• 한국포장학회지
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• 제24권3호
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• pp.141-148
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• 2018

Photo-oxidation is one of the main causes of food deterioration of great variety of foods, such as dairy products, nuts, meat products, and wine. It causes a loss of both nutritional value and sensorial quality of products and may even leads to the formation of toxic compounds. Active packaging for food and beverages has been investigated and developed with embedding light absorbers or blocking materials into the plastics. In recent years, several novel light barrier materials have been proposed as an alternative option for different applications. This article reviews the up-to-date technology in light absorber and blocking material with special emphasis on chemical compound and mechanism. Inorganic, organic, hybrid organic-inorganic, and natural light absorbers were scoped. The challenges and future perspectives of light barrier materials are also discussed.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• 한국포장학회지
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• 제15권2호
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• pp.67-73
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• 2009

The introduction of radio frequency identification (RFID) technology into cold chain system will be essentials for the better quality preservation of chilled products in the near future. The object of this study is to analyze the trends of international standardization activity for cold chain system and RFID packaging. The standardization of RFID technology is related to SC31 of ISO/IEC JTC1. The established standard from EPCglobal includes the air interface of UHF substitute actors, the control of EPC tag data and the event collected from RFID readers, the directory services and information storage of ONS and EPCIS, and securities. Also, EPC standards include the sensor functions of the cold chain. In Korea, the RFID packaging related techniques and their engineering standard are less studied as compared with Europe or North America. For effective application of RFID in the cold chain and packaging, scientific and systematic researches on RFID, including technical standards for domestic RFID frequency, will be key elements for preoccupation of these application techniques.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• 한국포장학회지
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• 제15권1호
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• pp.7-16
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• 2009

The purpose of this study was to evaluate current packaging modules and design the most acceptable packaging module for domestic and international distribution systems. An optimum packaging module can reduce package costs as well as total distribution costs such as transport, materials handling and warehouse costs. Three different sizes of packaging modules, namely U-type($600{\times}500\;mm$), K -ype($550{\times}366\;mm$) and I-type($600{\times}400\;mm$), were evaluated in terms of the area efficiency and MOEs(measures of effectiveness) for the T-11($1100{\times}1100mm$) and T-12($1,200{\times}1,000\;mm$) pallets. The results showed that the U-type module could fit very well for both pallets and the area efficiency of each module was more than 99 percents. Area efficiency of K-and I-type modules was greatly affected by the pallet footprint dimensions. U-type module also performed better result from MOEs evaluation. Twenty sub-multiple sizes derived from the U-type module were suggested for the future development of the Korean and ISO standards on dimension of transport packages.

• 한국포장학회지
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• 제29권3호
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• pp.163-174
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• 2023

Though box compression strength (BCS) is commonly used as a performance criterion for shipping containers, estimating BCS remains a challenge. In this study, artificial neural networks (ANN) are implemented as a new tool, with a focus on building up ANN architectures for BCS estimation. An Artificial Neural Network (ANN) model can be constructed by adjusting four modeling factors: hidden neuron numbers, epochs, number of modeling cycles, and number of data points. The four factors interact with each other to influence model accuracy and can be optimized by minimizing model's Mean Squared Error (MSE). Using both data from the literature and "synthetic" data based on the McKee equation, we find that model estimation accuracy remains limited due to the uncertainty in both the input parameters and the ANN process itself. The population size to build an ANN model has been identified based on different data sets. This study provides a methodology guide for future research exploring the applicability of ANN to address problems and answer questions in the corrugated industry.

• 식품과학과 산업
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• 제50권3호
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• pp.39-50
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• 2017

In order to secure competitiveness of the home meal replacement (HMR) industry from a long-term perspective, development of packaging and processing technologies must be achieved. The development of technology that can secure freshness, nutrition, and taste but secures the shelf life is the key to the future growth of HMR. The future of HMR can be considered in terms of nutrition, environment and safety. From the nutritional point of view, it is expected that development of healthy HMR such as low-salt, low-sugar, low-fat, and high fiber and premium HMR with functional ingredient enhanced, and personalized HMR for silver, infant and patients will be done. And it is expected that development of HMR utilizing environmentally friendly food or local food, development of energy reduction and environmentally friendly disinfection technology, development of environmentally friendly packaging material, and providing information on HMR preparation using QR code and RFID from the environmental and safe point of view.

• 한국식생활문화학회지
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• 제30권1호
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• pp.1-7
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• 2015

Traditional cuisine reflects cooking traditions shaped by political, economic, social, cultural, and environmental conditions characterized by authenticity and uniqueness. Traditional food is not only a part of our cultural heritage but also a knowledge resource. Application of food science and technology in Korean traditional foods was reviewed from six points of view, including food preservation, fermentation, changes in food materials, utilization of food functionality, and packaging and development of cooking appliances. Books from disparate times were chosen in order to cover a wide range of materials from the past to the present. Food preservation and fermentation techniques were applied to various food materials. Combination of science and skills contributes to the accessibility of diverse food materials and better quality foods. Koreans use assorted and resilient plants, which have an abundance of functional substances such as food materials. Among cooking appliances, microwave oven and refrigerator are the most innovative products with huge influences on food eating patterns as well as lifestyle. Packaging effectively reduces post-harvest preservation losses, and better packaging has technical improvements for storage and distribution. Kimchi was chosen as an example in order to study technology from the past to the present. Availability of Kimchi cabbage, enrichment of functional ingredients, identification of useful microbial species, standardization of recipe for commercialization, prevention of texture softening, introduction of salted Kimchi cabbage and Kimchi refrigerators, and packaging were reviewed. The future of traditional foods in the market will be competitive. First, traditional foods market should be maintained to protect the diversity of food materials. Secondly, tailored foods for individuals should be considered using foods with functional properties. Information on health benefits would provide insights into health and traditional food products. Third, speedy transfer of new technology to the traditional food industry is needed to ensure food quality production and new opportunities in the market. Fourth, safety of traditional foods should be ensured without sacrificing the essential characteristics of culturally important foods. Improvement of logistics, distribution, and facility should be carried out. As demand for convenience foods increases, traditional foods should be developed into products.

• 산업식품공학
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• 제14권4호
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• pp.283-291
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• 2010

Currently, nanotechnology is widely applied in various industrial fields and is rapidly emerging as a promising future technology. In food industries, nanotechnology is used to enhance food quality and safety. Numerous cutting-edge studies on the advantages of nanotechnology have been conducted in the fields of food processing, food ingredients and additives, food packaging, and food engineering for optimal health. The market for these areas of research has grown steadily, and is expected to continue to do so. Because of this, R&D for nanotechnology that can be used effectively in food industries is being performed by several companies, as well as in academic research institutions around the world. This review describes the recent global R&D trends that have been in progress for two key areas: food processing and food packaging.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.1-7
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• 2012

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.