environment, and the increase in productivity because of an increase in the technology change index (TCI) impacted by the external environment. Finally, the analysis of the impact on the management assessment scores showed that the productivity (MPI), scale efficiency (CRS), size of sales, operating profitability, and total capital investment efficiency are significantly related (+), except for the asset turnover, which is a static financial ratio. Meanwhile, the management evaluation scores between the high-productivity public corporations and low-performing public corporations were significantly discriminating. Thus, it is confirmed that the nation's state-run companies must manage their MPIs in a time series to score high in management evaluation.

어린이용 환자복 디자인 개발 방법에 대한 연구 (A Study on Developing a Child Hospital Gown)

  • 서동애;천종숙
    • 한국의류학회지
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    • 제21권5호
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    • pp.854-864
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    • 1997
  • This study was initiated to develop a uniform design suitable for child inpatients. The experimental hospital inpatient uniform design was developed based on the results of the prior studies. The panel was composed of 5 experienced nurses and 5 clothing specialists. They evaluated the function of the experimental inpatient uniforms developed in this study. The experimental hospital gown design was reformed based on the panel's evaluation.1'hen the child inpatients performed the wear test for the reformed experimental hospital gown. The results of the study are as follows; 1. The child inpatient hospital gown design of the most hospitals were similar to the adult patient's uniform : the V-neckline shirts with full length set-in sleeves. The bottom was full length pull-on pants. The fabric was white cotton with blue hospital logo and stripe print in most cases. 2. The panel's specialty affected the evaluation of the uniform design. The nurses concerned about the durability after washing and ease for medical treatment. The clothing specialists cared about the features related to the clothing construction and ease for physical movement of body. 3. The most preferred hospital inpatient uniform design by the panels was the shirts or one- piece gown with three-quarter length sleeve and overarm seam opening. 4. The researchers developed one-piece dress gown for the children under two years old. Three different size pajamas were developed for children 2∼5 years old,5∼8 years and 8∼12 years old.

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Ag 파우더 특성에 따른 터치 패널용 그라비어 오프셋 인쇄의 전도성 페이스트의 제조 및 물성 연구 (A Study on the Characteristics and Property of Gravure Off-set Printing Conductive Paste for Touch Panel by Ag Powder Characteristic)

  • 송재형;장아람;김성빈;남수용
    • 한국인쇄학회지
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    • 제29권2호
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    • pp.45-58
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    • 2011
  • Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

Development and Policy of Proper Management Estimation of Domestic Service Industry in Comparison with OECD Countries for Advancement of Korean Service Industry

  • Suh, Geun-Ha;Yoon, Sung-Wook
    • 유통과학연구
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    • 제12권11호
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    • pp.25-34
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    • 2014
  • Purpose - Considering that the governments' official statistics on the optimum scale of the domestic service industry will be crucial in future, this study's results will be used as an important benchmark to develop and verify the parameters in the government's official statistics. Research design, data, and methodology - To identify the appropriate scale of Korea's service industry and its adequacy, I have determined them through estimation using a regression method involving panel data analysis on the panel data of 30 OECD countries. Results - The regression coefficient provided indications of being non-linear. This means that a U-shaped curve relationship exists-that is, the level of the economic growth leverage decreases along with the service industry's growth up to the level of 70.9% in terms of the Korean service industry's adequacy; it increases along with the service industry's growth at a level higher than 70.9%. Conclusions - While the current proportion of the size of the service industry among all industries in Korea stands at 50.7%, its proper proportion estimated by a regression analysis was 70.9%.

Evaluation of the 256ch Flat Panel PS-PMT on Positioning Image Histogram for PET

  • Orita, Narimichi;Murayama, Hideo;Kawai, Hideyuki;Inadama, Naoko;Umehara, Takaya;Kasahara, Takehiro;Tsuda, Tomoaki
    • 한국의학물리학회:학술대회논문집
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    • 한국의학물리학회 2002년도 Proceedings
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    • pp.324-327
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    • 2002
  • For a next generation PET that realizes high sensitivity and high resolution, we proposed a design of a depth of interaction detector. A unit of the detector is constructed of four stages rectangular blocks of 2 by 2 Gd$_2$SiO$\sub$5/: Ce (GSO) crystal array optically coupled to position sensitive photomultiplier tube (PS-PMT). The 256ch flat panel PS-PMT is under development by Hamamatsu Photonics K.K., JAPAN. It has large cathode area, 51.7 by 51.7 mm$^2$, and the ratio of the effective area to external size is about 90%. The feature will contribute high packing fraction, accordingly high sensitivity. The 256 anodes are arranged in 16 by 16 at intervals of 3.0 mm. So as to evaluate the detector capability for identifying crystal of interaction, we got positioning image histograms with coupling a 16 by 5 array of GSO crystals, 2.9 by 2.9 by 7.5 mm$^3$, to the PS-PMT by irradiating a gamma ray uniformly from a point source. Flat panel PS-PMT is a new promising device for PET. We need to evaluate it if its performance is sufficiency. The performance was compared to the one with a 16ch PS-PMT.

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미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성 (Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps)

  • 최재훈;전성우;정부양;오태성;김영호
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.103-105
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    • 2003
  • COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

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