• Journal of Welding and Joining
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• v.29 no.5
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Earthquakes and Structures
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• v.21 no.6
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• pp.587-599
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• 2021

The modified-ECOMAC approach to monitor and investigate health of structure in marine platforms was evaluated in this research. The material properties of structure were defined based on the real platform located in Persian Gulf. The nonlinear time-history analyses were undertaken using the marine natural waves. The modified-ECOMAC approach was designed to act as the solution of the best sensor placement according to structural dynamic behavior of structure. This novel method uses nonlinear time-history analysis results as an exact seismic response despite the common COMAC algorithms utilize the eigenvalue responses. The processes of modified-ECOMAC criteria were designed and developed by author of this paper as a toolbox of Matlab. The Results show that utilizing an efficient ECOMAC method in SHM process leads to detecting the critical weak points of sensitive marine platforms to make better decision about them. The statistical results indicate that considering modified ECOMAC based on seismic waves analysis has an acceptable accuracy on identify the sensor location. The average of statistical comparison of COMAC and ECOMAC via modal and integrated analysis, had a high MAE of 0.052 and RSME of 0.057 and small R2 of 0.504, so there is significant difference between them.

• Smart Structures and Systems
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• v.31 no.6
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• pp.545-559
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• 2023

Nanoparticle strips (NPS) are widely used as external reinforcers for two-way reinforced concrete slabs. However, the Structural Health Monitoring (SHM) of these slabs is a very important issue and was evaluated in this study. This study has been done analytically and numerically to optimize the placement of sensors. The properties of slabs and carbon nanotubes as composite sheets were considered isotopic and orthotropic, respectively. The nonlinear Finite Element Method (FEM) approach and suitable optimal placement of sensor approach were developed as a new MATLAB toolbox called DECOMAC by the authors of this paper. The Suitable multi-objective function was considered in optimized processes based on distributed ECOMAC method. Some common concrete slabs in construction with different aspect ratios were considered as case studies. The dimension and distance of nano strips in retrofitting process were selected according to building codes. The results of Optimal Sensor Placement (OSP) by DECOMAC algorithm on un-retrofitted and retrofitted slabs were compared. The statistical analysis according to the Mann-Whitney criteria shows that there is a significant difference between them (mean P-value = 0.61).

• Smart Structures and Systems
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• v.15 no.2
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• pp.355-373
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• 2015

An optimal sensor placement (OSP) method based on structural subsection technique (SST) and model reduction technique was proposed for modal identification of truss structures, which was conducted using genetic algorithm (GA). The constraints of GA variables were determined by SST in advance. Subsequently, according to model reduction technique, the optimal group of master degrees of freedom and the optimal objective function value were obtained using GA in a case of the given number of sensors. Correspondingly, the optimal number of sensors was determined according to optimal objective function values in cases of the different number of sensors. The proposed method was applied on a scaled jacket offshore platform to get its optimal number of sensors and the corresponding optimal sensor layout. Then modal kinetic energy and modal assurance criterion were adopted to evaluate vibration energy and mode independence property. The experiment was also conducted to verify the effectiveness of the selected optimal sensor layout. The results showed that experimental modes agreed reasonably well with numerical results. Moreover the influence of the proposed method using different optimal algorithms and model reduction technique on optimal results was also compared. The results showed that the influence was very little.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2010.07a
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• pp.208-211
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• 2010

2012년 지상파 방송은 아날로그 송출을 종료하고 디지털 방송으로 전환된다. 이렇게 전환되는 지상파 디지털 방송은 무료로 누구나 시청할 수 있는 보편적 서비스를 지향하기 때문에, 케이블TV, 위성TV, IPTV 등의 다른 매체와는 달리 기술적 보호조치 없이 방송되고 있다. 또한 DTV 방송프로그램은 원본과 똑같은 화질로 개인이 쉽게 저장할 수 있고 인터넷을 통하여 누구나 쉽게 접근이 가능하기 때문에, DTV 방송프로그램의 무단복제와 인터넷을 통한 불법재배포는 큰 문제점으로 대두되고 있다. 이러한 불법 대량배포는 방송프로그램의 저작권을 심각히 침해할 뿐만 아니라, 방송사의 고품질의 방송프로그램을 제작환경을 더욱 열악하게 만들고 있다. 또한 일반 사용자는 인식하지 못하는 사이에 인터넷을 통해 불법 콘텐츠를 사용하게 되는 악순환에 빠지게 된다. 이에 본 논문은 KBS에서 추진하고 있는 여러 콘텐츠 보호 기술들을 하나의 보호 고리로 연결하는 KBS 보호기술 체계를 소개하고자 한다. 이를 위하여 KBS는 아래의 3가지 보호 기술을 개발하여 체계적으로 연결하여 적용하고 있다. 첫째, 프로그램의 저작권과 배포 정보를 나타내는 프로그램 보호신호(PPI, Program Protection Information)와 워터마크를 방송 신호에 삽입하여 수신기에서의 프로그램 보호를 추진한다, 둘째, 인터넷 OSP(Online Service Provider)와의 제휴를 통하여 콘텐츠 필터링 기술을 도입하여 프로그램 불법 업로드, 다운로드를 방지한다. 셋째, KBS 저작물 인터넷 모니터링 시스템을 개발하여 인터넷 상의 불법 프로그램 배포정보를 획득하여 불법배포가 진행되는 사이트에 보호를 요청한다.

• Journal of Microbiology and Biotechnology
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• v.27 no.1
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• pp.171-178
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• 2017

A series of novel effector molecules secreted by the type three secretion system (T3SS) of Shigella spp. have been reported in recent years. In this study, a proteomic approach was applied to study T3SS effectors systematically. First, proteins secreted by the S. flexneri wild-type strain after Congo Red induction were separated and identified using two-dimensional electrophoresis to display the relative abundance of all kinds of early effectors for the first time. Then, a gene deletion mutant of known virulence repressor (OspD1) and a gene overexpressed mutant of two known virulence activators (MxiE and IpgC) were constructed and analyzed to discover potential late effectors. Furthermore, the supernatant proteins of gene deletion mutants of two known translocators (IpaB and IpaD), which would constantly secrete effectors, were also analyzed. Among all of the secreted proteins identified in our study, IpaH1.4, IpaH_5, and IpaH_7 have not been reported before. These proteomics data of the secreted effectors will be valuable to understand the pathogenesis of S. flexneri.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.202-207
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• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.9
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• pp.85-91
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• 2013

This paper proposes the data reusable search scan methods for full search and fast search to implement low power Motion Estimation (ME). The proposed Optimized Sub-region Partitioning (OSP) method which divide search region into several sub-region can reduce the number of the required Reconfigurable Register Array (RRA) by half compared to the existing smart snake scan method for the same data reusability. In addition, the proposed Center Biased Search Scan method (CBSS) for various fast search algorithms can improve the data reusability. The performance comparisons show that the proposed search scan methods can reduce the average redundant data loading about 26.9% and 16.1% compared with the existing rater scan and snake scan methods, respectively. Due to the reduction of memory accesses, the proposed search scan methods are quite suitable for low power and high performance ME implementation.