• Korean Journal of Materials Research
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• v.10 no.3
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• pp.184-190
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• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.19 no.2
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• pp.7-12
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• 2006

Graphite particle/carbon fiber hybrid conductive polymer composites were fabricated by the compression molding technique. Graphite particles were mixed with an epoxy resin to impart the electrical conductivity in the composite materials. In this study, graphite reinforced conductive polymer composites with high filler loadings were manufactured to accomplish high electrical conductivity above 100S/cm. Graphite particles were the main filler to increase the electrical conductivity of composites by direct contact between graphite particles. While high filler loadings are needed to attain good electrical conductivity, the composites becomes brittle. So carbon fiber was added to compensate weakened mechanical property. With increasing the carbon fiber loading ratio, the electrical conductivity gradually decreased because non-conducting regions were generated in the carbon fiber cluster among carbon fibers, while the flexural strength increased. In the case of carbon fiber 20wt.% of the total system, the electrical conductivity decreased 27%, whereas the flexural strength increased 12%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Composites Research
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• v.20 no.6
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• pp.1-7
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• 2007

Expanded graphite/carbon fiber hybrid conductive polymer composites were fabricated by the preform molding technique. The conductive fillers were mechanically mixed with a phenol resin to provide an electrical property to composites. The conductive filler loading was fixed at 60wt.% to accomplish a high electrical conductivity. Expanded graphites were excellent in forming a conductive networking by direct contacts between them while it was hard to get the high flexural strength over 40MPa with using only expanded graphite and phenol resin. In this study, carbon fibers were added in composites to compensate the weakened flexural strength. The effect of carbon fibers on the mechanical and electrical properties was examined according to the weight ratio of carbon fiber. As the carbon fiber ratio increased, the flexural strength increased until the carbon fiber ratio of 24wt.%, and then decreased afterward. The electrical conductivity gradually decreased as the increase of the carbon fiber ratio. This was attributed to the non-conducting regions generated among the carbon fibers and the reduction of the direct contact areas between expanded graphites.

• Membrane Journal
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• v.16 no.4
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• pp.268-275
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• 2006

Novel SILEMs were prepared by multi-stage phase separation process combined by the low temperature phase separation (LTPS) and the high temperature phase separation (HTPS) using room temperature ionic liquids (RTILs) which have a high ionic conductivity. PVDF and imidazolium series ionic liquids were used as membrane material and electrolyte, respectively. To study the ion conducting properties, the SILEMs were tested using LCR meter at temperature controlled from 30 to $130^{\circ}C$. Under humid conditions, with increasing temperature from 30 to $100^{\circ}C$, the ion conductivity of the cast $Nafion^{(R)}$ membrane increased linearly, but then started to decrease after $100^{\circ}C$. However, in the case of the SILEMs, with increasing operating temperature, the ion conductivity increased. Also, the ion conductivity behaviors of the SILEMs were almost same, regardless of humidity. The ion conductivity of the SILEMs was $2.7{\times}10^{-3}S/cm$ and increased almost linearly up to $2.2{\times}10^{-2}S/cm$ with increasing temperature to $130^{\circ}C$. The effects of an inorganic filler on the physical properties of the SILEMs were studied using the $SiO_2$. The addition of $SiO_2$ could improve the mechanical strength of the SILEMs, though the ionic conductivity was decreased slightly.