• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.15-22
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• 2019

In these days, importance of the power electronic devices and modules keeps increasing due to electric vehicles and energy saving requirements. However, current silicon-based power devices showed several limitations. Therefore, wide band gap (WBG) semiconductors such as SiC, GaN, and $Ga_2O_3$ have been developed to replace the silicon power devices. WBG devices show superior performances in terms of device operation in harsh environments such as higher temperatures, voltages and switching speed than silicon-based technology. In power devices, the reliability of the devices and module package is the critically important to guarantee the normal operation and lifetime of the devices. In this paper, we reviewed the recent trends of the power devices based on WBG semiconductors as well as expected future technology. We also presented an overview of the recent package module and fabrication technologies such as direct bonded copper and active metal brazing technology. In addition, the recent heat management technologies of the power modules, which should be improved due to the increased power density in high temperature environments, are described.

• 마이크로전자및패키징학회지
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• 제17권2호
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• pp.29-33
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• 2010

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.11-18
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• 2022

최근 세계적으로 유연 전자소자 관련 기술들이 주목을 받으면서 유연소자 제작 과정에서의 성형성 및 굽힘 상태에서의 성능과 내구성 등의 문제점을 개선하기 위하여 액체 금속을 사용한 배선·접합 기술들의 개발이 요구되고 있다. 이러한 요구에 부응하여 독성이 없으면서 낮은 점도와 우수한 전기전도도를 가지는 갈륨 및 갈륨계 합금 (공정 갈륨-인듐 및 공정 갈륨-인듐-주석 등)의 액체금속을 저온 접합소재로 이용하려는 다양한 연구들이 이루어지고 있다. 본 논문에서는 갈륨 및 갈륨계 합금을 이용한 저온접합 기술의 최신 연구동향을 정리하여 소개하고자 한다. 이러한 기술들은 향후 유연 전자소자의 제조 및 전자패키지에서의 저온접합 등의 분야에서 실용화를 위한 중요한 기반기술이 될 것으로 예상된다.

• 한국포장학회지
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• 제29권2호
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• pp.111-118
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• 2023

본 연구에서 연속형 레이저와 나노초 레이저의 경우에는 고분자와 물성 조건이 맞지 않아서, 고분자 필름 표면에 특정 패터닝이 구현되지 않았다. 그러나, 펨토초 레이저를 활용하여 HDPE, PP, PET 등의 식품포장 필름의 표면에 패터닝이 구현됨을 확인하였다. 따라서, 본 연구에서 식품포장 필름에서 펨토초 레이저 패터닝 공정 조건을 확립하였고, 싱글 펄스에 의한 대면적 원형 패턴, 싱글 펄스를 30%를 중첩한 대면적 거칠기 패턴, 직선 패턴, 직선 패터닝을 중첩한 대면적 거칠기 패턴, 직선 패터닝을 교차하여 격자 패턴 등의 표면 패터닝 필름을 제작하였다. 또한, 표면 패턴 구조와 크기에 따른 패터닝 HDPE, PP, PET 필름은 SEM, AFM, 접촉각 분석을 통하여 그 특성을 확인하였다. 펨토초 레이저 패터닝을 하지 않은 각 대조군 필름의 표면 대비 대면적 원형 패터닝 HDPE 및 PP 필름, 싱글 펄스를 30%를 중첩한 대면적 거칠기 패터닝 및 직선 패터닝을 중첩한 대면적 거칠기 패터닝 PET 필름의 표면은 27.1-37.5°의 접촉각을 나타냄으로써, 패터닝 후에 HDPE, PP, PET 필름은 친수성 표면으로 변화되었다. 반면, 나노-마이크로 크기의 돌기 표면구조를 갖고 있는 대면적 격자 패터닝 HDPE 필름의 경우에는 120.4°의 접촉각을 보임으로써, 패터닝 후에 소수성 표면으로 변화되었다. 따라서, 패터닝을 통해 친수성 표면으로 바뀐 필름들은 단백질, 세포, 바이러스 등을 비롯하여 식품의 물질들이 달라붙지 못하거나, 쉽게 떨어지는 엔티파울링 응용분야에 활용이 가능하다. 또한, 향후 좀더 정밀한 나노 및 마이크로 돌기 구조를 갖는 격자 패터닝을 통해 150° 이상의 초소수성 표면을 제작하게 된다면, 자가 청소(Self-cleaning) 등의 초소수성 표면 응용분야에 활용 가능할 것이다.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.9-19
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• 2020

기능성 나노박막을 손상 없이 목표기판으로 옮기는 전사 기술은 나노박막 기반의 차세대 응용 제품 개발을 위한 초석이다. 본 논문에서는 최근 나노박막 전사의 연구 동향을 박막-기판 계면의 박리 원리에 따라 습식 식각 전사, 전기화학적 박리, 기계식 전사 방법 세 가지로 분류하여 간단하게 살펴볼 것이다. 더 나아가, 손쉽고, 기판 재활용이 가능하며, 광범위한 적용 가능성을 가지고 있어 유망 기술로 간주되는 기계식 전사 방법에 대하여 파괴 역학적 관점에 초점을 맞추어 다룰 것이다. 마지막으로, 나노박막의 기계식 전사 방법의 기술 성숙도를 향상시키기 위한 향후 도전 과제와 방향성에 대하여 고찰하고자 한다.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.1-12
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• 2021

3차원 인쇄 기술은 제품의 설계를 3차원으로 하여 조립없이 제품의 생산까지의 시간을 획기적으로 줄이고 복잡한 구조도 구현할 수 있어 미래의 기술로 각광받고 있다. 본 논문은 3차원 인쇄기술을 이용한 전자소자에 대한 최근 연구동향을 알아보면서 구성품, 전원공급장치와 회로에서의 연결과 3차원 인쇄기술 PCB의 응용한 연구논문들을 소개하고 있다. 3차원 인쇄기술로 제작한 전자소자는 원스톱으로 전자소자, 솔더링(soldering), 스태킹(stacking), 회로의 봉지막(encapsulation)까지 제작함으로써 생산설비의 단순화와 전자기기를 개인 맞춤형을 할 수 있는 가능성을 보여주었다.

• Journal of Dairy Science and Biotechnology
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• 제41권4호
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• pp.219-229
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• 2023

Consumer demand for products with health benefits and natural ingredients is significant for the expansion of functional foods. Edible films and coatings are an excellent way to diversify the market for functional foods and as substitutes for the prevailing packaging and products. Incorporation of whey protein (WP) and its active ingredients into edible films and coatings is a promising technique that can be applied to various food products. Numerous combinations can be used on an industrial scale depending on the purpose, product, nature of the film, type of active ingredient, and type of inclusions. In this review, we describe several characteristics of edible WP films and coatings used as novel packaging materials. WP-based packaging can play a beneficial role in sustainability because of the option of recycling materials rather than incinerating, as in synthetic laminates, because of the use of natural byproducts from the food industry as raw materials. However, cost-effectiveness is a driving force against industrial setbacks in current and future WP processing developments. The industrial application of this new technology depends on further scientific research aimed at identifying the mechanism of film formation to improve the performance of both the process and product. Furthermore, research such as consumer studies and long-term toxicity assessments are required to obtain significant market shares.

• Journal of Biosystems Engineering
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• 제30권6호통권113호
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• pp.347-353
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• 2005

Paper angle, environment friendly packaging material, has been mainly used as an edge protector, But, in the future, paper angle will be applied to package design of heavy product such as strength reinforcement or unit load system (ULS). Therefore. understanding of buckling behavior fur angle itself, compression strength and quality standard are required. The objectives of this study were to characterize the buckling behavior by theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, as applied load level was bigger and/or the length of angle was longer, incresing rate of buckling of asymmetric paper angle was higher than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia significantly increased as the extent of asymmetric angle increased, and buckling orientation of angle was open- direction near the small web. Incresing rate of maximum compression strength (MCS) for thickness of angle decreased as the web size increased in symmetric angle. MCS of asymmetric angle of 43${\times}$57 and 33${\times}$67 decreased $15{\~}18\%$ and $65{\~}78\%$, and change of buckling increased $12{\~}13\%$ and $62{\~}66\%$, respectively.

• 한국포장학회지
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• 제30권1호
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• pp.53-62
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• 2024

Molded pulp products has become more attractive than traditional materials such as expanded polystyrene foam (EPS) owing to low-priced recycled paper, environmental benefits such as biodegradability, and low production cost. In this study, various design factors regarding compression and cushioning characteristics of the molded pulp cushion with truncated pyramid-shaped structural units were analyzed using a test specimen with multiple structural units. The adopted structural factors were the geometric shape, wall thickness, and depth of the structural unit. The relative humidity was set at two levels. We derived the cushion curve model of the target molded pulp cushion using the stress-energy methodology. The coefficient of determination was approximately 0.8, which was lower than that for EPS (0.98). The cushioning performance of the molded pulp cushion was affected more by the structural factors of the structural unit than by the material characteristics. Repeated impacts, higher static stress, and drop height decreased the cushioning performance. Its compression behavior was investigated in four stages: elastic, first buckling, sub-buckling, and densification. It had greater rigidity during initial deformation stages; then, during plastic deformation, the rigidity was greatly reduced. The compression behavior was influenced by structural factors such as the geometric shape and depth of the structural unit and environmental conditions, rather than material properties. The biggest difference in the compression and cushioning characteristics of molded pulp cushion compared to EPS is that it is greatly affected by structural factors, and in addition, strength and resilience are expected to decrease due to humidity and repetitive loads, so future research is needed.