• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.277-280
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• 2004

Thin-film photosensors on organic light emitting diode (OLED) glass substrates using active-matrix OLED TFT manufacturing processes have been constructed and optimized, and their performance has been characterized. Suitable control circuitry and applications are proposed. The photosensors may be integrated into OLED displays for detection of ambient illumination and for detection of OLED light emission, thereby enabling output, uniformity, and aging compensation.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1004-1006
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• 1998

Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

• 한국정보디스플레이학회:학술대회논문집
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• 2001.08a
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• pp.3-8
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• 2001

This paper will review the state of the latest development of AMLCD manufacturing facilities for large Substrate and discuss the future technologies. The trend of the display size enlargement of Note book PC has hauled the enlargement of the mother glass substrate in past 10 years. The enlargement of a substrate size has brought about the productivity improvement of the TFT panel with process innovation as yet. Will this trend be continuing hereafter too? The issues of the processing and facilities related with the large square substrate and mask step reduction will be overviewed and the future processing and facilities will be discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.477-479
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• 2006

In this study, a stripe type counter electrode discharge cell for PDP was attempted to realize high luminance efficiency and low firing voltage for fine pitch discharge cells. The cells were prepared using electroplated Cu/Ni electrodes coated with glass dielectric layer. The discharge behaviors of such cells were observed. These results indicate that the counter electrode discharge cells have different discharge behavior compared with coplanar cells, which may affect the luminance efficiency of the panel.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1791-1794
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• 2006

For system-on-glass (SoG) with low-temperature poly-silicon (LTPS) thin film transistor (TFT), a new system interface architecture and timing controller are developed. With the newly developed system interface architecture, line memory can be eliminated which would take large area of SoG display panel. The system interface and timing controller are targeted for the application for 6-bit gray scale, 60-frames/s qVGA format.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.795-798
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• 2003

Inside of working PDP, there exist highly reactive conditions in the gap between two glass panels. MgO layer and phosphor have been investigated as a function of discharge and temperature. A drastic reduction in carbon impurity was observed on the surfaces after discharging and heat treatment. Carbon composition on the MgO and phosphor is a dominant factor for their instability

• 제어로봇시스템학회:학술대회논문집
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• 1989.10a
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• pp.206-210
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• 1989

In automobile glass fitting the stud is welded on the window seating panel in order to insert the plastic molding onto the stud. Since this type of process is in general manually done, almost 50% of the output turns out to be failure resulted from work inefficiency and weld inferiority. Therefore, it is required to improve this process for the productivity elevation through the application of the robot.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.717-718
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• 2009

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2012.04a
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• pp.333-336
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• 2012

ISO 13784-1 sandwich panel tests were conducted by FILK, KICT in Korea, SP in Sweden and CSIRO in Australia. Sandwich panels composed of steel sheets, EPS and glass wool supplied by FILK were tested. Mainly heat release rate was compared and equlity of distribution also analyzed on the point of statistical view based on ISO.