• Korean Journal of Materials Research
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• v.33 no.2
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• pp.71-76
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• 2023

The electroconvection generated on the surface of an ion exchange membrane (IEM) is closely related to the electrical/chemical characteristics or topology of the IEM. In particular, when non-conductive regions are mixed on the surface of the IEM, it can have a great influence on the transfer of ions and the formation of nonlinear electroconvective vortices, so more theoretical and experimental studies are necessary. Here, we present a novel method for creating microscale non-conductive patterns on the IEM surface by laser ablation, and successfully visualize microscale vortices on the surface modified IEM. Microscale (~300 ㎛) patterns were fabricated by applying UV nanosecond laser processing to the non-conductive film, and were transferred to the surface of the IEM. In addition, UV nanosecond laser process parameters were investigated for obvious micro-pattern production, and operating conditions were optimized, such as minimizing the heat-affected zone. Through this study, we found that non-conductive patterns on the IEM surface could affect the generation and growth of electroconvective vortices. The experimental results provided in our study are expected to be a good reference for research related to the surface modification of IEMs, and are expected to be helpful for new engineering applications of electroconvective vortices using a non-conductive patterned IEM.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.171-172
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• 2012

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.205-206
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• 2008

The transparent conductive film was prepared by bar coating method of poly (3, 4-ethylenedioxythiophene) (PEDOT) and poly (sodium 4-stylenesulfonate) grafted multi-walled carbon nanotubes (MWNT-PSS) nanocomposites solution on the polyethylene terephthalate (PET) film. In this case, multi-wall carbon nanotubes was treated by chemical methods to obtain water soluble MWNT-PSS and then blending with PEDOT. The non-covalent bonding of polymer to the MWNT surface was confirmed by Fourier transform infrared (FT-IR), thermal gravimetric analysis (TGA) and Transmission electro microscope (TEM) investigation also showed a polymer-wrapped MWNT structure. Furthermore, the electrical, transmission properties of the transparent conductive film were investigated and compared with control samples are raw PEDOT films.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.238.1-238.1
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• 2011

본 연구에서는 non-contact deposition method의 일환인 ESD (electroctatic deposition)의 박막공정을 이용하여 Conductive layer 위에 Gold nanoparticles 및 Silver nanoparticles 등 organic/inorganic nano particle conductive ink system의 단분산 2D 박막을 제조를 연구하였다. ESD head를 통해 여러가지 organic / inorganic nano particle conductive ink system을 Deposition하였으며 분산도가 높고 균일한 단분산의 2차원 박막 구조를 얻을 수 있었으며, 전도성 PEDOT과의 Hybridization을 통해 균일상의 표면 Morphology를 갖는 고 전도성 투명 필름을 제작하였다. ESD technique를 이용하는 박막공정 기술은 나노입자 및 나노구조물의 박막화 패턴화를 포함하는 새로운 Deposition 기술로써 이를 응용하여 금속 나노입자의 2차원의 패턴화된 박막 구현을 통해 유기반도체 및 전자소자에의 응용성을 증거할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.83-88
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• 2018

The electromigration (EM) tests were performed at $150^{\circ}C$ with $1.5{\times}10^5A/cm^2$ conditions in order to investigate the effect of non-conductive film (NCF) trap on the electrical reliability of Cu/Ni/Sn-Ag microbumps. The EM failure time of Cu/Ni/Sn-Ag microbump with NCF trap was around 8 times shorter than Cu/Ni/Sn-Ag microbump without NCF trap. From systematic analysis on the electrical resistance and failed interfaces, the trapped NCF-induced voids at the Sn-Ag/Ni-Sn intermetallic compound interface lead to faster EM void growth and earlier open failure.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.689-690
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• 2009

• 한국신재생에너지학회:학술대회논문집
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• 2006.11a
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• pp.324-324
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• 2006

Nb and Ti were added to 316 stainless steel, and then heat-treatments and surface treatments were performed on the 316 stainless steel and the Nb- and Ti-added alloys. All samples indicated enhanced electrical conductivity after surface treatments, whereas they showed low electrical conductivity before surface treatments due to the existence of non-conductive passive film on the alloy surface. In particular, the Hb- and Ti-added alloys showed remarkable enhancement of electrical conductivity compared to the original alloy, 316 stainless steel. Surface characterization revealed that small carbide particles formed on the alloy surface after surface treatments, while the alloys indicated flat surface structure before surface treatments. $Cr_{23}C_6$ mainly formed on the 316 stainless steel, and NbC and TiC mainly formed on the Nb- and Ti-added alloys, respectively. We attribute the enhanced electrical conductivity after surface treatments to the formation of these carbide particles, possibly acting as a means of electro-conductive channel through the passive film. Furthermore, NbC and TiC are supposed to be more effective carbides than $Cr_{23}C_6$ as electro-conductive channels of stainless steel

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).