• Proceedings of the Optical Society of Korea Conference
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• 2001.02a
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• pp.1-1
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• 2001

Microlasers grown on a chip without any distributed Brags reflectors to provide the feedback are potentially useful for integrated optics, particularly if the laser emission in the plane is unidirectional and this direction can be switched. Microfilters performing as add/drop devices and bandpass units are now considered the most needed optical element for the DWDM field. The talk will concentrate on our research effort in GaN microlasers with non-circular shapes and in dielectric microfilters with oval and square shapes. (omitted)

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.9
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• pp.1290-1296
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• 2013

The light intensity which represents the relative amount of brightness and darkness is very important feature to discern the color hue and its relevant information. With this aim, we devise a new optical system and method to analyze the light intensity. Our suggested system including a phototransistor and white-high-brightness chip light-emitting diode intend estimate the contrast value utilizing Image Research Institute(I.R.I.) Hue & Tone samples which includes 120 color sheets arranged by the color hue and tone. As a result, we confirmed that the brightness of the color checker can be accurately estimated by a high-brightness light-emitting-diode optical system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.5 s.347
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• pp.48-53
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• 2006

This paper describes the electrical characteristics of monolithic optical transceiver circuitry being used in the fiber optic modules. It has been designed and fabricated, and compared with two chips version transceiver when operates at 155.52 Mbps data rates. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. To compare the two kind of fiber optic modules using each chip, single chip version has similar properties to two chip version in the electrical characteristics as noise and others.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.7-13
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• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

• Journal of Sensor Science and Technology
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• v.22 no.6
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• pp.439-443
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• 2013

A wireless optical fiber interferometer arterial pulse wave sensor system is developed for remote sensing. The wireless optical fiber sensor system consists of Zigbee communication modules and an optical fiber interferometer arterial pulse wave sensor. The optical fiber arterial pulse wave sensor is an in-line Michelson interferometer enclosed with steel reinforcement in a heat-shrinkable tube. The Zigbee communication modules are composed of an ATmega128L microprocessor and a CC2420 Zigbee chip. The arterial pulse waves detected by the optical fiber sensor were transmitted and received via the Zigbee communication modules. The experimental results show that the wireless optical fiber sensor system can be used for monitoring the arterial pulse waves remotely.

• Vacuum Magazine
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• v.4 no.3
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• Journal of Korea Multimedia Society
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• v.10 no.12
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• pp.1585-1590
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• 2007

This paper introduces adaptive PRML (Partial Response Maximum Likelihood) architecture with PR (a,b,c,d,e) channel type for the improved readability of high-density optical discs with capacity greater than 30GB. The proposed PRML architecture consists of an adaptive equalizer, a Viterbi detector and a channel identifier. Detailed description for each component is included. The architecture is implemented in chip and also confirmed its performance on the test board mounting the chip. Test results show that the proposed 5-tap PRML architecture is well operated, and less than $2{\times}10^{-4}$ of BER (Bit Error Rate) is achieved with radial and tangential tilt margin of ${\pm}0.6^{\circ}$ on self-made 30GB BD at 1x speed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.53-57
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• 1996

The side burrs and shape distortion resulting from the micromachining of an array of V-shape microgrooves in optical components were experimentally invesigated and a simplified model for their formation is proposed. Burr/shpae distortion should be kept to a minimum level since they degrade the characteristics and performance of these parts. The focus of this study is on the influence of depth of cut and workpiece material. The workpiece materials use were brass, bronze and copper. From the obsevation of the chip shape and burr/shape distortion, the proposed model, that the compressive force at the cutting edge causess the ductile uncut chip material to flow plastically outward toward the free surface to result in a burr, was verified.

• Journal of Integrative Natural Science
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• v.3 no.4
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• pp.237-240
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• 2010

Recently, number of studies for porous silicon have been investigated by many researchers. Multistructured porous silicon (PSi), distributed Bragg reflector (DBR) PSi, has been a topic of interest, because of its unique optical properties. DBR PSi were prepared by an electrochemical etch of $P^{{+}{+}}$-type silicon wafer of resistivity between 0.1 $m{\Omega}cm$ with square wave current density, resulting two different refractive indices. In this work, We have fabricated a simple and portable organic vapor-sensing device based on DBR porous silicon and investigated the optical characteristics of DBR porous silicon. DBR porous silicon have been characterized by FT-IR, Ocean optics 2000 spectrometer. The device used DBR PSi chip has been demonstrated as an excellent gas sensor, showing a great senstivity to a toxic vapor (TEP, DMMP, DEEP) at room temperature.