• Journal of the Korean Society for Precision Engineering
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• v.32 no.7
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• pp.633-641
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• 2015

In this study, we proposed a three-dimensional (3D) scanning system based on laser-vision technique and rotary mechanism for automatic 3D model reconstruction. The proposed scanning system consists of a laser projector, a camera, and a turntable. For laser-camera calibration a new and simple method was proposed. 3D point cloud data of the surface of scanned object was fully collected by integrating extracted laser profiles, which were extracted from laser stripe images, corresponding to rotary angles of the rotary mechanism. The obscured laser profile problem was also solved by adding an addition camera at another viewpoint. From collected 3D point cloud data, the 3D model of the scanned object was reconstructed based on facet-representation. The reconstructed 3D models showed effectiveness and the applicability of the proposed 3D scanning system to 3D model-based applications.

• Journal of the Optical Society of Korea
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• v.8 no.4
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• pp.174-181
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• 2004

Various kinds of systems, that can do target recognition and position detection simultaneously by using infrared sensing detectors, have been developed. In this paper, the detection system TRSS (Thermal target Recognition by Spiral Scanning) adopts linear array shaped uncooled IR detector and uses spiral type fast scanning method for relative position detection of target objects, which radiate an IR region wavelength spectrum. It can detect thermal energy radiating from a 9 m-size target object as far as 200 m distance. And the maximum field of a detector is fully filled with the same size of target object at the minimum approaching distance 50 m. We investigate two types of lens systems. One is a singlet lens and the other is a doublet lens system. Every system includes one aspheric surface and free positioned aperture stop. Many designs of F/1.5 system with ${\pm}5.2^{\circ}$ field at the Efl=20, 30 mm conditions for single element and double elements lens system respectively are compared in their resolution performance [MTF] according to the aspheric surface and stop position changing on their optimization process. Optimum design is established including mechanical boundary conditions and manufacturing considerations.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.149-154
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• 2004

In the semiconductor and the optical industry a new transport system which can replace the conventional sliding system is required. These systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problem. In this paper, the relationship of transporting speed according to the change of flexural beam shape and the effect of transporting speed according to the change of weight and amplification voltage are verified. The vibration behavior of flexural beam in the ultrasonic transport system is experimented using Laser Scanning Vibrometer.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.05a
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• pp.264-268
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• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitating various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system and the amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1527-1530
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• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitation various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system. The amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• Journal of the Korean Society of Industry Convergence
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• v.18 no.3
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• pp.167-172
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• 2015

In this paper, we propose a new approach to design and control a smart gripper of robot system. A control method for flexible grasping a object in partially unknown environment was proposed, where a proximate sensor detecting the distance between the fingertip and object was used. Based on the proximate sensor signal the finger motion controller could plan the grasping process divided in three phases. The first step is scanning process which two first joints were moved to mid-position of the detected range by a state-variable feedback position controller, after the scanning was finished. The contact force of fingertip was then controlled using the detection sensor of the servo controller for finger joint control. The proposed grasping planning was tested on rectangular bar.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.2
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• pp.24-29
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• 2006

The use electron-beam(E-beam) manufacturing system provides a means to alleviate optic exposure equipment's problems. We are developing an E-beam manufacturing system with scanning electron microscope(SEM) function. The E-beam manufacturing system consist of high voltage generator, beam blanker, condenser lenses, object lenses, stigmator and stage. The development of E-beam manufacturing system is used on the method of remaking SEM's structure. The functions of SEM are developed. It is important for the test of E-beam performance. In E-beam manufacturing system and SEM, beam focus is important function. In this paper, we propose intelligent remote control function for beam focus in E-beam manufacturing system. The function extends the user's function and gives convenience.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.364-369
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• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitation various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system. The amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.12
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• pp.2016-2024
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• 1989

A versatile incoherent optical processing system is developed and analyzed in detail, in which an acousto-optic modulator is used to generate the temporal offset frequency for heterodyning and an optical scanner to process the input object in scanning mode. The operational characteristics of the systems are studied with respect to spatial filtering in terms of the spectral width change of the light source, the temporal offset frequency, and a scanning rate. To enhance the system's capability, two schemes for tuning the system's OTF, structural tuning and defocused object tuning, are also developed and verified with the MTF measurements and computer calculations.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.108-113
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• 2022

The deep-learning-based measurement method with the through-focus scanning optical microscopy (TSOM) estimated the size of the object using the classification. However, the measurement performance of the method depends on the number of subdivided classes, and it is practically difficult to prepare data at regular intervals for training each class. We propose an approach to measure the size of an object in the TSOM image using the deep-learning regression model instead of using classification. We attempted our proposed method to estimate the top critical dimension (TCD) of through silicon via (TSV) holes with 2461 TSOM images and the results were compared with the existing method. As a result of our experiment, the average measurement error of our method was within 30 nm (1σ) which is 1/13.5 of the sampling distance of the applied microscope. Measurement errors decreased by 31% compared to the classification result. This result proves that the proposed method is more effective and practical than the classification method.