• Title/Summary/Keyword: optical chip

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A Study on the Optimal Design for Optical Efficiency of LED (LED의 광효율 최적설계에 관한 연구)

  • Song, Young-Jae;Hong, Min-Sung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.361-367
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    • 2011
  • In this paper, it was attempted to analyze the optimal design of light emitting diode (LED), a source of back light unit (BLU). LED is beginning with commercialized red LED which is made by GaAsP compound semiconductor, and has been developed focusing on liquid crystal panel. In order to get the optimal design, optical simulation was made by analyzing luminosity shape, reflector angle, chip depth, and chip position of LED lighting. Final results show that the proposed LED characteristics were useful to increase light efficiency and it has been proven by distribution chart for actual exposed light on the light guide panel (LGP).

The Design and Fabrication of New Structure Reflector for LED Source (LED 광원에 적합한 새로운 구조의 반사경의 설계 및 제작)

  • Jeong, Hak-Geun;Jung, Bong-Man;Han, Su-Bin;Park, Suk-In;Kim, Kyu-Deok
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2006.05a
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    • pp.154-156
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    • 2006
  • A few ten mW white LED can substitute for the indicator light source and it is required to study several watt multi-chip semiconductor light sources in order to replace the light sources for general illumination such as incandescent lights and fluorescent lanes. Since the optical technology used for several mW white LED light source uses only 30% to 52% of the light it is required to develop the design technology of optical system and lens to improve the efficiency more than 80% for insuring the high power of white LED. In this paper, we designed and fabricated new structure reflector to increase the efficiency and is easy to make high power multi-chip LED lamp.

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A Study on the Crater Wear of Carbide Tool in Cutting SUS304 (SUS304 절삭시 Carbide 공구의 Crater 마모에 관한 연구)

  • Kang, Won-Suk;Oh, Seok-Hyung;Kim, Jong-Taeg;Seo, Nam-Seob
    • Journal of the Korean Society for Precision Engineering
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    • v.8 no.1
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    • pp.84-95
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    • 1991
  • This paper deals with crater wear when the SUS304 steel which forms the saw- toothed chip was cut by carbide tools. When the saw-toothed chip was formed, and optical creater wear measuring technique was used which provides complete information, both qualitatively and quantitatively, on the crater development. In this optical contour mapping technique an profile projector was used, making it possible to draw the depth contours of the crater directly. 98 contour maps of crater wear representing twelve different cutting conditions were presented. Also, the rake angles changed to have ${\alpha}$ =$6^{\circ}$, ${\alpha}$ =$-6^{\circ}$

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Development and Evaluation of Advanced Telemetry System (개선된 텔레메트리 시스템 개발 및 평가)

  • 박차훈;서희돈;박종대
    • Journal of Biomedical Engineering Research
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    • v.21 no.5
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    • pp.513-517
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    • 2000
  • In this study, we fabricated the advanced telemetry system that transmitting media use radio frequency(RF) for the middle range measurement of the physiological signals and receiving media use optical for electromagnetic interference problem. The telemetry system within a size of 65$\times$125$\times$45mm consists of three parts: a RF transmitter, a optical receiver and a physiological signal processing CMOS one chip. Advantages of proposed telemetry system is wireless middle range(50m) FM transmission, reduce electromagnetic interference to a minimum which enables a comfortable bed-side telemetry system.

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GaAs OEIC Unit Processes for chip-to-chip Interconnection I (OEIC overview ; Zn-diffusion ; SL layer growing) (칩상호 광접속용 GaAs 광전집적회로의 기본 공정 I (OEIC 개관;Zn-확산;SL 제작을 위한 초박막 성장))

  • 지정근
    • Proceedings of the Optical Society of Korea Conference
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    • 1989.02a
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    • pp.180-184
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    • 1989
  • Overviews of vertical and horizontal GaAs/AlGaAs OEIC are shown. Researching double Zn diffusion process, we obtain Xj=At1/2-Bd1, where A=2.5${\mu}{\textrm}{m}$/[hr]1/2, B=0.625, of which process is recommended for exact diffusion interface area control of GaAs/AlGaAs. It is proved to be 100A/100A AlAs/GaAs using MOCVD by measurement of photo-luminescence which shows a luminescence peak corresponding to the 798.4nm wavelength calculated values of 38meV ground state above GaAs conduction band.

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A SoC Based on a Neural Network for Embedded Smart Applications (임베디드 스마트 응용을 위한 신경망기반 SoC)

  • Lee, Bong-Kyu
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.10
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    • pp.2059-2063
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    • 2009
  • This paper presents a programmable System-On-a-chip (SoC) for various embedded smart applications that need Neural Network computations. The system is fully implemented into a prototyping platform based on Field Programmable Gate Array (FPGA). The SoC consists of an embedded processor core and a reconfigurable hardware accelerator for neural computations. The performance of the SoC is evaluated using a real image processing application, an optical character recognition (OCR) system.

Design and Fabrication of Si pin photodiode for APF optical link (APF optical link용 Si pin photodiode의 설계 및 제작)

  • 강현구;남정식;이지현;김윤희;이상열;김장기;장지근
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.270-273
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    • 2000
  • We have fabricated and analyzed photodiodes for optical link with Si pin structures. As the results of experiment, the web patterned photodiode(type C) with $p^{+}$-guard ring showed low junction capacitance of 6~7 pF at $V_{R}$=-5V and high separation ability for optical signal(dark current : $\leq$ 5 nA, optical signal current : $\geq$ 340 nA) due to the small effective $p^{+}$-n junction area and the expanded electric field region. The fabricated Si pin photodiode can be applicable for detecting an optical signal with the wavelength of about 660~670 nm. It can also be integrated with the twin well CMOS structure to develope an one chip based optical receiver IC. IC.C.

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A Study on the Optical communication part Lid glass manufacture technology by high temperature and compression molding (광통신 부품 Lid glass 고온압축성형의 관한 연구)

  • Jang, K.C.;Lee, D.G.;Jang, H.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1526-1531
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    • 2007
  • Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

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New Type of White-light LED Lighting for Illumination and Optical Wireless Communication under Obstacles

  • Choi, Su-il
    • Journal of the Optical Society of Korea
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    • v.16 no.3
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    • pp.203-209
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    • 2012
  • Visible light communications (VLC) use modern solid-state light-emitting diodes (LEDs) to broadcast information. Emerging white-light LEDs allow the combination of lighting and optical wireless communication in one optical source. In this paper, a new LED lighting design using one-chip-type white LEDs is proposed for efficient illumination and optical wireless communications under the existence of several obstacles. Lighting and communication performance are analyzed to show the effectiveness of the proposed LED lighting. Specifically, the signal-to-noise ratio considering intersymbol interference and the bit-error rate of variable pulse position modulation (VPPM) with dimming control are considered.

Modeling of Mixed Phosphors in White Light Emitting Diode (백색 발광다이오드에서의 혼합 형광체 모델링)

  • Kim, Dowoo;Gong, Dayeong;Gong, Myeongkook
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.7
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    • pp.567-574
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    • 2013
  • An optical model is proposed in the white LED using phosphor and LED chip. In this paper a new model that describes the absorption rate and quantum efficiency with increasing the mixing ratio of phosphor in silicone, and the allotment of the phosphor absorption optical power in the several phosphor mixing in the silicone. Single phosphor in silicone from the optical measurement data before and after molding, the solution to get the blue optical power and the phosphor emission optical power is proposed. By these solution the absorption rate and the quantum efficiency was obtained. The model with single phosphor mixing in the silicone the validity was confirmed.