• Design Convergence Study
• /
• v.16 no.4
• /
• pp.81-98
• /
• 2017

This study starts from the judgment that the evaluation about preserved flower package design has to be performed based on the product attribute. The principles and components of package design are reestablished from preceding researches, the product type model is suggested based on the product attribute. The 6 principles of package design are usability, esthetic element, attracting attention, creativity, identity and implication, and the 5 components of package design are form, material, color, graphics and branding factors. The product types are classified into 4 areas following the 2 axises. The 1 axis means the degree of perception risk on acquiring information and the other means the approaching type to expected effects about products. The characteristics of package design components are analyzed from the cases belonged at each area on the product type model. Based on the this model, the strategy of preserved flower package design is drawn. At last the package of 'Preserville' is analyzed, we find out the critical points and suggest the intention point in planning the preserved flower package.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.91-95
• /
• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Journal of Korean Society of Rural Planning
• /
• v.18 no.4
• /
• pp.141-152
• /
• 2012

Recently the package design for agricultural product of farm stay is great interests for increasing the income of farmers and villages as it may fulfill the sensible needs of consumers who experience rural culture and farm stay. This paper presents the status of the package design for agricultural product of farm stay and proposed improvements to the package design as following; 1)to diversify the packaging capacity, 2)to develop the cultural products to applicate the traditional crafts technique, 3)to provide institutional strategies for presenting the identity of farm or village, 4)to develop the education program about package design. We sampled fifty pilot farms or villages, analyse the package design of them and questionnaire surveyed farmers and managers in order to find problems and suggest improvements.

• Journal of Mechanical Science and Technology
• /
• v.18 no.9
• /
• pp.1572-1581
• /
• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• Journal of Digital Contents Society
• /
• v.18 no.1
• /
• pp.47-54
• /
• 2017

In this research, I analyze cases of character packages in Japane, extract the concept of design that was loved by consumers and inmates and succeeded in marketing, and aim to establish the logic and principle. In addition, in the future, when introducing and utilizing the character package design in Korea, this research intends to make a guideline for the development of objective validity and empathic package design. After identifying the design concept and finding the principle by targeting package design of five character of Tohato which mixed various media and expanded sales, I want to find out the cause of success. Therefore, I have studied the theory and principles of enterprise and creative in product strategy through case analysis of character design concept and character package design. As a result, a design that leaving the functional side, having a story, making memories, and inducing a sense of closeness was as a successful case of renewal. In the package design, in some cases, package design execution is more important under the theoretical system according to consumer behavior analysis and Promotion of bold design concept of the design for the success of that concept, deviated from the existing principle.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.1
• /
• pp.1-6
• /
• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Journal of Korea Multimedia Society
• /
• v.19 no.8
• /
• pp.1553-1563
• /
• 2016

Thesedays, not only a quality of a product but also a design of it plays an important role. Throughout this analysis, I would like to discuss how a design of package works in the cosmetics with the fact that low cost cosmetics sales better than high cost cosmetics. In this research, there are five samples each for Korean and Chinese low-costed cosmetics to yield a result about an element of package design. Based on that result, there was an survey about two different package design followed by the research problems. Throughout research, an attention and familiarity of package which was considered of characteristics of China was more effective on Chinese consumers. In order to activate the content market of cosmetics, it is utilized to manufacture taking into account the maximum of the design elements in the package design is a conclusion that affect the time of purchase. In this paper, one in which I hope to help in the development of being utilized as a basis article content market industry for pre-market research foray into the Chinese market is South Korean cosmetics.

• Journal of Korean Society of Rural Planning
• /
• v.20 no.4
• /
• pp.157-164
• /
• 2014

This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.27 no.3
• /
• pp.52-58
• /
• 2004

This study investigated the influence of package design of female cosmetics on the purchasing preferences of view The subjects of this study were the consumers of female cosmetics from their twenties to the forties, and were 195 consumers who dropped into beauty counters to buy their cosmetics. With this study, it can be said that package design Is an effective factor on purchasing of female cosmetics. In general, most consumers prefer to practical and useful package design. But the younger consumers tend to be more influenced by luxury and expensive package design than an elderly consumers on purchasing cosmetics. And it made a little difference in purchasing preferences by academic background.

• Journal of Korea Multimedia Society
• /
• v.25 no.7
• /
• pp.945-952
• /
• 2022

In a market situation full of brands and products, packaging requires a differentiated design that reflects the needs and trends of the times, as well as the characteristics of the product. Therefore, in this study, through literature reviews, market research methods, questionnaire surveys, eye-tracking experiments, etc., we derived related research and current status of ramen package design, and visual expression elements that induce consumers' subjective perception and interest. As a result, the ramen package design was generally simplified and tended to visualize the spicy taste. Second, consumers buy bag ramen once a week on average at a large discount mart, consider the color of the ramen package design as important, and recognize that the aesthetics of the package design can improve quality. Finally, the spicy phrases and ramen illustrations were the first visual elements of the ramen package design, and for the longest time, attention was focused on the brand name.