• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.1-8
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• 2012

This paper presents a fully-integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also proposes a low-swing gate driver for efficient regulation of high-frequency switching converters. The low-swing driver uses the voltage drop of a diode-connect transistor. The proposed converter is designed and fabricated using a $0.13-{\mu}m$ CMOS process. The fully-integrated buck converter achieves 68.7% and 86.6% efficiency for 3.3 V/2.0 V and 2.8 V/2.3 V conversions, respectively.