• Title/Summary/Keyword: package test

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Packaging Criterion for Mid-Size Sedan Based on Users' Daily-Life Scenario

  • Chung, Sung-Moon;Lee, Seung-Hwan;Kim, Su-Whan
    • Industrial Engineering and Management Systems
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    • v.11 no.2
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    • pp.196-201
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    • 2012
  • This study has developed a packaging criterion to minimize the level of discomfort which drivers using their vehicles for daily life purposes may experience due to ill designed vehicle packaging of mid-size sedan based on users' daily-life scenario. To find out optimal range of packaging dimension criterion, discomfort levels the test participants with different physical conditions suffer while performing various activities were analyzed. One hundred two test participants were carefully selected to represent entire Korean mid-size sedan owner-drivers. They were directed to test drive on the course designed to simulate mid-size sedan daily-usage scenario. At pre-designed locations, each of questions was asked to the test participants to be answered in the form of 10 point discomfort level score. By analyzing the test results, the optimal range for packaging dimensions was defined to be used as a packaging criterion.

Improvement of Memory Module Test Signal Integrity Using High Frequency Socket (High Frequency Socket 개발을 통한 Memory Module Test Signal Integrity 향상)

  • Kim, Min-Su;Kim, Su-Ki
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.491-492
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    • 2008
  • According to high-speed large scale integration trend of Memory module product, many type of noises, such a reflection, cross-talk simultaneous switching noise, occur on the Package PCB and they make the deterioration of memory module's performance and reliability. As module products have more high efficiency, Hardware of test board and socket has to be considered In test of the high-speed Memory Module. we mainly focused on improvement of Signal integrity Using the High Frequency Test socket that we invented

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Efficient Multi-site Testing Using ATE Channel Sharing

  • Eom, Kyoung-Woon;Han, Dong-Kwan;Lee, Yong;Kim, Hak-Song;Kang, Sungho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.3
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    • pp.259-262
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    • 2013
  • Multi-site testing is considered as a solution to reduce test costs. This paper presents a new channel sharing architecture that enables I/O pins to share automatic test equipment (ATE) channels using simple circuitry such as tri-state buffers, AND gates, and multiple-input signature registers (MISR). The main advantage of the proposed architecture is that it is implemented on probe cards and does not require any additional circuitry on a target device under test (DUT). In addition, the proposed architecture can perform DC parametric testing of the DUT such as leakage testing, even if the different DUTs share the same ATE channels. The simulation results show that the proposed architecture is very efficient and is applicable to both wafer testing and package testing.

Numerical estimation of errors in drop angle during drop tests of IP-Type metallic transport containers for radioactive materials

  • Lim, Jongmin;Yang, Yun Young;Lee, Ju-chan
    • Nuclear Engineering and Technology
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    • v.53 no.6
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    • pp.1878-1886
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    • 2021
  • For industrial package (IP)-type transport containers for radioactive materials, a free drop test should be conducted under regulatory conditions. Owing to various uncertainties observed during the drop test, errors in drop angles inevitably occur. In IP-type metal transport containers in which the container directly impacts onto a rigid target without any shock absorbing materials, the error in the drop angle due to a slight misalignment makes a significant difference from the ideal drop. In particular, in a vertical drop, the error in the drop angle causes a strong secondary impact. In this paper, a numerical method is proposed to estimate the error in the drop angle occurring during the test. To determine this error, an optimization method accompanying a computational drop analysis is proposed, and a surrogate model is introduced to ensure calculation efficiency. Effectiveness of the proposed method is validated by performing the verification and comparison between the test and the analysis applied with the drop angle error.

Development for the Water Mist Package Having a Low Pressure Nozzles on Wooden Cultural Properties and Temples (중저압 노즐을 이용한 사찰 및 목조 문화재용 미분무 패키지 소화설비 개발)

  • Kim, Tae-Hwan;Myeong, Sang-Yeong
    • Fire Science and Engineering
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    • v.24 no.4
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    • pp.62-68
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    • 2010
  • The present study purposed to develop the water mist package system for the cultural properties fire prevention and fire suppression system through analyzing fire protection system and cultural property's characteristic, and to suggest directions for the development of cultural property fire prevention system in the future. Maximum safety with minimum damage has issued a main objective in fire protection of the cultural property in Korea. Two types of the water mist nozzles having a low pressure had been developed by KEI. The one is for inside using in wooden cultural properties, the flow rate is 30~35 l/min and the discharging pressure is 13~14 bar. The other one is for out-side of wooden properties, the flow rate is 25~30 l/min and the discharging pressure is 14~15 bar. To evaluate the nozzles performance test, we made the fire scenario and full-scale model of wooden cultural properties for fire test. The size of full-scale model was 4.9 m length, 4 m wide, 6.6 m height, all was made by wooden. This real fire test results showed that the low pressure water mist nozzles having a $200{\mu}m$ dour size were very effectively fire extinguishing and suppression on wooden cultural properties fire. Even though the oil fuel fire was not extinguished, the fire suppression effects for the during mobilization of fire brigade was enough.

Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage (휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정)

  • Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.101-105
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    • 2019
  • The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

Grain Aging and Sensory Changes influenced by Milling and Packaging in Rice Storage (저장미 도정과 포장에 따른 고미화 및 식미 변화)

  • Lee, Ho-Jin;Kim, Tae-Hoon;Jeon, Woo-Bang
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.36 no.3
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    • pp.266-270
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    • 1991
  • Storage in the form of brown or milled rice saves space and cut cost rather than storage of rough rice, the common way of grain storage in Korea. But, brown or milled rice may be more susceptable to grain aging and sensory change than rough rice. Rice stored in government warehouse for 20 months after harvest was hulled into brown or milled rice and packaged with kraft paper bag (paper package), polyprophylen (PP package), and polyethylene (PE package). Then, after those rice packages were stored under room condition for one year, we investigated germinability, fat acidity, and sensory change to determine milling and packaging effects. Germinability of rough and brown rice was decreased significantly after long-term storge. In germination rate, Chucheong cultivar was lower than Milyang #23, brown rice was lower than rough rice, but there was no differences within packaging materials. TTC test which had a significant correlation with germinability can be used as a handy procedure for predicting grain germination. Fat acidity was increased as the order of rough < milled < brown rice in terms of milling, and PP < paper < PE package in terms of packaging materials. Especially, storage of brown rice increased fat acidity above 30 mg KOH, indicating one of characteristics of grain aging. To prevent from high fat acidity it was necessary to store in forms of rough grain with paper or PP packaging and milled rice with paper, or PP, or PE packaging. In sensory test of stored grain, eating quality in brown rice was the worst because of acidification of fatty acid. Also, eating quality of stored grain became worse as fat acidity increased.

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Numerical analysis of Brazilian split test on concrete cylinder

  • Wosatko, Adam;Winnicki, Andrzej;Pamin, Jerzy
    • Computers and Concrete
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    • v.8 no.3
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    • pp.243-278
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    • 2011
  • The paper presents simulations of the Brazilian test using two numerical models. Both models are regularized in order to obtain results independent of discretization. The first one, called gradient damage, is refined by additional averaging equation which contains gradient terms and an internal length scale as localization limiter. In the second one, called viscoplastic consistency model, the yield function depends on the viscoplastic strain rate. In this model regularization properties are governed by the assumed strain rate. The two models are implemented in the FEAP finite element package and compared in this paper. Parameter studies of the split test are performed in order to point out the features of each model.

Process Analysis and Experimental Evaluation by the Viscosity Measurement of Rheological Materials (레오로지 소재의 점도측정에 의한 공정해석 및 실험적 평가)

  • 서판기;강충길
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.70-73
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    • 2002
  • Using a simple compression test, the viscosity measurement experiment is carried out with the grain-refined Al-Si alloy(A356). The measured rheological data are expressed with power-law(Ostwald-de Waele) model and using commercial package, MAGMAsoft, coefficients of Ostwald-de Waele model and Carreau-Yasuda model are calculated. To verify the viscosity data, the die is designed to be applicable to the semi-solid die casting of automotive component and filling test is carried out. The filling test and the simulation result are compared and in good agreement. Hereafter, these data are considered to be usefully allied other product in the semi-solid die casting.

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A Statistical Analysis of the Distribution of Sasang Constitutions in Iksan Wonkwang Oriental Medicine (익산원광한의원 내원환자의 체질분포에 관한 통계적 분석)

  • 김종열;김홍기
    • The Journal of Korean Medicine
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    • v.24 no.3
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    • pp.118-129
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    • 2003
  • Objective : To learn the distributional characteristics of Sasang constitutions, Methods : We statistically analyzed those 1338 patients who had been treated at Iksan Wonkwang Oriental Medicine during the period of three years from 2000 to 2002. The data were obtained through the electronic chart developed by Kim Jong- Yeol, and analyzed using the statistical Package SPSS. Results : The distributional ratio of Soeumin : Soyangin : Taeumin was 22.8 : 29.2 : 47.8. Thus the hypothesis : 'the distributional ratio of Soeumin : Soyangin : Taeumin is 2 : 3 : 5' was barely rejected by $x^2$ test for goodness-of-fit at the significance level of 5 %. When $x^2$ test for homogeneity was applied, the distributional characteristics between women and men were different and the distributional characteristics among several age groups were different under significance level of 5%. Conclusion : Though the hypothesis: 'the distributional ratio of Soeumin : Soyangin : Taeumin is 2 : 3 : 5' was rejected by $x^2$ test at the significance level of 5%, the observed distributional ratio was not so far away from the hypothesis.

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