• Title/Summary/Keyword: osp

Search Result 127, Processing Time 0.019 seconds

Reliability evaluation of 1608 chip joint using Sn8Zn3Bi solder under high temperature and high humidity (Sn8Zn3Bi 솔더를 이용한 1608 칩 솔더링부의 고온고습 신뢰성 평가)

  • Kim, Gyu-Seok;Lee, Yeong-U;Hong, Seong-Jun;Jeong, Jae-Pil;Mun, Yeong-Jun;Lee, Ji-Won;Han, Hyeon-Ju;Kim, Mi-Jin
    • Proceedings of the KWS Conference
    • /
    • 2005.11a
    • /
    • pp.228-230
    • /
    • 2005
  • Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 고용고습시험을 행하였다. 고온 고습 시험은 $85^{\circ}C$/85RH 조건에서 1000 시간 동안 하였다. 접합 기판으로는 각각 OSP (Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608Chip 으로 MLCC(Multi Layer Ceramic Capacitor 이하, 1608C) 와 Chip Resister(이하, 1608R)을 사용하였으며, 이 두 부품의 전극부위에 Sn-10wt%Pb(이하 Sn-l0PB), Sn을 각각 도금하였다. 솔더링 후 1608C 와 1608R의 전단 접합 강도와 솔더링부에서 Zn상의 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 접합 강도는 기판의 표면처리에 상관없이 약 40N 이었다. 그러나 고온 고습 시험 1000 시간 후에는 기판의 표면처리에 상관없이 약 30N 까지 감소하였다. 하지만 이는 reference인 Sn-37Pb 솔더의 강도값과 거의 유사하며, 이는 Sn-8Bi-3Zn 솔더의 고온 고습 시험 후 전단강도 특성은 기존 유연솔더와 비교하여 동등이상이라고 평가할 수 있다.

  • PDF

A Suggestion for Merging Quality Management into Software Project Schedule Management (소프트웨어개발 일정관리와 품질관리의 통합 방안)

  • Paek, Seon-Uck;Han, Yong-Soo;Hong, Sug-Won
    • Information Systems Review
    • /
    • v.6 no.2
    • /
    • pp.195-208
    • /
    • 2004
  • In this paper we propose a new software project development management model incorporating quality management to schedule management. Though many efficient techniques such as code review and inspection are used to remove defects, the effect of defect removal time on project schedule hasn't been studied much. However, poor quality management has an important effect upon overall schedule and sometimes software projects fails due to it. Thus, quality management and schedule management should be considered together and we need to reflect the time to maintain software quality into the schedule management. For the proposed model we introduced "Quality Value" representing the needed time to remove software defects. We assume PSP/TSP to gather the needed data for quality value. The proposed model can be used to predict the effect of software defects on schedule in advance and to prevent schedule lag.

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향)

  • Lee, Young-Chul;Kim, Kwang-Seok;Ahn, Ji-Hyuk;Yoon, Jeong-Won;Ko, Min-Kwan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
    • /
    • v.48 no.11
    • /
    • pp.1035-1040
    • /
    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

Evaluation of Bonding Properties of Epoxy Solder Joints by High Temperature Aging Test (고온 시효 시험에 따른 Epoxy 솔더 접합부의 접합 특성 평가)

  • Kang, Min-Soo;Kim, Do-Seok;Shin, Young-Eui
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.32 no.1
    • /
    • pp.6-12
    • /
    • 2019
  • Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

Effect of Oil Cake Banding Application on Growth and Nutrient Use Efficiency in Maize (유박의 줄뿌림 시비가 옥수수 생육 및 양분이용효율에 미치는 영향)

  • Ok, Jung-Hun;Cho, Jung-Lai;Lee, Byung-Mo;An, Nan-Hee;Shin, Jae-Hoon;Lee, Yeon
    • Korean Journal of Organic Agriculture
    • /
    • v.24 no.4
    • /
    • pp.907-917
    • /
    • 2016
  • This study aimed at improving the method of oil cake application in maize. The experiment was conducted during 2 years at NAS (National Institute of Agricultural Sciences) experimental field, located in Wanju-kun, Jeollabuk-do. Growth factors and nutrient use efficiency were evaluated depending on oil cake application depth, placement, and application rate. Difference in oil cake application method and depth was tested in 2012 and different placements of oil cake application were compared in 2013. Plant height, SPAD value, and dry weight of stem and corn were investigated. SPAD value, dry weight of stem and corn were significantly higher in oil cake banding treatment (OB5, 5 cm depth) as compared to others application methods, i.e. spreading (OS0), deep banding (OB10) and banding + spreading (OB5S). In addition, dry weight of stem and corn of banding treatments (OBL, OBLL) on rhizosphere and in between row (OBR) were higher than spreading treatment (OSP). Furthermore, in case of reduced application rate in additional fertilization did not decrease dry weight of corn and increased nutrient use efficiency. Therefore, it is concluded that banding application in 5 cm-depth and rhizosphere can improve growth and nutrient use efficiency in maize production.

Optimization of 1(3)-Palmitoyl-2-Oleoyl-3(1)-Stearoyl Glycerol Produced via Lipase-catalyzed Esterification Using the Response Surface Methodology (Camellia Oil로부터 1(3)-Palmitoyl-2-Oleoyl-3(1)-Stearoyl Glycerol을 함유한 효소적 합성반응물의 최적화 연구)

  • Hwang, Yun-Ik;Shin, Jung-Ah;Lee, Jeung-Hee;Hong, Soon-Taek;Lee, Ki-Teak
    • Food Science and Preservation
    • /
    • v.18 no.5
    • /
    • pp.721-728
    • /
    • 2011
  • 1(3)-palmitoyl-2-oleoyl-3(1)-stearoyl-(POS)-glycerol-enriched reaction products were synthesized from camellia oil, palmitic ethyl ester, and stearic ethyl ester via lipase-catalyzed interesterification. Response surface methodology (RSM) was employed to optimize the production of the POS-enriched reaction product (Y1, %) and the stearicand palmitic-acid contents at the sn-2 position due to acyl migration (Y2, %). The reaction factors were the enzyme amount (X1, 2-6%), reaction time (X2, 60-360 min), and substrate molar ratio of camellia oil to palmitic ethyl ester and stearic ethyl ester (X3, 1-3 mol). The predictive models for Y1 and Y2 were adequate and reproducible as no lack of fit was signified (0.128 and 0.237) and as there were satisfactory levels of R2 (0.968 and 0.990, respectively). The optimal conditions for the reaction product for maximizing Y1 while minimizing Y2 were predicted at the reaction combination of 5.86% enzyme amount, 60 min reaction time, and 1:3 substrate molar ratio (3 moles of palmitic ethyl ester and 3 moles of stearic ethyl ester). Actual reaction was performed under the same conditions as above, and the resulting product contained 20.19% TAG-P/O/S and 12.71% saturated fatty acids at the sn-2 position.

The Distribution of Responsibility and Authority upon Public Record Appraisal : Focused on 'Citizen Participation Appraisal' (공공기록 평가의 책임과 권한의 분배 '시민참여 평가'를 중심으로)

  • Lee, Kyong Rae
    • The Korean Journal of Archival Studies
    • /
    • no.60
    • /
    • pp.49-88
    • /
    • 2019
  • Today, the civil society plays a key role not only in criticizing and monitoring the functions of the state and the market, but also as an active producer of public services by complementing the government and the public sector. Public records management is also becoming more and more popular. In the case of appraisal and selection, which is the core area of record management, discussions about citizen participation are becoming more serious than any other areas. The concept of 'proactive appraisal', which has emerged as a paradigm of citizens' participation in appraisal, reminds us that citizens themselves are the subjects of public records and are no longer alienated from the appraisal system. The problem is, while the growth of the Korean civil society about institutional participation is spreading rapidly, but citizen participation is hard to find in the field of public records. The purpose of this paper is to examine the role of citizen participation in the process of appraisal of public records, and to debunk the role of citizen participation in the appraisal processes by exploring the examples in the UK, Canada, and Australia. This paper emphasizes that the appraisal system of the national public records in crisis today could be largely restored through the domestic application of this active citizen participation cases. First of all, this study presents a conceptual appraisal model that could reflect citizen participation in the field of record management along with the analyses of the advanced cases in some western countries. Specifically, this paper focuses on presenting the models of 'appraisal documentation' and 'governance-based appraisal', reflecting the active citizen participation. This study suggests that these citizens' participatory evaluation models should be settled in Korea in the future and we should urgently discuss 'citizen participation appraisal'.