• 전기학회논문지
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• 제58권1호
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• pp.147-154
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• 2009

This paper presents a grating~integrated SPR (Surface Plasmon Resonance) sensor chip for simple and inexpensive biomolecule detection. The grating-integrated SPR sensor chip has two sensing channels having a nano grating for SPR coupling. An external mirror is used for multi channel SPR sensing. The present sensor chip replaces bulky and expensive optical components, such as fiber-optic switches or special shaped prisms, resulting in a simple and inexpensive wavelength modulated multi-channel SPR sensing system. We fabricate a SPR sensor chip integrated with 835 nm-pitch gratings by a micromolding technique to reduce the fabrication cost. In the experimental characterization, the refractive index sensitivity of each sensing channel is measured as $321.8{\pm}8.1nm$/RI and $514.3{\pm}8.lnm$/RI, respectively. 0.5uM of the target biomolecule (streptavidin) was detected by a $1.13{\pm}0.16nm$ shift of the SPR dip in the 10%-biotinylated sample channel, while the SPR dip in the reference channel for environmental perturbation monitoring remained at the same position. From the experimental results, multi-channel biomolecule detection capability of the present grating-integrated SPR sensor chip has been verified. On the basis of the preliminary experiments, we successfully measured the binding reaction rate for the $2\;nM{\sim}200\;nM$ monoclonal-antibiotin, thus verifying biomolecule concentration detectability of the present SPR sensor chip. The binding reaction rates measured from the present SPR sensor chip agredd well with those from a commercialized SPR sensor.

• 대한의용생체공학회:의공학회지
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• 제31권4호
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• pp.292-301
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• 2010

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

• 대한전자공학회논문지SD
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• 제41권9호
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• pp.11-17
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• 2004

STM-1 체계의 광통신용 광모듈 송수신부에 내장하기 위한 155.52 Mbps 트랜시버 ASIC을 0.6 ㎛ 2-poly 3-metal 실리콘 CMOS 기술을 이용하여 구현하였다. 제작된 ASIC은 시스템에 의해서 처리된 155.52 Mbps 데이터 신호를 LD를 통하여 광신호로 변환하여 상대 시스템으로 송신하는 트랜스미터의 역할과, 상대 시스템으로부터 전송되어온 155.52 Mbps 광신호를 PD로 수신하여 전기신호로 변환하고 원형으로 복구하는 리시버의 역할을 한다. 트랜스미터와 리시버를 하나의 실리콘 기판에 집적하여 단일 칩 형태의 트랜시버를 설계하기 위하여, 잡음 및 상호 간섭 현상을 방지하기 위한 배치 상의 소자 격리 방법뿐만 아니라 전원분리, 가드링, 격리장벽 등을 도입한 새로운 설계 방법을 적용하였다. 설계된 칩의 크기는 4 × 4 ㎟이며, 루프백 측정에서 지터도 실효치 32.3 ps, 최대치 335.9 ps로 비교적 양호하게 나타났다. 전체 칩의 소비전력은 5V 단일전원 공급 상태에서 약 1.15 W(230 mA)로 나타났다.

• 한국전기전자재료학회논문지
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• 제31권4호
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• pp.267-271
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• 2018

A high directivity TIR (total internal reflection) lens in the UV-A region was designed using a silicone resin, and a UV light source module with a maximum irradiation density of $150mW/cm^2$ was fabricated. The beam angle of the TIR lens was designed to be $8.04^{\circ}$ and the maximum diameter of the TIR lens was Ø13.5. A silicone resin having a UV transmittance of 93% and a refractive index of 1.4 at a wavelength of 365 nm was used, and the lens was manufactured using an aluminum mold, from which silicone could be easily released. The module was fabricated in a metal printed circuit board of COB (chip on board) type using a $0.75{\times}0.75mm^2$ UV chip. A jig was used to adjust the focal length between lens and chip and to fix the position of the lens. The optical characteristics such as illumination distributions of the lens and module were designed using 'LightTools' optical simulation software. The heat dissipation system was designed to use a forced-air cooling method using a heat-sink and fan.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -2
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• pp.1109-1112
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• 2002

A non-coherent synchronous all-optical code-division multiple-access (CDMA) network is proposed. In this network, symmetric codes derived from prime sequence codes are used. We present the construction of symmetric codes and show that the pseudo-orthogonality of the new codes is the same as that of the original prime-sequence codes while the cardinality of the new codes is larger than that of the prime sequence codes and the modified prime codes in the same field GF(p). Therefore, an optical CDMA LAN using symmetric codes can have a larger number of potential subscribers. The new codes allow designing fully programmable serial all-optical transmitter and receiver suitable for low-loss, high-capacity, optical CDMA LANs. It is also shown that compared to systems using modified prime codes the proposed system can achieve better BER performance for low received chip optical power.

• Current Optics and Photonics
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• 제6권1호
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• pp.15-22
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• 2022

This paper describes the construction of a phase shifter with low loss and small volume. To construct it, we use the two graphene layers that are separated by a hexagonal boron nitride (hBN) and embedded in a silicon waveguide. The refractive index of the waveguide is adjusted by applying a bias voltage to the graphene sheet to create an optical phase shift. This waveguide is a compact device that only has a radius of 5 ㎛. It has a phase shift of 6π. In addition, the extinction ratio (ER) is 11.6 dB and the insertion loss (IL) is 0.031 dB. Due to its unique characteristics, this device has great potential in silicon on-chip optical interconnection and all-optical multiple-input multiple-output processing.

• 한국광학회:학술대회논문집
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• 한국광학회 1991년도 제6회 파동 및 레이저 학술발표회 Prodeedings of 6th Conference on Waves and Lasers
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• pp.1-1
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• 1991

The fabrication of computer components requires a great variety of optical equipment. The patterning of integrated circuits is performed either on step-and-repeat cameras, scanning systems or step-and-repeat systems. The image forming optics used in these machines is quite difficult to design and fabricate. In addtion several layers of patterns must be precisely superposed, and also the illuminators have to provide the final irradiance in the image plane constant to within 1%. Other uses of specialized optical equipment are mass production of chip packages, inspection scanners and laser ablation cameras for polymers. The details of some of these systems will be described with particular ephasis on different optical structures and the use of excimer lasers as light sources.

• 전자공학회논문지
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• 제49권12호
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• pp.142-146
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• 2012

Today, the demand for high-speed data communication and mobile communication has exploded. Thus, there is a growing need for optical communication systems that convert large volumes of data to optical signals and that accommodate and transmit the signals across long distances. Digital optical communication with these characteristics consists of a master unit (MU) and a slave unit (SU). However, the digital optical units that are currently commercialized or being developed transmit data without compression. Thus, digital optical communication using these units is restricted by the quantity of optical frames when adding diversity or operating with various combinations of CDMA, WCDMA, WiBro, GSM, LTE, and other mobile communication technologies. This paper suggests the application of a data compression algorithm to a digital signal processor (DSP) chip as a field programmable gate array (FPGA) and a complex programmable logic device (CPLD) of a digital optical unit to add separate optical waves or to transmit complex data without specific changes in design of the optical frame.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.2040-2042
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• 2004

This paper presents a miniature optical system for the fluorescence detection of the patterned protein chip. The patterned protein chip was fabricated using MEMS process. The fluorescence from the patterned protein chip was measured while varying the concentration of the BSA. The fluorescence light is separated spatially from the excitation beam using mini-size prism to increase SNR (Signal-to-Noise Ratio). The combination of prism and mirrors can convert the excitation light from the laser diode to uniform illumination on the specimen. We believe that the proposed system for fluorescence detection can be applied to rea1ization of point-of-care.