• 한국식품과학회지
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• 제44권5호
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• pp.577-582
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• 2012

쌀 전분의 아밀로오스 함량차이에 따른 옥테닐호박산(OSAn) 변성전분의 제조 특성 및 이화학적 특성을 검토하였다. 아밀로오스의 함량은 Jinsumi가 15.42%, Milyang 261은 34.21%였으며 전분 추출 후의 Jinsumi가 20.31%, Milyang 261은 39.32%였다. 치환도 및 반응효율은 Milyang 261이 각각 0.0137, 89.89%였으며 Jinsumi는 0.0144, 95.92%로 Jinsumi가 Milyang 261보다 높았다. 점도는 Jinsumi와 Milyang 261이 각각 30.1 cP 및 7.8 cP이었으며 옥테닐호박산을 이용한 변성전분의 경우 240.5 cP 및 162.6cP으로 상승하였다. 변성전분의 유화안정성은 두 품종 모두 대체적으로 안정하였으며 특히 Jinsumi는 높은 유화안정성을 보였으며, 변성전분을 부형제로 이용하여 미세캡슐화한 후의 코팅효율은 Jinsumi가 65.70-73.54%, Milyang 261이 29.45-36.98%로 나타나 분무건조를 통한 미세캡슐 효율은 Jinsumi가 높았다. 이러한 결과를 볼 때 분무건조를 통한 미세캡슐화의 피복물질 소재로서 변성을 통한 쌀 전분이 이용가치가 있을 것으로 사료되며 특히 Jinsumi가 Milyang 261에 비하여 높은 활용도를 가질 것이라 판단된다.

• 한국포장학회지
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• 제29권1호
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• pp.9-14
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• 2023

The application of starch-based films is limited by the poor water vapor barrier and mechanical properties. In this study, plasticized octenyl-succinated corn starch (OTPS) was mixed into Poly (butylene adipate-co-terephthalate) (PBAT) with various concentration (0/0.25/0.5/0.75 wt%) of epoxidized soybean oil (ESO) to enhance the mechanical properties and the hydrophobicity of blends. Tensile Strength and elongation at break of PBAT/OTPS film was slightly strengthened as the added ratio of ESO raised to 0.5 wt%, yet lessened again in 0.75 wt% sample. The yield strength and elastic modulus were highest in 0.25wt% of ESO added. In thermal properties, the melting temperature (T_m) and crystallization temperature (T_c) were highest at ESO 0.25 and the maximum degradation temperature (T_max) of components of the films were developed as ESO added. Also, it has been proved that the addition of hydrophobic substances reduces the hydrophilicity of the film by contact angle. This suggests the use of epoxidized oil for preparing films based on high TPS content allows obtaining enhanced interfacial adhesion. This study confirmed that ESO acts as a compatibilizer between OTPS and PBAT to improve the mechanical properties and hydrophobicity of the sample. The sample containing 0.5wt% of ESO was the most suitable for packaging application.