Effect of Curing Method on the Reliability of Silicone Encapsulant for Light Emitting Diode (LED용 실리콘 봉지재의 경화방법이 신뢰성에 미치는 영향)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.25 no.10
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- pp.844-848
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- 2012