• 한국재료학회지
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• 제10권4호
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• pp.282-289
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• 2000

전자싸이클로트론공명-플라즈마 화학기상증착법으로 $PbTiO_3$박막을 증착하였다. $RuO_2$ 기판과 Pt 기판 위에 금속유기화합물 원료기체 유량 및 증착온도에 따라서 $PbTiO_3$박막의 증착특성을 연구하였다. $RuO_2$ 기판 위에서 Pt 기판에 비하여 Pb-oxide 분자의 잔류시간이 상대적으로 크고, 페로브스카이트 핵생성 밀도는 상대적으로 작으며, 단일한 페로브스카이트 상의 $PbTiO_3$ 박막을 얻을 수 있는 공정범위가 Pt 기판보다 좁았다. $PbTiO_3$ 박막 증착 전 Ti-oxide 씨앗층을 도입함으로써 $RuO_2$ 기판에서도 페로브스카이트 핵생성 밀도를 증가시켜 단일한 페로브스카이트 박막을 얻을 수 있는 공정범위가 확장되었다. $PbTiO_3$에서 Ti 성분을 Zr으로 일부 대체시킨 $Pb(Zr,Ti)O_3\;(PZT)$ 박막의 경우에도 Ti-oxide 씨앗층을 도입함으로써 넓은 공정범위에서 단일한 페로브스카이트 PZT 박막을 $RuO_2$기판 위에서도 제조할 수 있었다.

• Transactions on Electrical and Electronic Materials
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• 제7권1호
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• pp.36-41
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• 2006

In this paper, the time evolution of undoped GaN epilayers on a low-temperature GaN buffer layer grown on c-plane sapphire at a low pressure of 300 Torr was studied via a two-step growth condition in a horizontal MOCVD reactor. As a function of the growth time at a high-temperature, the surface morphology, structural quality, and optical and electrical properties were investigated using atomic force microscopy, high-resolution x-ray diffraction, photoluminescence, and Hall effect measurement, respectively. The root-mean-square roughness showed a drastic decrease after a certain period of surface roughening probably due to the initial island growth. The surface morphology also showed the island coalescence and the subsequent suppression of three-dimensional island nucleation. The structural quality of the GaN epilayer was improved with increasing growth time considering the symmetrical (002) and asymmetrical (102) rocking curves. The variations of room-temperature photoluminescence, background carrier concentration, and Hall mobility were measured and discussed.

• 한국진공학회지
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• 제12권1호
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• pp.70-77
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• 2003

전이금속을 촉매로 이용하여 화학기상증착법 (CVD)으로 탄소나노튜브 (CNT)를 성장시킬 때, 질소분위기가 성장을 증진시킨다는 사실은 잘 알려져 있다. 본 논문에서는 질소분위기에 의한 CNT 성장증진의 원인이 활성화 질소이며, 활성화 질소가 성장과정 중 CNT의 탄소와 결합함으로써 성장증진효과가 일어남을 보여주었다. 이 결과는 질소의 결합이 튜브상의 흑연판을 만드는데 필요한 탄성변형에너지를 낮추어 주는 역할을 한다는 CNx 박막의 이론적 계산결과와 일치한다. 따라서, 질소의 결합에 의한 CNT의 성장증진 효과는 튜브상의 흑연판 핵 생성과 CNT의 성장에 필요한 임계 에너지의 감소에 의한 것이다.

• 설비공학논문집
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• 제17권5호
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• pp.459-467
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• 2005

The effect of anti freezing solution liquid film on the frost prevention is experimentally investigated. It is desirable that the antifreezing solution spreads widely on the heat exchanger surface forming thin liquid film to prevent frost nucleation and reduce the thermal resistance across the film. A porous layer coating technique is adopted to improve the wettedness of the anti freezing solution on a parallel plate heat exchanger. The antifreezing solution spreads widely on the heat exchanger surface with 100 $\mu$m thickness by the capillary force resulting from the porous structure. It is observed that the antifreezing solution liquid film prevents a parallel plate heat exchanger from frosting. The reductions of heat and mass transfer rate caused by thin liquid film are only $1\~2\%$ compared with those for non-liquid film surface.

• 열처리공학회지
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• 제18권1호
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• pp.24-28
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• 2005

New post plasma nitriding can achieve a high uniformity that have been difficult in DC nitriding and have a high productivity comparable to gas nitriding. However, it has not a enough high nitriding potential for a rapid nitriding, because surface activation or ion etching in the general plasma nitriding cannot be expected. Thus, in this study, the effects of pre-treatments with oxidation and reduction gas have been investigated to improve the nitriding kinetics of post plasma nitriding. An effective pre-treatment consisting of oxidation and reduction resulted in the increase of surface energy of STD 11. This induced the surface hardness and the effective nitriding depth of STD 11. It is thought that the increase of the surface energy and the surface area with pre-treatment promote the nucleation of nitriding layer.

• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.657-662
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• 2003

This paper presents a new fabrication method of selective SiGe epitaxial growth at 650 $^{\circ}C$ on (100) silicon wafer with oxide patterns by reduced pressure chemical vapor deposition. The new method is characterized by a cyclic process, which is composed of two parts: initially, selective SiGe epitaxy layer is grown on exposed bare silicon during a short incubation time by SiH$_4$/GeH$_4$/HCl/H$_2$system and followed etching step is achieved to remove the SiGe nuclei on oxide by HCl/H$_2$system without source gas flow. As a result, we noted that the addition of HCl serves not only to reduce the growth rate on bare Si, but also to suppress the nucleation on SiO$_2$. In addition, we confirmed that the incubation period is regenerated after etching step, so it is possible to grow thick SiGe epitaxial layer sustaining the selectivity. The effect of the addition of HCl and dopants incorporation was investigated.

• 한국세라믹학회지
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• 제35권8호
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• pp.827-835
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• 1998

Blanket Copper films were chemically vapor deposited on six kinds for substrates for scrutinizing the change of characteristics induced by the difference of substrates and seeding layers. Both TiN/Si and {{{{ { SiO}_{2 } }}/Si wafers were used as-recevied and with the Cu-seeding layers of 40${\AA}$ and 160${\AA}$ which were produced by sputtering The CVD processes were exectued at the deposition temperatures between 130$^{\circ}C$ and 260$^{\circ}C$ us-ing (hfc)Cu(VTMS) as a precursor. The deposition rate of 40$^{\circ}C$ Cu-seeded substrates was higher than that of other substrates and especially in seeded {{{{ { SiO}_{2 } }}/Si substrate because of the incubation period reducing in-duced by seeding layer at the same deposition time and temperature. The resistivity of 160${\AA}$ Cu seeded substrate was lower then that of 40 ${\AA}$ because the nucleation and growth behavior in Cu-island is different from the behavior in {{{{ { SiO}_{2 } }} substrate due to the dielectricity of {{{{ { SiO}_{2 } }}.

• Bulletin of the Korean Chemical Society
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• 제22권2호
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• pp.154-158
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• 2001

The steps for the generation of very thin GaN films on ultrathin AlN/6H-SiC surface by alternating a pulsative supply (APS) of trimethyl gallium and NH3 gases have been examined by ASED-MO calculations. We postulate that the gallium cul ster was formed with the evaporation of CH4 gases via the decomposition of trimethyl gallium (TMG), dimethyl gallium (DMG), and monomethyl galluim (MMG). During the injection of NH3 gas into the reactor, the atomic hydrogens were produced from the thermal decomposition of NH3 molecule. These hydrogen gases activated the Ga-C bond cleavage. An energetically stable GaN nucleation site was formed via nitrogen incorporation into the layer of gallium cluster. The nitrogen atoms produced from the thermal degradation of NH3 were expected to incorporate into the edge of the gallium cluster since the galliums bind weakly to each other (0.19 eV). The structure was stabilized by 2.08 eV, as an adsorbed N atom incorporated into a tetrahedral site of the Ga cluster. This suggests that the adhesion of the initial layer can be reinforced by the incorporation of nitrogen atom through the formation of large grain boundary GaN crystals at the early stage of GaN film growth.

• 한국진공학회지
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• 제2권4호
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• pp.439-454
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• 1993

The phase sequence of codeposited Co-Si alloy and Co/si multilayer thin film was investigated by differential scanning calormetry(DSC) and X-ray diffraction (XRD) analysis, The phase sequence in codeposition and codeposited amorphous Co-Si alloy thin film were CoSilongrightarrow Co2Si and those in Co/Si multilayer thin film were CoSilongrightarrowCo2Silongrightarrow and CoSilongrightarrowCo2Si longrightarrowCoSilongrightarrowCoSi2 with the atomic concentration ration of Co to Si layer being 2:1 and 1:2 respectively. The observed phase sequence was analyzed by the effectvie heat of formatin . The phase determining factor (PDF) considering structural facotr in addition to the effectvie heat of formation was used to explain the difference in the first crystalline phase between codeposition, codeposited amorphous Co-Si alloy thin film and Co/Si multilayer thin film. The crystallinity of Co-silicide deposited by multitarget bias cosputter deposition (MBCD) wasinvestigated as a funcion of deposition temperature and substrate bias voltage by transmission electron microscopy (TEM) and epitaxial CoSi2 layer was grown at $200^{\circ}C$ . Parameters, Ear, $\alpha$(As), were calculate dto quantitatively explain the low temperature epitaxial grpwth of CoSi2 layer. The phase sequence and crystallinity had a stronger dependence on the substrate bias voltage than on the deposition temperature due to the collisional daxcade mixing, in-situ cleannin g, and increase in the number of nucleation sites by ion bombardment of growing surface.

• 한국태양에너지학회 논문집
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• 제29권5호
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• pp.35-44
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• 2009

In this study, boiling heat transfer coefficients(HTCs) and critical heat flux(CHF) are measured on a smooth square flat copper heater in a pool of pure water with and without carbon nano tubes(CNTs) dispersed at $60^{\circ}C$. Tested aqueous nanofluids are prepared using multi-walled CNTs whose volume concentrations are 0.0001, 0.001, 0.01, and 0.05%. For dispersion of CNTs, polyvinyl pyrrolidone(PVP) is used in distilled water. Pool boiling HTCs are taken from $10kW/m^2$ to critical heat flux for all nanofluids. Test results show that the pool boiling HTCs of the nanofluids are lower than those of pure water in entire nucleate boiling regime. On the other hand, critical heat flux is enhanced greatly showing up to 200% increase at volume concentration of 0.001% CNTs as compared to that of pure water. This is related to the change of surface characteristics by the deposition of CNTs. This deposition makes a thin CNT layer on the surface and the active nucleation sites of heat transfer surface are decreased due to this layer. The thin layer acts as the thermal resistance and also decreases the bubble generation rate resulting in a decrease in pool boiling HTCs. The same layer, however, maintains the nucleate boiling even at very high heat fluxes and reduces the formation of large vapor canopy at near CHF resulting in a significant increase in CHF.