• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.29.2-29.2
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• 2007

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.131-135
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• 2004

본 논문에서는 일정한 소프트웨어 품질 수준을 달성하기 위해 소요되는 시간을 소프트웨어 개발 일정 관리에 반영한 새로운 일정관리 모델을 제안한다. 제안된 모델은 PSP/TSP (Personal Software Process/Team Software Process)의 일정 관리 및 추적 모델에 결함 제거에 필요한 작업량을 반영하여 품질 관리까지 포함한 종합적인 일정 추적과 관리가 가능하도록 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.31-36
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• 2012

In this study, the complex vibration reliability of Sn-3.5Ag and Sn-0.7Cu having a high melting temperature was investigated. For manufacturing of BGA test samples, Sn-3.5Ag and Sn-0.7Cu balls were joined on BGA chips finished by ENIG and the chips were mounted on PCB finished OSP by using reflow process. For measuring of resistance change during complex vibration test, daisy chain was formed in the test board. From the results of resistance change and shear strength change, the reliability of two solder balls was compared and evaluated. During complex vibration for 120 hours, Sn-0.7Cu solder was more stable than Sn-3.5Ag solder in complex vibration test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Journal of the Korean Recycled Construction Resources Institute
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• v.8 no.1
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• pp.39-48
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• 2020

The present study investigates the chemical reaction and performance of ternary blended binders by mixing ferronickel slag. Cement was replaced using ground granulated blast furnace slag and ferronickel slag, combined up to 50% of the replacement rate. The blended cements were tested by setting times, length change, compressive strength at 1, 3, 7, 28 days. X-ray diffraction and scanning electron microscope were conducted for detecting hydration products while the MIP and microhydation heat were used for examining morphological characteristics. The results showed that by adding ferronickel slag, Pozzolanic reaction occurred, forming a dense pore structure and the effect of reducing hydration heat and dry shrinkage was also found. The compressive strength at 28 days was lower than that of 100% OPC control specimen (OSP0), but ternary blended cements showed no significant difference compared to binary blended (OSP50). If the optimal mix is derived later and used for the purpose, the potential for use as a cement binder is expected.

• Smart Structures and Systems
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• v.16 no.2
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• pp.243-262
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• 2015

Optimal sensor placement (OSP) is a critical issue in construction and implementation of a sophisticated structural health monitoring (SHM) system. The uncertainties in the identified structural parameters based on the measured data may dramatically reduce the reliability of the condition evaluation results. In this paper, the information entropy, which provides an uncertainty metric for the identified structural parameters, is adopted as the performance measure for a sensor configuration, and the OSP problem is formulated as the multi-objective optimization problem of extracting the Pareto optimal sensor configurations that simultaneously minimize the appropriately defined information entropy indices. The nondirective movement glowworm swarm optimization (NMGSO) algorithm (based on the basic glowworm swarm optimization (GSO) algorithm) is proposed for identifying the effective Pareto optimal sensor configurations. The one-dimensional binary coding system is introduced to code the glowworms instead of the real vector coding method. The Hamming distance is employed to describe the divergence of different glowworms. The luciferin level of the glowworm is defined as a function of the rank value (RV) and the crowding distance (CD), which are deduced by non-dominated sorting. In addition, nondirective movement is developed to relocate the glowworms. A numerical simulation of a long-span suspension bridge is performed to demonstrate the effectiveness of the NMGSO algorithm. The results indicate that the NMGSO algorithm is capable of capturing the Pareto optimal sensor configurations with high accuracy and efficiency.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.2
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• pp.8-14
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• 2016

When Open Source Projects are processed by multiple developers, the Version Control Systems, which control the different versions of the same file being used, is a very useful tool. On the other hand, because most of conventional VCS(SVN, Git, etc.) mainly control the history of the modifications of the source codes or documents, there is an inconvenience that each developer should modify the development environment whenever the development environment is modified. To overcome this inconvenience, this paper suggests a scheme of VC for OSP. The basic concept of the suggested scheme is that an image, including the development environment and controls, is created as a new version using the Docker, virtualization tool of the container method. To review the functional appropriateness of the suggested scheme, after establishing the Docker on the hosts that use the different OS( Ubuntu12.0.4, CentOS7), this study tested a VC that could control the different versions including the history of modifications of the development environment and evaluated them by a comparison with the conventional VCS. The results show that the suggested scheme is a convenient scheme of VC for the OSP.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.