• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.14 no.2
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• pp.53-56
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• 2008

Polyvinylchloride(PVC) is variously used to produce food packaging, wrap film, sealing compound of drinking bottle cap. Safety of these PVC food package is controlled by Food Code, PVC regulation. This study was carried out researches on manufacture process, physical, chemical properties and monomer(CAS No., common name, molecular structure) of PVC to help the understanding of PVC material. Also, this study helps us the understanding of regulation through researches on the foundation of PVC regulation, the purpose of test and the comment of test method. It is considered that these informations of material properties and explanations of test method are very useful to PVC producers, users and analyzers of them.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.12
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• pp.2228-2233
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• 2008

This research paper aims to establish a test process of the AFE SiP chip. It measured the sensitivity, current consumption and power consumption both on the evaluation socket board and Catalyst load board. As a result, the sensitivity became deteriorated with an average of 0.2[dBm] at the channel 62 only, the current consumption increased to an average of 0.57[mA] and the power consumption increased to an average of 1.76[mW], But all characteristics incomes the tolerance of the measurement, it also keeps almost the same level. Therefore this design of the test process improved a valid design.

• Corrosion Science and Technology
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• v.18 no.4
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• pp.117-120
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• 2019

Considering the tendency of development of electrification vehicles, development and verification of new evaluation technology is needed because of new technology applications. Recently, as the battery package is set outdoors of an electric vehicle, such vehicles are exposed to corrosive environments. Among major components connected to the battery package, rust prevention of high-voltage cables and connectors is considered the most important issue. For example, if corrosion of high voltage cable connectors occurs, the corrosion durability assessment of using an electric vehicle will be different from general environmental corrosion phenomena. The purpose of this study is to investigate the corrosion mechanism of high voltage cable connectors of an electric vehicle under various driving environments (road surface vibration, corrosion environment, current conduction by stray current, etc.) and develop an optimal rust prevention solution. To improve our parts test method, we have proposed a realistic test method to reproduce actual electric vehicle corrosion issues based on the principle test.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.843-844
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• 2012

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• Korean Journal of Metals and Materials
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• v.46 no.2
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• The monthly packaging world
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• s.206
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• pp.70-75
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• 2010

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.5 no.3
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• pp.199-212
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• 2007

If a type IP-2 transport package were to be subjected to a free drop test and a penetration test under the normal conditions of transport, it should prevent a loss or dispersal of the radioactive contents and a more than 20% increase in the maximum radiation level at any external surface of the package. In this paper, we suggested the analytic method to evaluate the structural safety of a type IP-2 transport package using a thick steel plate for a structure part and a bolt for tying a bolt. Using an analysis a loss or dispersal of the radioactive contents and a loss of shielding integrity were confirmed for two kinds of type IP-2 transport packages to transport radioactive waste drums from a waste facility to a temporary storage site in a nuclear power plant. Under the free drop condition the maximum average stress at the bolts and the maximum opening displacement of a lid were compared with the tensile stress of a bolt and the steps in a lid, which were made to avoid a streaming radiation in the shielding path, to evaluate a loss or dispersal of radioactive waste contents. Also a loss of shielding integrity was evaluated using the maximum decrease in a shielding thickness. To verify the impact dynamic analysis for free drop test condition and evaluate experimentally the safety of two kinds of type IP-2 transport packages, free drop tests were conducted with various drop directions. For the tests we examined the failure of bolts and the deformation of flange to evaluate a loss or dispersal of radioactive material and measured the shielding thickness using a ultrasonic thickness gauge to assess a loss of shielding integrity. The strains and accelerations acquired from tests were compared with those by analyses to verify the impact dynamic analysis. The analytic results were larger than the those of test so that the analysis showed the conservative results. Finally, we evaluated the safety of the type IP-2 transport package under the stacking test condition using a finite element analysis. Under the stacking test condition, the maximum Tresca stress of the shielding material was 1/3 of the yielding stress. Two kinds of a type IP-2 transport package were safe for the free drop test condition and the stacking test condition.

• Transactions of the Korean Society of Mechanical Engineers
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• v.6 no.4
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• pp.384-389
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• 1982

It is necessary that machine tool structures should be designed so that they will cause a minimum chance of machining chatter. In order to do this, a computer program package is developed utilizing Finite Element Method, modal flexibility and energy balance method. Validity of the program package is verified through computer simulation analysis and impulse test of a simplified machine tool structure.

• International Journal of Industrial Entomology and Biomaterials
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• v.3 no.2
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• pp.135-139
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• 2001

Experiments were held in Egypt to test a new Package of practices for commercial cocoon production, including adding secondary macro and micronutrients to the mulberry garden, disease free rearing regime, low temperature rearing in young instars and natural mounting fur silkworms. This package for seed silkworm rearing lead to increase in fecundity by 67-121eggs (15.12-26.22%) and yield of standard boxes per 1 parent egg boxes by 57-58 egg boxes(48.33-51.66%) respectively in comparison th the traditional cocoon production technology.