• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• 한국기계연구소 소보
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• s.16
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• pp.75-81
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• 1986

본 논문에서는 기계부품 요소의 설계와 분석에 사용되는 대화식 Graphics package KIMMPAK 을 설계.구현하였다. 2차원의 Plotting 루틴과 Device driver로 구성된 KIMMPAK은 TEKTRONIX 그래픽 터미널을 Drive할 수 있는 PLOT10-TCS와, IBM-PC용의 Multi-HALO(MHA¬LO), 그리고 HP Plotter의 PLOT-21 그래픽 라이브러리를 이용하여 Device Driver를 구축하였다. 이로 인한 KIMMPAK의 Device 독립성의 증가는 패키지 자체의 호환성 및 신뢰성을 높이고 있다. KIMMPAK은 VAX/VMS V4 . 2 운영체제하에서 FORTRAN-77의 부프로그램 형태로 구현되어 있으며, IBM-PC에서 사용 가능하도록 MS-FORTRAN으로 변화된 PC용 KIMMPAK이 따로 설계.구현되었다.

• The Journal of Korean Academic Society of Nursing Education
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• v.7 no.1
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• pp.126-142
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• 2001

Although a call for the implementation of PBL in nursing education is getting increased, it has not been actively implemented as it could be. The main reason for this situation seems to be the lack of well designed learning packages. Well designed PBL packages can be the core factor for the successful implementation of PBL. However, this seems to be the hardest task for teachers wanting to implement PBL. Therefore, the purpose of this study is to develop a systematic framework of PBL package development process and provide the examples of its application. This framework of the process of PBL package development includes thirteen steps. First of all, the team needs to decide a topic to be explored in the package and then clusters concepts related to the topic. Second, the team selects a real situation and writes it as a story. Third, knowledge, skills, and attitudes that practitioners need to know to deal with the situation will be explored. Fourth, learning objectives will be written. The next, the team will check if the situation includes multidisciplinary concepts and content. Sixth, the story will be divided into several parts. Seventh, part 1 will be written. Eighth, clinical documents related to part 1 need to be prepared. Ninth, the team will write a suggested approach for students. Then, they need to prepare a tutor's guide for part 1. Eleventh, the team will prepare a list of reading materials and plan for lectures and clinical laboratory sessions. Twelfth, they will write part 2 ~ part N following the steps from the seventh to the eleventh. The last step is evaluating the package and amending it as needed. These thirteen steps are very detailed and easy to follow for beginners. It is expected that this framework will contribute to accelerate the implementation of PBL in nursing education.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.43-55
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• 2003

As the development of If industries and their electronic device manufacturing technology have been accelerated recently, the request for electronic devices with small size, light weight, and high performance has been inducing that electronic package and substrate (PCB) companies have to develop substrates with low cost, high dense I/O, excellent thermal properties and electrical properties. Therefore, world-wide chip makers have been setting their own severe reliability standards and requiring their suppliers to keep specification and to develop green, high frequency and high-performing substrates. Because properties of substrates are dependent mainly on their constituent materials, the application of them showing superior properties is expected to satisfy the customer's requirement. Therefore, substrate companies should ensure the superiority of materials and assure their competitive capability of substrates by analyzing the latest trends of technology and properties of the materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.556-561
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• 2022

Computational material science as an application of Density Functional Theory (DFT) to the discipline of material science has emerged and applied to the research and development of energy materials and electronic materials such as semiconductor. However, there are a few difficulties, such as generating input files for various types of materials in both the same calculating condition and appropriate parameters, which is essential in comparing results of DFT calculation in the right way. In this tutorial status report, we will introduce how to create crystal structures and to prepare input files automatically for the Vienna Ab initio Simulation Package (VASP) and Gaussian, the most popular DFT calculation programs. We anticipate this tutorial makes DFT calculation easier for the ones who are not experts on DFT programs.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.39-39
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.98.1-98
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.99.4-99
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.31-35
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• 2014

$TiO_2$-nanoparticle-dispersed silicone was applied to a LED package and the light efficiency of the LED package was evaluated in this study. The addition of $TiO_2$ nanoparticles in silicone increased refractive index, which improved the light efficiency of the LED package. The $TiO_2$ nanoparticles were fabricated by hydrothermal synthesis and were dispsersed by a vinyl silane coating treatment. After the silane treatment, the $TiO_2$ nanoparticles dispersed with diameters of 10~40 nm but rod-shape $TiO_2$ nanoparticles with lengths of 100 nm were also observed. The refractive index increased with the $TiO_2$ concentration in silicone, while the transmittance decreased with the $TiO_2$ concentration. The light efficient of the LED package with $TiO_2$+silicone encapsulant was higher than that of the LED package with no $TiO_2$ in silicone encapsulant.