• Title/Summary/Keyword: non-heating process

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Cold Crucible Electromagnetic Casting of Silicon (Cold crucible을 이용한 실리콘의 전자기주조)

  • Shin, Je-Sik;Lee, Sang-Mok;Moon, Byung-Moon
    • Journal of Korea Foundry Society
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    • v.25 no.3
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    • pp.115-122
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    • 2005
  • In the present study, an EMC (Electromagnetic Casting) process, using a segmented Cu cold crucible under a high frequency alternating magnetic field of 20 kHz, was practiced for the fabrication of poly-crystalline Si ingot of 50 mm diameter. The effects of Joule heating and electromagnetic pressure in molten Si were systematically investigated with various processing parameters such as electric current and crucible configuration. A preliminary experimental work was initiated with the pure Al system for the establishment of a stabilized non-contact working condition, and further adapted to the semiconductor-off-grade Si system. A commercialized software such as Opera-3D was utilized in order to simulate electromagnetic pressure and Joule heating. In order to evaluate the meniscus shape of the molten melts, shape parameter was used throughout the research. A segmented graphite crucible, which was attached at the upper part of the cold crucible, was introduced to enhance significantly the heating efficiency of Si melt keeping non-contact condition during continuous melting and casting processes.

Polysilicon Thin Film Transistors on spin-coated Polyimide layer for flexible electronics

  • Pecora, A.;Maiolo, L.;Cuscuna, M.;Simeone, D.;Minotti, A.;Mariucci, L.;Fortunato, G.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.261-264
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    • 2007
  • We developed a non self-aligned poly-silicon TFTs fabrication process at two different temperatures on spin-coated polyimide layer above Si-wafer. After TFTs fabrication, the polyimide layer was mechanically released from the Si-wafer and the devices characteristics were compared. In addition self-heating and hot-carrier induced instabilities were analysed.

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Low Temperature Hermetic Packaging using Localized Beating (부분 가열을 이용한 저온 Hermetic 패키징)

  • 심영대;김영일;신규호;좌성훈;문창렬;김용준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.1033-1036
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    • 2002
  • Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

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Effects of Heating Conditions in the Straightening of Sheet Metal Distortion (박판재 변형의 가열교정에서 가열면적의 영향)

  • Park, Jun-Hyoung;Kim, Jae-Woong;Kim, Ki-Chul;Jun, Joong-Hwan
    • Journal of Welding and Joining
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    • v.26 no.4
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    • pp.79-84
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    • 2008
  • Use of sheet metal structure is increased in various fields such as automobile, aerospace and communication equipment industry. When this structure is welded, welding distortion is generated due to the non-uniformity of temperature distribution. Recently welding distortion becomes a matter of great importance in the structure manufacture industry because it deteriorates the product's quality by bringing about shape error. Accordingly many studies for solving the problems by controlling the welding distortion are being performed. However, it is difficult to remove all kinds of distortion by welding process, though various kinds of methods for reducing distortion are applied to production. Consequently, straightening process is operated if the high precision quality is requested after welding. The local heating method induces compression plastic deformation by thermal expansion in the heating stage and then leaves constriction of length direction in the cooling stage. Accordingly, in the case of sheet metal structure, straightening effect is expected by heating for the part of distortion. This study includes numerical analysis of straightening effect by the local heating method in distortion comes from production of welded sheet metal structure. Particularly straightening effect followed by dimensions of heating area is analyzed according to the numerical analysis. The numerical analysis is performed by constructing 3-dimensional finite element model for 0.4mm stainless steel-sheet metal. Results of this study confirm that straightening effect changes as heating area increases and the optimum value of heating area that proves the maximum straightening effect exists.

Characterization of LaCrO$_3$ Powders Synthesized by Combustion Process with Different Heating Methods (가열방법에 따른 LaCrO$_3$ 연소합성분말의 특성)

  • 정층환;박홍규;오석진;박지연
    • Journal of the Korean Ceramic Society
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    • v.35 no.10
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    • pp.1078-1084
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    • 1998
  • lanthanum chromite(LaCrO3) powder was synthesized by the combustion of a solution of metal nitrates La(NO3).6H2O and Cr(NO3)3.9H2O and urea. The pH of solution affected a yield of the combustion products but did not influence the morphology of the products. When the pH of the solution was in the range of 0.7-4, the yield of the combustion products was more than 90% The morphology of the combustion products was af-fected by heating methods for the solution. The hot-plate induced heating of the solution yielded powders hav-ing two-dimensionally interconnected agglomerates whereas microwave-induced heating produced a fine and non-agglomerated powders. The specific surface area(BET) of the combustion products using microwave-in-non-agglomerated powders. The specific surface area(BET) of the combustion products using microwave-in-duced heating method were larger(25~32m2/g) than that of hot plate heating method(10-14m2/g)

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Resonant Network Design and Verification of Induction Cooker for Heating Nonmagnetic Vessel (비자성체 용기 가열을 위한 Induction Cooker 공진 네트워크 설계 및 검증)

  • Jang, Eun-Su;Park, Sang-Min;Joo, Dong-Myoung;Lee, Byoung-Kuk
    • The Transactions of the Korean Institute of Power Electronics
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    • v.22 no.6
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    • pp.504-509
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    • 2017
  • This paper proposes a procedure for designing a resonant network for induction cookers that enables the induction heating of magnetic and non-magnetic vessels. In order to design such network, the range of operating frequency must be determined according to the material of the vessels by measuring several parameters, such as equivalent resistance and inductance, which are reflected in the working coil of the vessels. Through this process, the capacitance of the resonant capacitor is determined. The PSIM simulation and experiment results verify the feasibility of the proposed design and the heating performance of the designed resonant network.

Effects of Change of Wafer Shape through Heating on Chemical Mechanical Polishing Process (가열에 의한 웨이퍼 형상 변화가 CMP에 미치는 영향)

  • 권대희;김형재;정해도
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.1
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    • pp.85-90
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    • 2003
  • Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

Reheating Process and FEM Analysis of Inductive Heating (재가열 공정과 유도 가열의 FEM 해석)

  • 손영익
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.03b
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    • pp.195-198
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    • 1999
  • For the thixoforming process beside an existing solidus-liquidus interval, the reheating conditions to obtain the globular microstructure are very important. It relies on the control of globular microstructure of semi-solid alloys that contain non-dendritic particles. To obtain the globular microstructure in cross section of billet, the optimal design of the induction coil is necessary. Therefore, in this paper the optimal coil design to minimize electromagnetic end effect will be proposed. The results of coil design were also applied to the reheating process to obtain a fine globular microstructure. Finally, reheating data base of aluminum alloys for thixoforming and FEM model for induction heating based on the optimal coil design have been proposed.

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Injection molding using porous nano-scale patterned master with Pettier devices (펠티어 소자를 이용한 다공성 나노패턴의 사출에 대한 연구)

  • Hong, N.P.;Kwon, J.T.;Shin, H.G.;Seo, Y.H.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.05a
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    • pp.513-516
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    • 2008
  • We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

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Effect of ethene($C_2H_4$) on DeNOx using Plasma/Post-Heating System (플라즈마/후가열 장치를 이용한 NOx 저감에 에틴($C_2H_4$)이 미치는 영향에 관한 연구)

  • Jung, Sang-Ho;Lee, Hyeong-Sang;Park, Kwang-Seo;Chun, Bae-Hyeock;Chun, Kwang-Min
    • 한국연소학회:학술대회논문집
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    • 2002.06a
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    • pp.157-162
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    • 2002
  • The characteristics of DeNOx conversion process by plasma/post-heating system with the simulated gas containing ethene is investigated experimentally. Without plasma treatment, $NO-NO_2$ conversion doesn't occur by $400^{\circ}C$ in a mixture of $N_2/O_2$ with a trace gas of ethene. But $NO-NO_2$ conversion occurs as temperature increases above $400^{\circ}C$. The NO can, however, be converted to $NO_2$ at lower temperatures by treating the gas mixture with non-thermal plasma. The $NO-NO_2$ conversion enhances further by passing the plasma treated gas through the post-heating furnace. Results show that 20%${\sim}50%$ more conversion of NO to $NO_2$ is observed when the temperatures of the post-heating furnace are maintained at $300^{\circ}C$ or $400^{\circ}C$. The additional $NO-NO_2$ conversion by post-heating is due to the reaction of ethene with the byproducts or radicals generated from the plasma reaction.

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