• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2005년도 학술발표회 논문집
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• pp.743-748
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• 2005

김남원 등(2004a, b)에 의해 개발된 SWAT-MODFLOW 모형은 SWAT 모형과 MODFLOW 모형의 Recharge Package와 River Package를 직렬로 연결한 모형이다. 그러나 MODFLOW 모형에는 지하수 흐름방정식의 해석에 관련된 Package를 제외하더라도 Well, Drain, Evapotranspiration 등의 Package가 더 있어 대수층으로부터의 우물의 함양과 배출, 배수관을 통한 지하수의 배출, 지하수의 증발산으로 인한 손실 등을 수행할 수 있다. MODFLOW 모형의 Well Package는 SWAT 모형에서 대수층의 물이동, Drain Package는 SWAT 모형의 토관배수, Evapotranspiration Package는 SWAT 모형의 얕은 대수층에서의 증발산과 밀접한 관계가 있다. 본 연구에서는 이들 세 개의 Package를 SWAT 모형과 완전 연동시킴으로써 사용자가 좀 더 다양한 조건에 대하여 SWAT-MODFLOW 결합모형을 적용할 수 있도록 기능을 향상시켰다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.98.4-98
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• 1998

• 마이크로전자및패키징학회지
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• 제23권3호
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• pp.43-49
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• 2016

박형 package-on-package에 대해 T/H (temperature/humidity) 시험, TC (temperature cycling) 시험과 HTS(high temperature storage) 시험을 사용하여 신뢰성을 분석하였다. T/H 시험은 $85^{\circ}C/85%$의 조건으로 500시간, TC 시험은 $-40{\sim}100^{\circ}C$의 조건으로 1000회, HTS 시험은 $155^{\circ}C$의 조건으로 1,000시간 범위에서 평가하였다. 폴리이미드 써멀테이프를 사용하여 제작한 24개의 package-on-package (PoP) 시편에 대해 신뢰성 시험 전에 측정한 솔더접속 배선의 평균저항은 $0.56{\pm}0.05{\Omega}$이었으며, 24개 시편에서 모두 유사한 값이 측정되었다. 500시간까지의 T/H 시험, 1000회의 TC 시험 및 1,000시간까지의 HTS 시험후에도 솔더 접속부의 오픈 불량은 발생하지 않았다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 기술혁신학회지
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• 제3권3호
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• pp.1-17
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• 2000

This paper shows the institutional limits of technological innovation at the railway package service, that is the limits of introducing the package express system. The railway package service, owned by government and operated by D company, has been suffered severe operating loss since early 1990's. The package express system supported by information network and co-working with inner city quick service might be an solution for the railway package service. But there are several obstacles such as labor union and the rigidities of the Korean National Railroad of government agency.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.98.3-98
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• 1998

• 한국수학교육학회지시리즈E:수학교육논문집
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• 제21권2호
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• pp.199-225
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• 2007

초 중 고등학교 확률 및 통계교육 시 우리는 통계패키지로서 R을 사용할 수 있다. R은 대화식 처리방식을 따르기 때문에 배우기가 쉽다. 또한 R에서의 그래픽스는 아주 강력하다. 가장 큰 장점은 R의 사용이 무료라는 것이다. 이러한 많은 장점을 갖고 있는 R을 초 중 고등학교 확률 및 통계교육 현장에서 사용하는 표준 통계패키지로서 고려할 필요가 있다.

• 한국국방경영분석학회지
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• 제17권2호
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• pp.100-112
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• 1991

Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.