• 한국재료학회지
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• 제33권2호
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• pp.71-76
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• 2023

The electroconvection generated on the surface of an ion exchange membrane (IEM) is closely related to the electrical/chemical characteristics or topology of the IEM. In particular, when non-conductive regions are mixed on the surface of the IEM, it can have a great influence on the transfer of ions and the formation of nonlinear electroconvective vortices, so more theoretical and experimental studies are necessary. Here, we present a novel method for creating microscale non-conductive patterns on the IEM surface by laser ablation, and successfully visualize microscale vortices on the surface modified IEM. Microscale (~300 ㎛) patterns were fabricated by applying UV nanosecond laser processing to the non-conductive film, and were transferred to the surface of the IEM. In addition, UV nanosecond laser process parameters were investigated for obvious micro-pattern production, and operating conditions were optimized, such as minimizing the heat-affected zone. Through this study, we found that non-conductive patterns on the IEM surface could affect the generation and growth of electroconvective vortices. The experimental results provided in our study are expected to be a good reference for research related to the surface modification of IEMs, and are expected to be helpful for new engineering applications of electroconvective vortices using a non-conductive patterned IEM.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.171-172
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• 2012

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.205-206
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• 2008

The transparent conductive film was prepared by bar coating method of poly (3, 4-ethylenedioxythiophene) (PEDOT) and poly (sodium 4-stylenesulfonate) grafted multi-walled carbon nanotubes (MWNT-PSS) nanocomposites solution on the polyethylene terephthalate (PET) film. In this case, multi-wall carbon nanotubes was treated by chemical methods to obtain water soluble MWNT-PSS and then blending with PEDOT. The non-covalent bonding of polymer to the MWNT surface was confirmed by Fourier transform infrared (FT-IR), thermal gravimetric analysis (TGA) and Transmission electro microscope (TEM) investigation also showed a polymer-wrapped MWNT structure. Furthermore, the electrical, transmission properties of the transparent conductive film were investigated and compared with control samples are raw PEDOT films.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.238.1-238.1
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• 2011

본 연구에서는 non-contact deposition method의 일환인 ESD (electroctatic deposition)의 박막공정을 이용하여 Conductive layer 위에 Gold nanoparticles 및 Silver nanoparticles 등 organic/inorganic nano particle conductive ink system의 단분산 2D 박막을 제조를 연구하였다. ESD head를 통해 여러가지 organic / inorganic nano particle conductive ink system을 Deposition하였으며 분산도가 높고 균일한 단분산의 2차원 박막 구조를 얻을 수 있었으며, 전도성 PEDOT과의 Hybridization을 통해 균일상의 표면 Morphology를 갖는 고 전도성 투명 필름을 제작하였다. ESD technique를 이용하는 박막공정 기술은 나노입자 및 나노구조물의 박막화 패턴화를 포함하는 새로운 Deposition 기술로써 이를 응용하여 금속 나노입자의 2차원의 패턴화된 박막 구현을 통해 유기반도체 및 전자소자에의 응용성을 증거할 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.83-88
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• 2018

Cu/Ni/Sn-Ag 미세범프 접합 공정후 Ni/Sn-Ag접합계면에 잔류한 비전도성 필름(non-conductive film, NCF) trap 형성이 전기적 신뢰성에 미치는 영향을 분석하기 위해 온도 $150^{\circ}C$, 전류밀도 $1.5{\times}10^5A/cm^2$ 조건에서 electromigration (EM) 신뢰성 실험을 진행하였다. EM 신뢰성 실험 결과, NCF trap이 거의 없는 Cu/Ni/Sn-Ag 미세범프가 NCF trap이 형성된 미세범프 보다 약 8배 긴 EM 수명을 보여주고 있다. 저항 변화 및 손상계면에 대한 미세구조 분석결과, Ni/Sn-Ag접합계면에 공정 이슈에 의해 형성된 NCF trap이 Ni-Sn 금속간화합물/Sn-Ag솔더계면에 보이드를 유발하여 EM 원자 확산을 방해하기 때문에 빠른 보이드 성장에 의한 전기적 손상이 일찍 발생하는 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.81-89
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• 2022

비전도성 필름(non-conductive film, NCF)의 적용이 Cu/Ni/Sn-2.5Ag 미세범프의 금속간화합물(intermetallic compound, IMC) 성장 거동에 미치는 영향을 분석하기 위해 110, 130, 150℃의 온도 조건과 1.3×10⁵ A/cm²의 전류밀도 조건에서 실시간 열처리 및 electromigration(EM) 실험을 진행하였다. 그 결과, NCF 적용 유무와 열처리 및 EM 실험과 관계없이 Ni₃Sn₄ IMC 성장에 필요한 활성화에너지는 약 0.52 eV로 큰 차이는 보이지 않았다. 이는 Ni-Sn IMC의 성장속도가 Cu-Sn IMC 성장 속도보다 매우 느리며, 또한 Ni-Sn IMC의 성장 거동은 시간의 제곱근에 선형적으로 증가하므로 확산이 지배하는 동일한 반응기구를 가지며 NCF 적용에 따른 역응력(back stress)의 EM 억제 효과가 크지 않기 때문에 Ni₃Sn₄ IMC 성장에 필요한 활성화에너지는 차이가 나지 않는 것으로 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.689-690
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• 2009

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.324-324
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• 2006

Nb and Ti were added to 316 stainless steel, and then heat-treatments and surface treatments were performed on the 316 stainless steel and the Nb- and Ti-added alloys. All samples indicated enhanced electrical conductivity after surface treatments, whereas they showed low electrical conductivity before surface treatments due to the existence of non-conductive passive film on the alloy surface. In particular, the Hb- and Ti-added alloys showed remarkable enhancement of electrical conductivity compared to the original alloy, 316 stainless steel. Surface characterization revealed that small carbide particles formed on the alloy surface after surface treatments, while the alloys indicated flat surface structure before surface treatments. $Cr_{23}C_6$ mainly formed on the 316 stainless steel, and NbC and TiC mainly formed on the Nb- and Ti-added alloys, respectively. We attribute the enhanced electrical conductivity after surface treatments to the formation of these carbide particles, possibly acting as a means of electro-conductive channel through the passive film. Furthermore, NbC and TiC are supposed to be more effective carbides than $Cr_{23}C_6$ as electro-conductive channels of stainless steel

• 센서학회지
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• 제14권6호
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).