• The monthly packaging world
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• s.271
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• pp.69-73
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• 2015

• The monthly packaging world
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• s.319
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• pp.77-91
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• 2019

• The monthly packaging world
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• s.343
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• pp.82-87
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• 2021

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.14 no.1
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• pp.1-8
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• 2008

New concepts and solutions for the Flexible Food Packaging Design have been demanded to meet the various customer's needs and to compete with other worldwide products. Future-oriented designs beyond the basic functions of preserving and protecting contents can only meet the demands on product's reliability and consumer's satisfaction, specially considering environmental issues. This study is to describe the spiritual values of Korean Flexible Food Packaging Design on the basis of comprehensive understanding and to identify the process of changes and developments. The thesis also forecasts the future of Flexible Food Packaging. Little progress in the Flexible Food Packaging has been made because of the slow response, only to meet the increasing demand without any statistical or theoretical study. On the contrary, Korean Flexible Food Packaging Design has been developed by imitating foreigners' and made mistake of not creating original design reflecting a native traditional culture. This study researches the roles of food-classified flexible packaging to predict the near future trend of packaging industry classifying those into functional, visual, environmental and industrial aspects.

• Korean journal of food and cookery science
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• v.16 no.6
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• pp.548-556
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• 2000

To examine the opinions of consumers concerning the ricecake as a traditional food, we conducted the study of the cognition and interests of children and mothers ricecake for its popularization. Our subjects of study were elementary school children as the future consumers and their mothers as the present consumers. The results were as follows: children favored to eat much more western style food and sweet food than did mothers. All of children and mothers liked traditional food and ricecake, but children did not know how to prepare the traditional food and ricecake, indicating thenecessity of the education of ricecake-making. All of them were satisfied with the taste of ricecake 'on sale, but not with packaging designs and price of ricecake. Development of packaging designs was required for popularization of ricecake to spread worldwide.

• The monthly packaging world
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• s.288
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• pp.55-64
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• 2017

• The monthly packaging world
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• s.215
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• pp.42-43
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• 2011

• Journal of the Korean Society of Floral Art and Design
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• no.43
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• pp.81-100
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• 2020

Since sustainable packaging of flower basket designs that are sold from florist shops is needed for both the seller and the buyer, studying of second packaging of flower basket design has begun. In this study, based on the survey that has been done in 2019, and the analysis of the interview that has been done in 2020, the suggestion of sustainable packaging development is the purpose. The definition of flower basket design was done and surveys of the status of domestic flower basket designs' second packaging were done in accordance with the type of basket which is an object, transportation, and characteristic of a florist shop. For sustainable packaging, based on physical theory, second packaging which depends on the packaging that includes design factor, transportation final destination has to be different. The factors to be considered as sustainable packaging are the quality of opaque paper, the necessity of first packaging, packaging structure that can fix an object, the form of second packaging influenced by types of transportation. Suggestions for packaging development included new materials for first packaging, eco-friendly objects that can be recycled and reused, structural packaging design, standardization and variability of packaging, protection of floristry which is the fundamental purpose of packaging, and brand advertisement effect. Based on the result of this study further designs of packaging will be commercialized. This study is significant for serving the opportunity of new packaging design for futuristic floristry that fit for unmanned system and studying of categories of products.

• Journal of Korean Society of Rural Planning
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• v.20 no.3
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• pp.191-199
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• 2014

The current rural conditions are undergoing the change from the past production-intensive structure to an integral and complex one of producing, processing, selling, touring and lodging owing to the changes of life-style, consumption trend and social environments. The rural area is developing into a community of rural tourism villages to grow into one management system along with the assistance of the government's various supporting projects. Through this, the rural designing has got to play a significant role as one of the factors of the enhancement of competitiveness and the increase of income. Therefore, those previous studies on the variety and possibility of rural development are being employed for the researches which are to develop techniques of branding, marketing and packaging. In particular, the researches for VI (Village Identity), BI (Brand Identity) and designs of landscaping, packaging of agricultural specialties and display stores, which definitely shows that the importance of rural designing, is being paid a lot more attention to. Thus, this study has verified the site commercialization and its effect by developing some practical designing with the focus of package design at rural tourism villages. The Okgye Village in Yoncheon was selected for study subject based on the result of status investigation. This study has analyzed such problems as lack of village identity, non-description of items and their indispensible marks which were seen their designs of village and packaging. The colors of major items and the village image being substituted into the image scale of IRI color were estimated so that the appropriate colors might be selected, along with which the shapes of major items were decided to be motif for the village symbol and design to be created. The designs of such major items as grains, greens and sauces were created with the consideration of the easiness of loading, the continuity of using and the aesthetics. For grains, those outer boxes which are possible for set-packaging and small-sized packaging have been developed. For greens were developed the boxes with the structure of the permeability for the persisten't quality as well as the possibility for packaging small amount. In case of sauces, those outer-boxes equipped with fixing tray were made with the transport-convenience taken into consideration. The sticker-label designs for all those three were also developed which stand for the village identity and are conveniently used in each farm family. When this development was applied at the sites, it was found that the satisfaction and reliability of consumers as well as the satisfaction of farmers were raised along with the increase by more than 30% after the improvement.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.